Engel; Raymond W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Engel; Raymond W..The latest application filed is for "methods and apparatus for passive attachment of components for integrated circuits".

Company Profile

2.9.10

Engel; Raymond W. - Southbridge MA
Engel; Raymond W - Southbridge MA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods And Apparatus For Passive Attachment Of Components For Integrated Circuits App 20200355525 - Taylor; William P. ; et al.	2020-11-12
Methods and Apparatus for Passive Attachment of Components for Integrated Circuits App 20150285874 - Taylor; William P. ; et al.	2015-10-08
Magnetic Field Sensors and Methods for Fabricating the Magnetic Field Sensors App 20130267043 - Ararao; Virgil ; et al.	2013-10-10
Magnetic Field Sensors and Methods for Fabricating the Magnetic Field Sensors App 20130264667 - Ararao; Virgil ; et al.	2013-10-10
Magnetic field sensors and methods for fabricating the magnetic field sensors Grant 8,486,755 - Ararao , et al. July 16, 2	2013-07-16
Magnetic field sensors and methods for fabricating the magnetic field sensors Grant 8,461,677 - Ararao , et al. June 11, 2	2013-06-11
Methods And Apparatus For Passive Attachment Of Components For Integrated Circuits App 20120086090 - Sharma; Nirmal ; et al.	2012-04-12
Methods for multi-stage molding of integrated circuit package Grant 8,143,169 - Engel , et al. March 27, 2	2012-03-27
Magnetic Field Sensors and Methods for Fabricating the Magnetic Field Sensors App 20120013333 - Ararao; Virgil ; et al.	2012-01-19
Methods For Multi-stage Molding Of Integrated Circuit Package App 20100330708 - Engel; Raymond W. ; et al.	2010-12-30
Methods and apparatus for multi-stage molding of integrated circuit package Grant 7,816,772 - Engel , et al. October 19, 2	2010-10-19
Magnetic Field Sensors and Methods for Fabricating the Magnetic Field Sensors App 20100141249 - Ararao; Virgil ; et al.	2010-06-10
Methods And Apparatus For Multi-stage Molding Of Integrated Circuit Package App 20080237818 - Engel; Raymond W. ; et al.	2008-10-02
Methods And Apparatus For Passive Attachment Of Components For Integrated Circuits App 20080013298 - Sharma; Nirmal ; et al.	2008-01-17
Single unitary plastic package for a magnetic field sensing device Grant 6,265,865 - Engel , et al. July 24, 2	2001-07-24
Package for a magnetic field sensing device Grant 5,963,028 - Engel , et al. October 5, 1	1999-10-05
Hall-effect ferrous-article-proximity sensor assembly Grant 5,581,179 - Engel , et al. December 3, 1	1996-12-03

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.