| Patent | Date |
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Robust multi-layer wiring elements and assemblies with embedded microelectronic elements
Grant 10,032,646 - Haba , et al. July 24, 2 | 2018-07-24 |
Microelectronic interconnect element with decreased conductor spacing
Grant 9,856,135 - Ryu , et al. January 2, 2 | 2018-01-02 |
Microelectronic Interconnect Element With Decreased Conductor Spacing
App 20170096329 - Ryu; Chang Myung ; et al. | 2017-04-06 |
Robust Multi-layer Wiring Elements And Assemblies With Embedded Microelectronic Elements
App 20170018440 - Haba; Belgacem ; et al. | 2017-01-19 |
Microelectronic interconnect element with decreased conductor spacing
Grant 9,524,947 - Ryu , et al. December 20, 2 | 2016-12-20 |
Interconnection element with posts formed by plating
Grant 9,282,640 - Kwon , et al. March 8, 2 | 2016-03-08 |
Microelectronic Interconnect Element With Decreased Conductor Spacing
App 20150087146 - Ryu; Chang Myung ; et al. | 2015-03-26 |
Method of making a microelectronic interconnect element with decreased conductor spacing
Grant 8,900,464 - Ryu , et al. December 2, 2 | 2014-12-02 |
Structure and method of making interconnect element, and multilayer wiring board including the interconnect element
Grant 8,859,420 - Endo , et al. October 14, 2 | 2014-10-14 |
Method of Making a Microelectronic Interconnect Element With Decreased Conductor Spacing
App 20130341299 - RYU; Chang Myung ; et al. | 2013-12-26 |
Interconnection Element With Posts Formed By Plating
App 20130286619 - Kwon; Jinsu ; et al. | 2013-10-31 |
Method of fabricating an interconnection element having conductive posts
Grant 8,505,199 - Kwon , et al. August 13, 2 | 2013-08-13 |
Microelectronic Substrate Or Element Having Conductive Pads And Metal Posts Joined Thereto Using Bond Layer
App 20130186944 - Haba; Belgacem ; et al. | 2013-07-25 |
Microelectronic interconnect element with decreased conductor spacing
Grant 8,461,460 - Ryu , et al. June 11, 2 | 2013-06-11 |
Interconnection Element For Electric Circuits
App 20130119012 - Endo; Kimitaka | 2013-05-16 |
Interconnection element for electric circuits
Grant 8,299,368 - Endo October 30, 2 | 2012-10-30 |
Bump structure formed from using removable mandrel
Grant 8,119,516 - Endo February 21, 2 | 2012-02-21 |
Structure And Method Of Making Interconnect Element, And Multilayer Wiring Board Including The Interconnect Element
App 20110252637 - Endo; Kimitaka ; et al. | 2011-10-20 |
Structure and method of making interconnect element, and multilayer wiring board including the interconnect element
Grant 7,923,828 - Endo , et al. April 12, 2 | 2011-04-12 |
Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
App 20100242270 - Iijima; Tomoo ; et al. | 2010-09-30 |
Chip Capacitor Embedded Pwb
App 20100071944 - Endo; Kimitaka | 2010-03-25 |
Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer
App 20100044860 - Haba; Belgacem ; et al. | 2010-02-25 |
Microelectronic interconnect element with decreased conductor spacing
App 20100009554 - Ryu; Chang Myung ; et al. | 2010-01-14 |
System management method, system management device, system management program, and storage medium containing system management program
Grant 7,617,238 - Nakayama , et al. November 10, 2 | 2009-11-10 |
Interconnection element for electric circuits
App 20090188706 - Endo; Kimitaka | 2009-07-30 |
Interconnection element with posts formed by plating
App 20090145645 - Kwon; Jinsu ; et al. | 2009-06-11 |
Interconnection element with plated posts formed on mandrel
App 20090148594 - Moran; Sean ; et al. | 2009-06-11 |
Process for forming a bump structure and bump structure
App 20090121351 - Endo; Kimitaka | 2009-05-14 |
Robust multi-layer wiring elements and assemblies with embedded microelectronic elements
App 20090115047 - Haba; Belgacem ; et al. | 2009-05-07 |
Multilayer substrate with interconnection vias and method of manufacturing the same
App 20090071707 - Endo; Kimitaka ; et al. | 2009-03-19 |
Database access control method, database access controller, agent processing server, database access control program, and medium recording the program
Grant 7,454,421 - Imaeda , et al. November 18, 2 | 2008-11-18 |
Flexible Circuit Board, Method For Making The Same, Flexible Multi-layer Wiring Circuit Board, And Method For Making The Same
App 20070170598 - Iijima; Tomoo ; et al. | 2007-07-26 |
Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate
Grant 7,238,603 - Iijima , et al. July 3, 2 | 2007-07-03 |
System management method, system management device, system management program, and storage medium containing system management program
App 20060190588 - Nakayama; Jouji ; et al. | 2006-08-24 |
Database access control method, database access controller, agent processing server, database access control program, and medium recording the program
App 20060143189 - Imaeda; Takashi ; et al. | 2006-06-29 |
Structure and method of making interconnect element, and multilayer wiring board including the interconnect element
App 20060079127 - Endo; Kimitaka ; et al. | 2006-04-13 |
Interlayer member used for producing multilayer wiring board and method of producing the same
App 20050224256 - Osawa, Kenji ; et al. | 2005-10-13 |
Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate
App 20050161804 - Iijima, Tomoo ; et al. | 2005-07-28 |
Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring board
App 20050097727 - Iijima, Tomoo ; et al. | 2005-05-12 |
Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate
Grant 6,884,709 - Iijima , et al. April 26, 2 | 2005-04-26 |
Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
App 20040201096 - Iijima, Tomoo ; et al. | 2004-10-14 |
Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate
App 20030155653 - Iijima, Tomoo ; et al. | 2003-08-21 |
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