Eng; Kian Teng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Eng; Kian Teng.The latest application filed is for "semiconductor packages and methods of packaging semiconductor devices".

Company Profile

0.15.11

Eng; Kian Teng - Singapore SG
Eng; Kian Teng - Compass Heights SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor packages and methods of packaging semiconductor devices Grant 9,881,863 - Wang , et al. January 30, 2	2018-01-30
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20170148722 - WANG; Chuen Khiang ; et al.	2017-05-25
Semiconductor packages and methods of packaging semiconductor devices Grant 9,589,875 - Wang , et al. March 7, 2	2017-03-07
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20150380346 - WANG; Chuen Khiang ; et al.	2015-12-31
Semiconductor packages and methods of packaging semiconductor devices Grant 9,136,142 - Wang , et al. September 15, 2	2015-09-15
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20140227832 - WANG; Chuen Khiang ; et al.	2014-08-14
Semiconductor packages and methods of packaging semiconductor devices Grant 8,716,873 - Wang , et al. May 6, 2	2014-05-06
Semiconductor package and method of attaching semiconductor dies to substrates Grant 8,592,258 - Castillo , et al. November 26, 2	2013-11-26
Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process Grant 8,247,272 - Koh , et al. August 21, 2	2012-08-21
Semiconductor Package And Method Of Attaching Semiconductor Dies To Substrates App 20120034738 - CASTILLO; Denver Paul C. ; et al.	2012-02-09
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20120001306 - WANG; Chuen Khiang ; et al.	2012-01-05
Shrink Package On Board App 20100102436 - ENG; Kian Teng ; et al.	2010-04-29
Copper On Organic Solderability Preservative (osp) Interconnect And Enhanced Wire Bonding Process App 20100025849 - KOH; Yong Chuan ; et al.	2010-02-04
Semiconductor Package And Method Of Attaching Semiconductor Dies To Substrates App 20090194871 - Castillo; Denver Paul C. ; et al.	2009-08-06
Avoiding Electrical Shorts In Packaging App 20090165815 - ALCALA; Debbie Tuerca ; et al.	2009-07-02
Copper On Organic Solderability Preservative (osp) Interconnect App 20090008796 - Eng; Kian Teng ; et al.	2009-01-08
Solder ball contact and method Grant 6,514,845 - Eng , et al. February 4, 2	2003-02-04
Method for adhering and sealing a silicon chip in an integrated circuit package Grant 6,387,729 - Eng , et al. May 14, 2	2002-05-14
Integrated circuit package Grant 6,365,833 - Eng , et al. April 2, 2	2002-04-02
Method for adhering and sealing a silicon chip in an integrated circuit package App 20020001882 - Eng, Kian Teng ; et al.	2002-01-03
Method for adhering and sealing a silicon chip in an integrated circuit package Grant 6,087,203 - Eng , et al. July 11, 2	2000-07-11
Double sided single inline memory module Grant 5,998,860 - Chan , et al. December 7, 1	1999-12-07
High density single inline memory module Grant 5,956,233 - Yew , et al. September 21, 1	1999-09-21
Flexible pin location integrated circuit package Grant 5,952,611 - Eng , et al. September 14, 1	1999-09-14

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