| Patent | Date |
|---|
Semiconductor embedded module and method for producing the same
Grant 8,742,589 - Kawabata , et al. June 3, 2 | 2014-06-03 |
Controllable Turn-Around Time For Post Tape-Out Flow
App 20140040848 - Endo; Toshikazu ; et al. | 2014-02-06 |
Partition response surface modeling
Grant 8,572,525 - Chew , et al. October 29, 2 | 2013-10-29 |
Light source device with thermal dissipating members
Grant 8,523,410 - Hashimoto , et al. September 3, 2 | 2013-09-03 |
Light source apparatus
Grant 8,414,163 - Hashimoto , et al. April 9, 2 | 2013-04-09 |
Light Source Apparatus
App 20120327669 - Hashimoto; Naotaka ; et al. | 2012-12-27 |
Composite wire indexing for programmable logic devices
Grant 8,286,116 - Endo , et al. October 9, 2 | 2012-10-09 |
Light Source Apparatus
App 20120243240 - Hashimoto; Naotaka ; et al. | 2012-09-27 |
Light Source Device
App 20120224381 - Hashimoto; Naotaka ; et al. | 2012-09-06 |
Lamp And Lighting Apparatus
App 20120187836 - Hashimoto; Naotaka ; et al. | 2012-07-26 |
Light Source Apparatus
App 20120120670 - Hashimoto; Naotaka ; et al. | 2012-05-17 |
Wire mapping for programmable logic devices
Grant 8,104,009 - Kang , et al. January 24, 2 | 2012-01-24 |
Partition Response Surface Modeling
App 20110047520 - Chew; Marko P ; et al. | 2011-02-24 |
Wire mapping for programmable logic devices
Grant 7,890,913 - Kang , et al. February 15, 2 | 2011-02-15 |
Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded therein
Grant 7,812,444 - Katsumata , et al. October 12, 2 | 2010-10-12 |
Composite wire indexing for programmable logic devices
Grant 7,788,623 - Endo , et al. August 31, 2 | 2010-08-31 |
Hard disk drive and wireless data terminal using the same
Grant 7,733,600 - Endo , et al. June 8, 2 | 2010-06-08 |
Semiconductor embedded module and method for producing the same
App 20100013103 - Kawabata; Kenichi ; et al. | 2010-01-21 |
Module with embedded semiconductor IC and method of fabricating the module
Grant 7,547,975 - Takaya , et al. June 16, 2 | 2009-06-16 |
Semiconductor-embedded substrate and manufacturing method thereof
App 20080079146 - Hattori; Yasuyuki ; et al. | 2008-04-03 |
Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards
App 20080044660 - Takaya; Minoru ; et al. | 2008-02-21 |
Hard disk drive and wireless data terminal using the same
App 20070076320 - Endo; Toshikazu ; et al. | 2007-04-05 |
Semiconductor IC-embedded module
App 20070057366 - Katsumata; Masashi ; et al. | 2007-03-15 |
Inductive device and method for producing the same
Grant 7,167,071 - Takaya , et al. January 23, 2 | 2007-01-23 |
Multilayer substrate and method for producing same
App 20060180342 - Takaya; Minoru ; et al. | 2006-08-17 |
Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module
Grant 7,081,803 - Takaya , et al. July 25, 2 | 2006-07-25 |
Composite Magnetic Material And Magnetic Molding Material, Magnetic Powder Compression Molding Material, And Magnetic Paint Using The Composite Magnetic Material, Composite Dielectric Material And Molding Material, Powder Compression Molding Material, Paint, Prepreg, And Substrate Using The Composit
Grant 7,060,350 - Takaya , et al. June 13, 2 | 2006-06-13 |
Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin compo
App 20050154110 - Takaya, Minoru ; et al. | 2005-07-14 |
Inductive device and method for producing the same
App 20050151613 - Takaya, Minoru ; et al. | 2005-07-14 |
Composite Dielectric Material, Composite Dielectric Substrate, Prepreg, Coated Metal Foil, Molded Sheet, Composite Magnetic Substrate, Substrate, Double Side Metal Foil-clad Substrate, Flame Retardant Substrate, Polyvinylbenzyl Ether Resin Composition, Thermosettin
Grant 6,908,960 - Takaya , et al. June 21, 2 | 2005-06-21 |
Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin compo
App 20050130446 - Takaya, Minoru ; et al. | 2005-06-16 |
Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyviny
App 20050130447 - Takaya, Minoru ; et al. | 2005-06-16 |
Module with embedded semiconductor IC and method of fabricating the module
App 20050029642 - Takaya, Minoru ; et al. | 2005-02-10 |
Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards
App 20050003199 - Takaya, Minoru ; et al. | 2005-01-06 |
Electronic component and process for manufacturing the same
App 20040265551 - Takaya, Minoru ; et al. | 2004-12-30 |
Method for producing multilayer substrate and electronic part, and multilayer electronic part
Grant 6,808,642 - Takaya , et al. October 26, 2 | 2004-10-26 |
Electronic parts and method producing the same
App 20040202848 - Takaya, Minoru ; et al. | 2004-10-14 |
Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module
App 20040183645 - Takaya, Minoru ; et al. | 2004-09-23 |
Electronic parts and method producing the same
Grant 6,749,928 - Takaya , et al. June 15, 2 | 2004-06-15 |
Electronic parts
Grant 6,713,162 - Takaya , et al. March 30, 2 | 2004-03-30 |
Module component, core substrate element assembly, multi-layer substrate, method of manufacturing core substrate element assembly, method of manufacturing multi-layer substrate, and method of manufacturing module component
App 20030039101 - Takaya, Minoru ; et al. | 2003-02-27 |
Method for producing multilayer substrate and electronic part, and multilayer electronic part
App 20030029830 - Takaya, Minoru ; et al. | 2003-02-13 |
Substrate for electronic part and electronic part
App 20030030994 - Takaya, Minoru ; et al. | 2003-02-13 |
Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin compo
App 20020132898 - Takaya, Minoru ; et al. | 2002-09-19 |
Electronic parts and method producing the same
App 20020122934 - Takaya, Minoru ; et al. | 2002-09-05 |
Composite magnetic material and magnetic molding material, magnetic powder compression molding material, and magnetic paint using the composite magnetic material, composite dielectric material and molding material, powder compression molding material, paint, prepreg, and substrate using the composit
App 20020039667 - Takaya, Minoru ; et al. | 2002-04-04 |
Electronic parts
App 20020009577 - Takaya, Minoru ; et al. | 2002-01-24 |
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