Epoch Material Co., Ltd.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Epoch Material Co., Ltd..The latest application filed is for "chemical mechanical polishing slurry, its preparation method and use for the same".

Company Profile

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Epoch Material Co., Ltd. - Aurora IL
Epoch Material Co., Ltd. -
Epoch Material Co., Ltd. - Kaoh Siung County TW
Epoch Material Co., Ltd. - Kaohsiung County TW
Epoch Material Co., Ltd. - Lu-Chuh Hsiang TW
EPOCH MATERIAL CO., LTD. - Kaohsiung Science Park TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Chemical mechanical polishing slurry, its preparation method and use for the same Grant 8,557,006 - Hou , et al. October 15, 2	2013-10-15
Chemical Mechanical Polishing Slurry, Its Preparation Method And Use For The Same App 20120270401 - HOU; Hui-Fang ; et al.	2012-10-25
Aqueous cleaning composition for semiconductor copper processing Grant 8,067,352 - Chen , et al. November 29, 2	2011-11-29
Aqueous cleaning composition for semiconductor copper processing Grant 8,063,006 - Chen , et al. November 22, 2	2011-11-22
Aqueous Cleaning Composition App 20090170742 - Chuang; Tsung-Hsien ; et al.	2009-07-02
Chemical mechanical polishing composition Grant 7,550,092 - Hou , et al. June 23, 2	2009-06-23
Aqueous Cleaning Composition For Semiconductor Copper Processing App 20090036343 - Chen; Chien Ching ; et al.	2009-02-05
Chemical mechanical polishing slurry, its preparation method, and use for the same App 20080096470 - Hou; Hui-Fang ; et al.	2008-04-24
Chemical mechanical polishing composition App 20070290165 - Hou; Hui-Fang ; et al.	2007-12-20
Aqueous cleaning composition for semiconductor copper processing App 20070066508 - Chen; Chien Ching ; et al.	2007-03-22

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