Endoh; Keiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Endoh; Keiichi.The latest application filed is for "bonding material and bonding method employing same".

Company Profile

8.16.23

Endoh; Keiichi - Tokyo JP
Endoh; Keiichi - Okayama JP
ENDOH; Keiichi - Okayama-shi Okayama-ken

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Joining material and joining method using same Grant 11,453,053 - Kurita , et al. September 27, 2	2022-09-27
Bonding material and bonding method using same Grant 10,903,185 - Endoh , et al. January 26, 2	2021-01-26
Bonding material and bonding method using same Grant 10,821,558 - Endoh , et al. November 3, 2	2020-11-03
Bonding Material And Bonding Method Employing Same App 20200094318 - FUJIMOTO; Hideyuki ; et al.	2020-03-26
Bonding Material And Bonded Product Using Same App 20200035637 - Hori; Tatsuro ; et al.	2020-01-30
Bonding material and bonding method using same Grant 10,543,569 - Kurita , et al. Ja	2020-01-28
Bonding Material And Bonding Method Using Same App 20190283129 - Endoh; Keiichi ; et al.	2019-09-19
Bonding material and bonding method using same Grant 10,328,534 - Endoh , et al.	2019-06-25
Joining Material And Joining Method Using Same App 20190118257 - Kurita; Satoru ; et al.	2019-04-25
Method For Joining Electronic Part Using A Joining Silver Sheet App 20180331063 - KURITA; Satoru ; et al.	2018-11-15
Bonding method using bonding material Grant 10,090,275 - Endoh , et al. October 2, 2	2018-10-02
Bonding material and bonding method using the same Grant 10,008,471 - Endoh , et al. June 26, 2	2018-06-26
Bonding Material And Bonding Method Using Same App 20170252874 - Endoh; Keiichi ; et al.	2017-09-07
Metal nanoparticle dispersion, method for producing metal nanoparticle dispersion, and bonding method Grant 9,662,748 - Endoh , et al. May 30, 2	2017-05-30
Bonding Material And Bonding Method Using Same App 20170120395 - Kurita; Satoru ; et al.	2017-05-04
Bonding Material And Bonding Method Using Same App 20170077057 - Endoh; Keiichi ; et al.	2017-03-16
Bonding material and bonding method in which said bonding material is used Grant 9,533,380 - Endoh , et al. January 3, 2	2017-01-03
Joining Silver Sheet, Method For Manufacturing Same, And Method For Joining Electronic Part App 20160254243 - KURITA; Satoru ; et al.	2016-09-01
Bonding Material And Bonding Method Using The Same App 20160172328 - ENDOH; Keiichi ; et al.	2016-06-16
Bonding Material And Bonding Method Using Same App 20160136763 - Endoh; Keiichi ; et al.	2016-05-19
Metal Paste For Joining, Joining Method And Joined Body App 20160121435 - FURUKAWA; Masashi ; et al.	2016-05-05
Metal Nanoparticle Dispersion, Method For Producing Metal Nanoparticle Dispersion, And Bonding Method App 20160101486 - ENDOH; Keiichi ; et al.	2016-04-14
Bonding Material And Bonding Method Using The Same App 20160099087 - ENDOH; Keiichi ; et al.	2016-04-07
Bonding material and bonding method using the same Grant 9,240,256 - Endoh , et al. January 19, 2	2016-01-19
Bonding Material And Bonding Method In Which Said Bonding Material Is Used App 20150028085 - Endoh; Keiichi ; et al.	2015-01-29
Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding method Grant 8,858,700 - Endoh , et al. October 14, 2	2014-10-14
Low-temperature-sinterable bonding material, and bonding method using the bonding material Grant 8,641,929 - Endoh , et al. February 4, 2	2014-02-04
Bonding Material And Bonding Body, And Bonding Method App 20130323529 - Kurita; Satoru ; et al.	2013-12-05
Low-temperature-sinterable Bonding Material, And Bonding Method Using The Bonding Material App 20130081759 - Endoh; Keiichi ; et al.	2013-04-04
Bonding Material And Bonding Method Using The Same App 20120298009 - Endoh; Keiichi ; et al.	2012-11-29
Bonding Material Using Metal Nanoparticles And Bonding Method App 20120103515 - Endoh; Keiichi ; et al.	2012-05-03

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