Eng; Meow Koon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Eng; Meow Koon.The latest application filed is for "packaged semiconductor assemblies and methods for manufacturing such assemblies".

Company Profile

3.35.26

Eng; Meow Koon - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaged Semiconductor Assemblies And Methods For Manufacturing Such Assemblies App 20220013460 - Boon; Suan Jeung ; et al.	2022-01-13
Packaged Semiconductor Assemblies And Methods For Manufacturing Such Assemblies App 20200243444 - Boon; Suan Jeung ; et al.	2020-07-30
Packaged semiconductor assemblies and methods for manufacturing such assemblies Grant 10,622,308 - Boon , et al.	2020-04-14
Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods Grant 10,396,059 - Eng , et al. A	2019-08-27
Microelectronic Die Packages With Metal Leads, Including Metal Leads For Stacked Die Packages, And Associated Systems And Methods App 20180323179 - Eng; Meow Koon ; et al.	2018-11-08
Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods Grant 10,056,359 - Eng , et al. August 21, 2	2018-08-21
Packaged Semiconductor Assemblies And Methods For Manufacturing Such Assemblies App 20180158778 - Boon; Suan Jeung ; et al.	2018-06-07
Packaged semiconductor assemblies and methods for manufacturing such assemblies Grant 9,911,696 - Boon , et al. March 6, 2	2018-03-06
Microelectronic Die Packages With Metal Leads, Including Metal Leads For Stacked Die Packages, And Associated Systems And Methods App 20170207206 - Eng; Meow Koon ; et al.	2017-07-20
Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods Grant 9,653,444 - Eng , et al. May 16, 2	2017-05-16
Packaged microelectronic components Grant 9,418,872 - Eng , et al. August 16, 2	2016-08-16
Microelectronic Die Packages With Metal Leads, Including Metal Leads For Stacked Die Packages, And Associated Systems And Methods App 20160099237 - Eng; Meow Koon ; et al.	2016-04-07
Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods Grant 9,165,910 - Eng , et al. October 20, 2	2015-10-20
Microelectronic Die Packages With Metal Leads, Including Metal Leads For Stacked Die Packages, And Associated Systems And Methods App 20150091166 - Eng; Meow Koon ; et al.	2015-04-02
Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods Grant 8,906,744 - Eng , et al. December 9, 2	2014-12-09
Packaged Microelectronic Components App 20140141544 - Eng; Meow Koon ; et al.	2014-05-22
Packaged Semiconductor Assemblies And Methods For Manufacturing Such Assemblies App 20140124960 - Boon; Suan Jeung ; et al.	2014-05-08
Microelectronic Die Packages With Metal Leads, Including Metal Leads For Stacked Die Packages, And Associated Systems And Methods App 20140015130 - Eng; Meow Koon ; et al.	2014-01-16
Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods Grant 8,536,702 - Eng , et al. September 17, 2	2013-09-17
Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods Grant 8,525,320 - Eng , et al. September 3, 2	2013-09-03
Interconnects for packaged semiconductor devices and methods for manufacturing such devices Grant 8,445,330 - Boon , et al. May 21, 2	2013-05-21
Packaged semiconductor assemblies and methods for manufacturing such assemblies Grant 8,232,657 - Boon , et al. July 31, 2	2012-07-31
Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods Grant 8,198,720 - Eng , et al. June 12, 2	2012-06-12
Semiconductor device assemblies and packages Grant 8,063,493 - Boon , et al. November 22, 2	2011-11-22
Microelectronic Die Packages With Leadframes, Including Leadframe-based Interposer For Stacked Die Packages, And Associated Systems And Methods App 20110215453 - Eng; Meow Koon ; et al.	2011-09-08
Packaged semiconductor assemblies and methods for manufacturing such assemblies Grant 7,855,462 - Boon , et al. December 21, 2	2010-12-21
Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods Grant 7,843,050 - Eng , et al. November 30, 2	2010-11-30
Interconnects for packaged semiconductor devices and methods for manufacturing such devices Grant 7,791,203 - Boon , et al. September 7, 2	2010-09-07
Semiconductor Device Assemblies And Packages With Edge Contacts And Sacrificial Substrates And Other Intermediate Structures Used Or Formed In Fabricating The Assemblies Or Packages App 20100072603 - Boon; Suan Jeung ; et al.	2010-03-25
Microelectronic imagers and methods for manufacturing such microelectronic imagers Grant 7,659,134 - Chia , et al. February 9, 2	2010-02-09
Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages Grant 7,633,159 - Boon , et al. December 15, 2	2009-12-15
Multiple chip semiconductor package Grant 7,553,697 - Eng , et al. June 30, 2	2009-06-30
Method of making multichip wafer level packages and computing systems incorporating same Grant 7,485,562 - Chua , et al. February 3, 2	2009-02-03
Packaged Semiconductor Assemblies And Methods For Manufacturing Such Assemblies App 20090014858 - Boon; Suan Jeung ; et al.	2009-01-15
Castellation wafer level packaging of integrated circuit chips Grant 7,304,375 - Boon , et al. December 4, 2	2007-12-04
Castellation wafer level packaging of integrated circuit chips Grant 7,271,027 - Boon , et al. September 18, 2	2007-09-18
Castellated chip-scale packages and methods for fabricating the same Grant 7,208,335 - Boon , et al. April 24, 2	2007-04-24
Castellation wafer level packaging of integrated circuit chips Grant 7,193,312 - Boon , et al. March 20, 2	2007-03-20
Multiple chip semiconductor package App 20070059862 - Eng; Meow Koon ; et al.	2007-03-15
Multiple chip semiconductor package Grant 7,173,330 - Eng , et al. February 6, 2	2007-02-06
Multichip wafer level packages and computing systems incorporating same Grant 7,087,992 - Chua , et al. August 8, 2	2006-08-08
Multiple chip semiconductor package and method of fabricating same Grant 6,987,031 - Eng , et al. January 17, 2	2006-01-17
Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages App 20060006521 - Boon; Suan Jeung ; et al.	2006-01-12
Castellation wafer level packaging of integrated circuit chips App 20060001143 - Boon; Suan Jeung ; et al.	2006-01-05
Multi-chip wafer level system packages and methods of forming same Grant 6,964,881 - Chua , et al. November 15, 2	2005-11-15
Multiple chip semiconductor package and method of fabricating same App 20050236709 - Eng, Meow Koon ; et al.	2005-10-27
Multiple chip semiconductor package Grant 6,958,537 - Eng , et al. October 25, 2	2005-10-25
Method of making multichip wafer level packages and computing systems incorporating same App 20050116337 - Chua, Swee Kwang ; et al.	2005-06-02
Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a lead Grant 6,882,021 - Boon , et al. April 19, 2	2005-04-19
Multichip wafer level packages and computing systems incorporating same App 20050073029 - Chua, Swee Kwang ; et al.	2005-04-07
Castellated chip-scale packages and methods for fabricating the same App 20050067680 - Boon, Suan Jeung ; et al.	2005-03-31
Multiple chip semiconductor package App 20050006748 - Eng, Meow Koon ; et al.	2005-01-13
Packaged microelectronic devices and methods of packaging microelectronic devices App 20040238909 - Boon, Suan Jeung ; et al.	2004-12-02
Multichip wafer level packages and computing systems incorporating same Grant 6,825,553 - Chua , et al. November 30, 2	2004-11-30
Multichip wafer level system packages and methods of forming same App 20040229400 - Chua, Swee Kwang ; et al.	2004-11-18
Multichip wafer level packages and computing systems incorporating same App 20040046250 - Chua, Swee Kwang ; et al.	2004-03-11
Multiple chip semiconductor package and method of fabricating same App 20040042190 - Eng, Meow Koon ; et al.	2004-03-04
Multi-chip wafer level system packages and methods of forming same App 20040043533 - Chua, Swee Kwang ; et al.	2004-03-04

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.