Engl; Reimund

Patent Applications and Registrations

Patent applications and USPTO patent grants for Engl; Reimund.The latest application filed is for "chip package, method of forming a chip package and method of forming an electrical contact".

Company Profile

7.20.27

Engl; Reimund - Munich DE
Engl; Reimund - Regensburg DE
Engl; Reimund - Muenchen DE
Engl; Reimund - Muechen DE
Engl; Reimund - Regensberg DE
Engl; Reimund - Nurnberg DE
Engl; Reimund - Nuremberg DE
Engl, Reimund - Nuernberg DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer Grant 10,978,418 - Mahler , et al. April 13, 2	2021-04-13
Chip Package, Method Of Forming A Chip Package And Method Of Forming An Electrical Contact App 20210082861 - Mahler; Joachim ; et al.	2021-03-18
Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package Grant 10,672,678 - Koerner , et al.	2020-06-02
Chip Package And Method Of Forming A Chip Package With A Metal Contact Structure And Protective Layer, And Method Of Forming An App 20200013749 - Mahler; Joachim ; et al.	2020-01-09
Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound Grant 10,497,634 - Koerner , et al. De	2019-12-03
Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact Grant 10,461,056 - Mahler , et al. Oc	2019-10-29
Methods For Forming A Chip Package App 20190287875 - Koerner; Heinrich ; et al.	2019-09-19
Chip package and method of forming a chip package Grant 9,941,181 - Koerner , et al. April 10, 2	2018-04-10
Chip Package And Method Of Forming A Chip Package App 20170338165 - KOERNER; Heinrich ; et al.	2017-11-23
Chip Package, Method Of Forming A Chip Package And Method Of Forming An Electrical Contact App 20170338169 - Mahler; Joachim ; et al.	2017-11-23
Chip Package And Method Of Forming A Chip Package App 20170338164 - Koerner; Heinrich ; et al.	2017-11-23
Semiconductor Device App 20150279782 - Ewe; Henrik ; et al.	2015-10-01
Semiconductor device Grant 9,059,083 - Ewe , et al. June 16, 2	2015-06-16
Protection Layers for Conductive Pads and Methods of Formation Thereof App 20140319688 - Meinhold; Dirk ; et al.	2014-10-30
Protection layers for conductive pads and methods of formation thereof Grant 8,835,319 - Meinhold , et al. September 16, 2	2014-09-16
Semiconductor device Grant 8,642,408 - Otremba , et al. February 4, 2	2014-02-04
Protection Layers for Conductive Pads and Methods of Formation Thereof App 20130228929 - Meinhold; Dirk ; et al.	2013-09-05
Integrated circuit device and method for the production thereof Grant 8,330,252 - Mahler , et al. December 11, 2	2012-12-11
Semiconductor device including isolation layer Grant 8,110,906 - Mahler , et al. February 7, 2	2012-02-07
Semiconductor Device App 20110189821 - Otremba; Ralf ; et al.	2011-08-04
Method for producing a power semiconductor module comprising surface-mountable flat external contacts Grant 7,955,901 - Ewe , et al. June 7, 2	2011-06-07
Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier Grant 7,868,465 - Otremba , et al. January 11, 2	2011-01-11
Semiconductor module Grant 7,705,441 - Mahler , et al. April 27, 2	2010-04-27
Semiconductor device with leadframe including a diffusion barrier Grant 7,675,146 - Engl , et al. March 9, 2	2010-03-09
Method For Producing A Power Semiconductor Module Comprising Surface-mountable Flat External Contacts App 20090093090 - Ewe; Henrik ; et al.	2009-04-09
Semiconductor Device App 20090072379 - Ewe; Henrik ; et al.	2009-03-19
Semiconductor Device With Leaderframe Including A Diffusion Barrier App 20090065914 - Engl; Reimund ; et al.	2009-03-12
Semiconductor Device App 20080296782 - Otremba; Ralf ; et al.	2008-12-04
Integrated Circuit Device And Method For The Production Thereof App 20080246137 - Mahler; Joachim ; et al.	2008-10-09
Semiconductor module App 20080220564 - Mahler; Joachim ; et al.	2008-09-11
Pentaarylcyclopentadienyl units as active units in resistive memory elements Grant 7,417,247 - Schmid , et al. August 26, 2	2008-08-26
Semiconductor Arrangement Having a Resistive Memory App 20080191197 - Walter; Andreas ; et al.	2008-08-14
Semiconductor Device Including Isolation Layer App 20080173992 - Mahler; Joachim ; et al.	2008-07-24
Integrated Circuit Having Resistive Memory App 20080142774 - Walter; Andreas ; et al.	2008-06-19
Semiconductor Component Arrangement App 20080061449 - Mahler; Joachim ; et al.	2008-03-13
Semiconductor arrangement with non-volatile memories App 20070194301 - Sezi; Recai ; et al.	2007-08-23
Method for Forming Memory Layers App 20070164276 - Engl; Reimund ; et al.	2007-07-19
Memory cell, method for the production thereof and use of a composition therefor Grant 7,238,964 - Walter , et al. July 3, 2	2007-07-03
Resistive memory for low-voltage applications Grant 7,211,856 - Sezi , et al. May 1, 2	2007-05-01
Material and cell structure for storage applications App 20060237716 - Sezi; Recai ; et al.	2006-10-26
Pentaarylcyclopentadienyl units as active units in resistive memory elements App 20050213413 - Schmid, Gunter ; et al.	2005-09-29
Resistive memory for low-voltage applications App 20050186737 - Sezi, Recai ; et al.	2005-08-25
Memory cell, method for the production thereof and use of a composition therefor App 20050179033 - Walter, Andreas ; et al.	2005-08-18