Enquist; Paul M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Enquist; Paul M..The latest application filed is for "conductive barrier direct hybrid bonding".
Company Profile
20.68.70
- Enquist; Paul M. - Cary NC
- Enquist; Paul M. - Durham NC
- Enquist; Paul M. - Research Triangle Park NC
- Enquist; Paul M - Cary NC
Patent Activity
| Patent | Date |
|---|---|
| Conductive Barrier Direct Hybrid Bonding App 20220254746 - Enquist; Paul M. | 2022-08-11 |
| Directly Bonded Structures App 20220208723 - Katkar; Rajesh ; et al. | 2022-06-30 |
| Stacked Devices And Methods Of Fabrication App 20220189941 - Enquist; Paul M. ; et al. | 2022-06-16 |
| 3D IC method and device Grant 11,289,372 - Enquist , et al. March 29, 2 | 2022-03-29 |
| Stacked devices and methods of fabrication Grant 11,276,676 - Enquist , et al. March 15, 2 | 2022-03-15 |
| Conductive barrier direct hybrid bonding Grant 11,264,345 - Enquist March 1, 2 | 2022-03-01 |
| 3d Ic Method And Device App 20210313225 - Enquist; Paul M. ; et al. | 2021-10-07 |
| 3d Ic Method And Device App 20210280461 - Enquist; Paul M. ; et al. | 2021-09-09 |
| 3D IC method and device Grant 11,011,418 - Enquist , et al. May 18, 2 | 2021-05-18 |
| Systems and methods for efficient transfer of semiconductor elements Grant 10,896,902 - Uzoh , et al. January 19, 2 | 2021-01-19 |
| Bonded structures Grant 10,879,210 - Enquist , et al. December 29, 2 | 2020-12-29 |
| Heterogeneous Annealing Method And Device App 20200328193 - Enquist; Paul M. ; et al. | 2020-10-15 |
| Heterogeneous device Grant 10,777,533 - Enquist , et al. Sept | 2020-09-15 |
| Probe methodology for ultrafine pitch interconnects Grant 10,748,824 - Delacruz , et al. A | 2020-08-18 |
| Bonded Structures App 20200144217 - Enquist; Paul M. ; et al. | 2020-05-07 |
| Probe Methodology For Ultrafine Pitch Interconnects App 20200105630 - DELACRUZ; Javier A. ; et al. | 2020-04-02 |
| Increased contact alignment tolerance for direct bonding Grant 10,607,937 - Enquist , et al. | 2020-03-31 |
| Systems And Methods For Efficient Transfer Of Semiconductor Elements App 20200043910 - Uzoh; Cyprian Emeka ; et al. | 2020-02-06 |
| Probe methodology for ultrafine pitch interconnects Grant 10,529,634 - Delacruz , et al. J | 2020-01-07 |
| Bonded structures Grant 10,522,499 - Enquist , et al. Dec | 2019-12-31 |
| Stacked Devices And Methods Of Fabrication App 20190355706 - Enquist; Paul M. ; et al. | 2019-11-21 |
| Systems and methods for efficient transfer of semiconductor elements Grant 10,446,532 - Uzoh , et al. Oc | 2019-10-15 |
| Increased Contact Alignment Tolerance For Direct Bonding App 20190244899 - Enquist; Paul M. ; et al. | 2019-08-08 |
| Conductive Barrier Direct Hybrid Bonding App 20190237419 - ENQUIST; Paul M. | 2019-08-01 |
| Three dimensional device integration method and integrated device Grant 10,366,962 - Enquist , et al. July 30, 2 | 2019-07-30 |
| Method for low temperature bonding and bonded structure Grant 10,312,217 - Tong , et al. | 2019-06-04 |
| 3d Ic Method And Device App 20190148222 - Enquist; Paul M. ; et al. | 2019-05-16 |
| Increased contact alignment tolerance for direct bonding Grant 10,269,708 - Enquist , et al. | 2019-04-23 |
| Room Temperature Metal Direct Bonding App 20190115247 - Tong; Qin-Yi ; et al. | 2019-04-18 |
| Conductive barrier direct hybrid bonding Grant 10,262,963 - Enquist | 2019-04-16 |
| 3D IC method and device Grant 10,147,641 - Enquist , et al. De | 2018-12-04 |
| Room temperature metal direct bonding Grant 10,141,218 - Tong , et al. Nov | 2018-11-27 |
| Probe methodology for ultrafine pitch Interconnects App 20180331000 - DELACRUZ; Javier A. ; et al. | 2018-11-15 |
| Bonded Structures App 20180226375 - Enquist; Paul M. ; et al. | 2018-08-09 |
| Conductive Barrier Direct Hybrid Bonding App 20180226371 - ENQUIST; Paul M. | 2018-08-09 |
| Increased Contact Alignment Tolerance For Direct Bonding App 20180204798 - Enquist; Paul M. ; et al. | 2018-07-19 |
| Conductive barrier direct hybrid bonding Grant 9,953,941 - Enquist April 24, 2 | 2018-04-24 |
| Increased contact alignment tolerance for direct bonding Grant 9,852,988 - Enquist , et al. December 26, 2 | 2017-12-26 |
| 3d Ic Method And Device App 20170316971 - Enquist; Paul M. ; et al. | 2017-11-02 |
| Heterogeneous Annealing Method And Device App 20170301656 - Enquist; Paul M. ; et al. | 2017-10-19 |
| 3D IC method and device Grant 9,716,033 - Enquist , et al. July 25, 2 | 2017-07-25 |
| Systems And Methods For Efficient Transfer Of Semiconductor Elements App 20170200711 - Uzoh; Cyprian Emeka ; et al. | 2017-07-13 |
| Heterogeneous annealing method and device Grant 9,698,126 - Enquist , et al. July 4, 2 | 2017-07-04 |
| Increased Contact Alignment Tolerance For Direct Bonding App 20170179029 - Enquist; Paul M. ; et al. | 2017-06-22 |
| Three Dimensional Device Integration Method And Integrated Device App 20170170132 - Enquist; Paul M. ; et al. | 2017-06-15 |
| Conductive Barrier Direct Hybrid Bonding App 20170062366 - ENQUIST; Paul M. | 2017-03-02 |
| Three dimensional device integration method and integrated device Grant 9,564,414 - Enquist , et al. February 7, 2 | 2017-02-07 |
| Method For Low Temperature Bonding And Bonded Structure App 20160322328 - Tong; Qin-Yi ; et al. | 2016-11-03 |
| Three dimensional device integration method and integrated device Grant 9,431,368 - Enquist , et al. August 30, 2 | 2016-08-30 |
| Method for low temperature bonding and bonded structure Grant 9,391,143 - Tong , et al. July 12, 2 | 2016-07-12 |
| Room temperature metal direct bonding Grant 9,385,024 - Tong , et al. July 5, 2 | 2016-07-05 |
| Three Dimensional Device Integration Method And Integrated Device App 20160190093 - Enquist; Paul M. ; et al. | 2016-06-30 |
| Method for low temperature bonding and bonded structure Grant 9,331,149 - Tong , et al. May 3, 2 | 2016-05-03 |
| Heterogeneous Annealing Method And Device App 20160099233 - Enquist; Paul M. ; et al. | 2016-04-07 |
| Method For Low Temperature Bonding And Bonded Structure App 20160086913 - Tong; Qin-Yi ; et al. | 2016-03-24 |
| Room Temperature Metal Direct Bonding App 20160086899 - Tong; Qin-Yi ; et al. | 2016-03-24 |
| 3d Ic Method And Device App 20150340285 - ENQUIST; Paul M. ; et al. | 2015-11-26 |
| Heterogeneous annealing method and device Grant 9,184,125 - Enquist , et al. November 10, 2 | 2015-11-10 |
| 3D IC method and device Grant 9,171,756 - Enquist , et al. October 27, 2 | 2015-10-27 |
| Method For Low Temperature Bonding And Bonded Structure App 20150303263 - Tong; Qin-Yi ; et al. | 2015-10-22 |
| Three Dimensional Device Integration Method And Integrated Device App 20150287692 - ENQUIST; Paul M. ; et al. | 2015-10-08 |
| Method for low temperature bonding and bonded structure Grant 9,082,627 - Tong , et al. July 14, 2 | 2015-07-14 |
| Room Temperature Metal Direct Bonding App 20140370658 - TONG; Qin-Yi ; et al. | 2014-12-18 |
| Room temperature metal direct bonding Grant 8,846,450 - Tong , et al. September 30, 2 | 2014-09-30 |
| Method For Low Temperature Bonding And Bonded Structure App 20140203407 - TONG; Qin-Yi ; et al. | 2014-07-24 |
| Method For Low Temperature Bonding And Bonded Structure App 20140206176 - TONG; Qin-Yi ; et al. | 2014-07-24 |
| 3d Ic Method And Device App 20140187040 - ENQUIST; Paul M. ; et al. | 2014-07-03 |
| Heterogeneous annealing method and device Grant 8,735,219 - Enquist , et al. May 27, 2 | 2014-05-27 |
| 3D IC method and device Grant 8,709,938 - Enquist , et al. April 29, 2 | 2014-04-29 |
| Heterogeneous Annealing Method And Device App 20140061949 - Enquist; Paul M. ; et al. | 2014-03-06 |
| Heterogeneous Annealing Method And Device App 20140061942 - Enquist; Paul M. ; et al. | 2014-03-06 |
| Room Temperature Metal Direct Bonding App 20130233473 - Tong; Qin-yi ; et al. | 2013-09-12 |
| Room temperature metal direct bonding Grant 8,524,533 - Tong , et al. September 3, 2 | 2013-09-03 |
| 3d Ic Method And Device App 20130178062 - Enquist; Paul M. ; et al. | 2013-07-11 |
| 3D IC method and device Grant 8,389,378 - Enquist , et al. March 5, 2 | 2013-03-05 |
| Method For Low Temperature Bonding And Bonded Structure App 20120097638 - TONG; Qin-Yi ; et al. | 2012-04-26 |
| Method for low temperature bonding and bonded structure Grant 8,153,505 - Tong , et al. April 10, 2 | 2012-04-10 |
| Method for low temperature bonding and bonded structure Grant 8,053,329 - Tong , et al. November 8, 2 | 2011-11-08 |
| Wafer scale die handling Grant 7,956,447 - Enquist , et al. June 7, 2 | 2011-06-07 |
| Method For Low Temperature Bonding And And Bonded Structure App 20110067803 - Tong; Qin-Yi ; et al. | 2011-03-24 |
| Room Temperature Metal Direct Bonding App 20110041329 - Tong; Qin-Yi ; et al. | 2011-02-24 |
| Method for low temperature bonding and bonded structure Grant 7,871,898 - Tong , et al. January 18, 2 | 2011-01-18 |
| Room temperature metal direct bonding Grant 7,842,540 - Tong , et al. November 30, 2 | 2010-11-30 |
| Method for low temperature bonding and bonded structure Grant 7,807,549 - Tong , et al. October 5, 2 | 2010-10-05 |
| Method For Low Temperature Bonding And Bonded Structure App 20100163169 - TONG; Qin-Yi ; et al. | 2010-07-01 |
| Single mask via method and device Grant 7,714,446 - Enquist May 11, 2 | 2010-05-11 |
| Wafer bonding hermetic encapsulation Grant 7,622,324 - Enquist , et al. November 24, 2 | 2009-11-24 |
| Method For Low Temperature Bonding And Bonded Structure App 20090263953 - Tong; Qin-Yi ; et al. | 2009-10-22 |
| Room temperature metal direct bonding Grant 7,602,070 - Tong , et al. October 13, 2 | 2009-10-13 |
| Method for low temperature bonding and bonded structure Grant 7,553,744 - Tong , et al. June 30, 2 | 2009-06-30 |
| 3d Ic Method And Device App 20090068831 - Enquist; Paul M. ; et al. | 2009-03-12 |
| 3D IC method and device Grant 7,485,968 - Enquist , et al. February 3, 2 | 2009-02-03 |
| Single Mask Via Method And Device App 20080150153 - ENQUIST; Paul M. | 2008-06-26 |
| Method for low temperature bonding and bonded structure Grant 7,387,944 - Tong , et al. June 17, 2 | 2008-06-17 |
| Three dimensional device integration method and integrated device App 20080093747 - Enquist; Paul M. ; et al. | 2008-04-24 |
| Three dimensional device integration method and integrated device App 20080061419 - Enquist; Paul M. ; et al. | 2008-03-13 |
| Method for low temperature bonding and bonded structure App 20080063878 - Tong; Qin-Yi ; et al. | 2008-03-13 |
| Single mask via method and device Grant 7,341,938 - Enquist March 11, 2 | 2008-03-11 |
| Method for low temperature bonding and bonded structure App 20080053959 - Tong; Qin-Yi ; et al. | 2008-03-06 |
| Method for low temperature bonding and bonded structure Grant 7,335,572 - Tong , et al. February 26, 2 | 2008-02-26 |
| Room Temperature Metal Direct Bonding App 20070232023 - Tong; Qin-Yi ; et al. | 2007-10-04 |
| 3D IC method and device App 20070037379 - Enquist; Paul M. ; et al. | 2007-02-15 |
| Three dimensional device integration method and integrated device App 20060292744 - Enquist; Paul M. ; et al. | 2006-12-28 |
| Three dimensional device integration method and integrated device Grant 7,126,212 - Enquist , et al. October 24, 2 | 2006-10-24 |
| Method for low temperature bonding and bonded structure Grant 7,041,178 - Tong , et al. May 9, 2 | 2006-05-09 |
| Three dimensional device integration method and integrated device Grant 7,037,755 - Enquist May 2, 2 | 2006-05-02 |
| Three dimensional device integration method and integrated device Grant 6,984,571 - Enquist January 10, 2 | 2006-01-10 |
| Method for room temperature metal direct bonding Grant 6,962,835 - Tong , et al. November 8, 2 | 2005-11-08 |
| Wafer scale die handling App 20050194668 - Enquist, Paul M. ; et al. | 2005-09-08 |
| Single mask via method and device App 20050181542 - Enquist, Paul M. | 2005-08-18 |
| Room temperature metal direct bonding App 20050161795 - Tong, Qin-Yi ; et al. | 2005-07-28 |
| Three dimensional integrated device Grant 6,905,557 - Enquist June 14, 2 | 2005-06-14 |
| Method for low temperature bonding and bonded structure Grant 6,902,987 - Tong , et al. June 7, 2 | 2005-06-07 |
| Method for low temperature bonding and bonded structure App 20050079712 - Tong, Qin-Yi ; et al. | 2005-04-14 |
| Single mask via method and device Grant 6,867,073 - Enquist March 15, 2 | 2005-03-15 |
| Three dimensional device integration method and integrated device Grant 6,864,585 - Enquist March 8, 2 | 2005-03-08 |
| Wafer bonding hermetic encapsulation App 20050009246 - Enquist, Paul M. ; et al. | 2005-01-13 |
| Wafer bonding hermetic encapsulation Grant 6,822,326 - Enquist , et al. November 23, 2 | 2004-11-23 |
| Room temperature metal direct bonding App 20040157407 - Tong, Qin-Yi ; et al. | 2004-08-12 |
| Method for low temperature bonding and bonded structure App 20040152282 - Tong, Qin-Yin ; et al. | 2004-08-05 |
| Wafer bonding hermetic encapsulation App 20040058476 - Enquist, Paul M. ; et al. | 2004-03-25 |
| Method for low temperature bonding and bonded structure App 20030211705 - Tong, Qin-Yi ; et al. | 2003-11-13 |
| Three dimensional device integration method and integrated device Grant 6,627,531 - Enquist September 30, 2 | 2003-09-30 |
| Three dimensional device integration method and integrated device App 20030119279 - Enquist, Paul M. | 2003-06-26 |
| Three dimensional device integration method and integrated device Grant 6,500,694 - Enquist December 31, 2 | 2002-12-31 |
| Three dimensional device integration method and integrated device App 20020173120 - Enquist, Paul M. | 2002-11-21 |
| Three dimensional device integration method and integrated device App 20020164839 - Enquist, Paul M. | 2002-11-07 |
| Self aligned symmetric intrinsic process and device App 20020100916 - Enquist, Paul M. | 2002-08-01 |
| Three dimensional device intergration method and intergrated device App 20020094661 - Enquist, Paul M. ; et al. | 2002-07-18 |
| Light emitting device contact layers having substantially equal spreading resistance and method of manufacture Grant 6,410,943 - Enquist June 25, 2 | 2002-06-25 |
| Three dimensional device integration method and integrated device App 20020064906 - Enquist, Paul M. | 2002-05-30 |
| CMOS-compatible InP/InGaAs digital photoreceiver Grant 5,684,308 - Lovejoy , et al. November 4, 1 | 1997-11-04 |
| Symmetric self-aligned processing Grant 5,318,916 - Enquist , et al. June 7, 1 | 1994-06-07 |
| Method of manufacturing heterojunction transistors with self-aligned metal contacts Grant 5,272,095 - Enquist , et al. December 21, 1 | 1993-12-21 |
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