loadpatents
name:-0.00478196144104
name:-0.01066780090332
name:-0.00099301338195801
Engdahl; Erik H. Patent Filings

Engdahl; Erik H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Engdahl; Erik H..The latest application filed is for "low friction gimbaled substrate holder for cmp apparatus".

Company Profile
0.8.3
  • Engdahl; Erik H. - Livermore CA
  • Engdahl; Erik H. - Anaheim CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Apparatus for controlling leading edge and trailing edge polishing
Grant 6,729,945 - Xu , et al. May 4, 2
2004-05-04
Low friction gimbaled substrate holder for CMP apparatus
Grant 6,716,093 - Engdahl , et al. April 6, 2
2004-04-06
Low friction gimbaled substrate holder for CMP apparatus
App 20030109208 - Engdahl, Erik H. ;   et al.
2003-06-12
Method of transporting a semiconductor wafer in a wafer polishing system
Grant 6,517,418 - Engdahl , et al. February 11, 2
2003-02-11
Apparatus for controlling leading edge and trailing edge polishing
App 20020146972 - Xu, Cangshan ;   et al.
2002-10-10
Method of transporting a semiconductor wafer in a wafer polishing system
App 20010039168 - Engdahl, Erik H. ;   et al.
2001-11-08
Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
Grant 6,261,155 - Jairath , et al. July 17, 2
2001-07-17
Method and apparatus for stabilizing the process temperature during chemical mechanical polishing
Grant 6,224,461 - Boehm, Jr. , et al. May 1, 2
2001-05-01
Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
Grant 6,146,248 - Jairath , et al. November 14, 2
2000-11-14
Sensors for a linear polisher
Grant 5,762,536 - Pant , et al. June 9, 1
1998-06-09
Thermal processing apparatus and process
Grant 5,618,351 - Koble, Jr. , et al. April 8, 1
1997-04-08

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