ENOKIDO; Satoshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for ENOKIDO; Satoshi.The latest application filed is for "conveying device".
- ENOKIDO; Satoshi - Tokyo JP
- Enokido; Satoshi - Hachioji JP
- Enokido; Satoshi - Hachioji-shi JP
| Patent | Date |
|---|---|
| Conveying Device App 20220216089 - LI; JIN ; et al. | 2022-07-07 |
| Wire bonding apparatus and wire bonding method Grant 10,262,968 - Hayata , et al. | 2019-04-16 |
| Wire Bonding Apparatus And Wire Bonding Method App 20180090464 - HAYATA; Shigeru ; et al. | 2018-03-29 |
| Bonding program Grant 7,330,582 - Enokido , et al. February 12, 2 | 2008-02-12 |
| Bonding apparatus Grant 7,324,684 - Enokido , et al. January 29, 2 | 2008-01-29 |
| Bonding pattern discrimination device Grant 7,324,683 - Enokido January 29, 2 | 2008-01-29 |
| Bonding pattern discrimination program Grant 7,321,681 - Enokido January 22, 2 | 2008-01-22 |
| Method for setting capillary contact position data and wire bonding apparatus using the same App 20070181651 - Takahashi; Kuniyuki ; et al. | 2007-08-09 |
| Bonding pattern discrimination method, bonding pattern discrimination device and bonding pattern discrimination program Grant 7,224,829 - Enokido May 29, 2 | 2007-05-29 |
| Bonding method, bonding apparatus and bonding program Grant 7,209,583 - Enokido , et al. April 24, 2 | 2007-04-24 |
| Bonding program App 20070041632 - Enokido; Satoshi ; et al. | 2007-02-22 |
| Bonding pattern discrimination program App 20070036423 - Enokido; Satoshi | 2007-02-15 |
| Bonding pattern discrimination device App 20070036424 - Enokido; Satoshi | 2007-02-15 |
| Bonding apparatus App 20070036425 - Enokido; Satoshi ; et al. | 2007-02-15 |
| Bonding method, bonding apparatus and bonding program App 20050167471 - Enokido, Satoshi ; et al. | 2005-08-04 |
| Bonding pattern discrimination method, bonding pattern discrimination device and bonding pattern discrimination program App 20050167470 - Enokido, Satoshi | 2005-08-04 |
| Bonding apparatus Grant 6,814,121 - Hayata , et al. November 9, 2 | 2004-11-09 |
| Offset measurement method, tool position detection method and bonding apparatus Grant 6,762,848 - Hayata , et al. July 13, 2 | 2004-07-13 |
| Bonding apparatus App 20030030821 - Hayata, Shigeru ; et al. | 2003-02-13 |
| Bonding apparatus and bonding method Grant 6,467,673 - Enokido , et al. October 22, 2 | 2002-10-22 |
| Offset measurement method, tool position detection method and bonding apparatus App 20010042770 - Hayata, Shigeru ; et al. | 2001-11-22 |
| Bonding apparatus and bonding method App 20010016062 - Enokido, Satoshi ; et al. | 2001-08-23 |
| Bonding apparatus and bonding method App 20010011669 - Hayata, Shigeru ; et al. | 2001-08-09 |
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