loadpatents
name:-0.019500017166138
name:-0.0080430507659912
name:-0.00050520896911621
Engle; Jason C. Patent Filings

Engle; Jason C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Engle; Jason C..The latest application filed is for "modular integrated circuit chip carrier".

Company Profile
0.8.7
  • Engle; Jason C. - San Clemente CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Modular Integrated Circuit Chip Carrier
App 20110019377 - Kledzik; Kenneth J. ;   et al.
2011-01-27
Modular integrated circuit chip carrier
Grant 7,796,400 - Kledzik , et al. September 14, 2
2010-09-14
Carrier-based electronic module
Grant 7,405,471 - Kledzik , et al. July 29, 2
2008-07-29
Modular integrated circuit chip carrier
App 20060254809 - Kledzik; Kenneth J. ;   et al.
2006-11-16
Modular integrated circuit chip carrier
Grant 7,102,892 - Kledzik , et al. September 5, 2
2006-09-05
Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
Grant 6,900,529 - Kledzik , et al. May 31, 2
2005-05-31
Carrier-based electronic module
App 20040108590 - Kledzik, Kenneth J. ;   et al.
2004-06-10
Electronic circuit module with a carrier having a mounting pad array
Grant 6,713,854 - Kledzik , et al. March 30, 2
2004-03-30
Modular integrated circuit chip carrier
App 20030165051 - Kledzik, Kenneth J. ;   et al.
2003-09-04
Electronic module having canopy-type carriers
App 20030137808 - Kledzik, Kenneth J. ;   et al.
2003-07-24
Electronic module having canopy-type carriers
Grant 6,545,868 - Kledzik , et al. April 8, 2
2003-04-08
Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
App 20020181216 - Kledzik, Kenneth J. ;   et al.
2002-12-05
Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
Grant 6,487,078 - Kledzik , et al. November 26, 2
2002-11-26
Electronic Module Having A Three Dimensional Array Of Integrated Circuit Packages
App 20020135982 - Kledzik, Kenneth J. ;   et al.
2002-09-26
Circuit board assembly having a three dimensional array of integrated circuit packages
Grant 6,313,998 - Kledzik , et al. November 6, 2
2001-11-06

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