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Patent applications and USPTO patent grants for Enquist; Paul.The latest application filed is for "stacked dies and methods for forming bonded structures".
Patent | Date |
---|---|
Stacked Dies And Methods For Forming Bonded Structures App 20210183847 - Uzoh; Cyprian Emeka ;   et al. | 2021-06-17 |
Stacked dies and methods for forming bonded structures Grant 10,879,226 - Uzoh , et al. December 29, 2 | 2020-12-29 |
Stacked Dies And Methods For Forming Bonded Structures App 20190189607 - Uzoh; Cyprian Emeka ;   et al. | 2019-06-20 |
Stacked dies and methods for forming bonded structures Grant 10,204,893 - Uzoh , et al. Feb | 2019-02-12 |
Stacked Dies And Methods For Forming Bonded Structures App 20170338214 - Uzoh; Cyprian Emeka ;   et al. | 2017-11-23 |
Three dimensional device integration method and integrated device App 20080061418 - Enquist; Paul ;   et al. | 2008-03-13 |
Self aligned symmetric intrinsic process and device Grant 6,756,281 - Enquist June 29, 2 | 2004-06-29 |
Self aligned symmetric intrinsic process and device Grant 6,740,909 - Enquist May 25, 2 | 2004-05-25 |
Self aligned symmetric process and device Grant 6,368,930 - Enquist April 9, 2 | 2002-04-09 |
Self aligned symmetric intrinsic process and device App 20010019873 - Enquist, Paul | 2001-09-06 |
Self-aligned symmetric intrinsic device Grant 6,242,794 - Enquist June 5, 2 | 2001-06-05 |
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