loadpatents
name:-0.010435819625854
name:-0.019731044769287
name:-0.00046300888061523
En; Honchin Patent Filings

En; Honchin

Patent Applications and Registrations

Patent applications and USPTO patent grants for En; Honchin.The latest application filed is for "printed wiring board and method for producing the same".

Company Profile
0.19.14
  • En; Honchin - Ibi-gun N/A JP
  • En; Honchin - Gifu JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Printed wiring board and method for producing the same
Grant 8,533,943 - En , et al. September 17, 2
2013-09-17
Printed wiring board and method for producing the same
Grant 8,093,507 - En , et al. January 10, 2
2012-01-10
Printed wiring board and its manufacturing method
Grant 8,065,794 - En , et al. November 29, 2
2011-11-29
Printed wiring board and method for producing the same
Grant 8,030,577 - En , et al. October 4, 2
2011-10-04
Method of manufacturing a printed wiring board
Grant 8,020,291 - En , et al. September 20, 2
2011-09-20
Printed circuit board
Grant 8,018,045 - En , et al. September 13, 2
2011-09-13
Method for producing a printed wiring board
Grant 8,006,377 - En , et al. August 30, 2
2011-08-30
Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board
Grant 7,993,510 - En August 9, 2
2011-08-09
Printed wiring board and method for producing the same
Grant 7,994,433 - En , et al. August 9, 2
2011-08-09
Electroplating process of electroplating an elecrically conductive sustrate
Grant 7,827,680 - En , et al. November 9, 2
2010-11-09
Multilayer printed circuit board
Grant 7,812,262 - En October 12, 2
2010-10-12
Printed wiring board and its manufacturing method
Grant 7,691,189 - En , et al. April 6, 2
2010-04-06
Printed Wiring Board And Method For Producing The Same
App 20090205857 - EN; Honchin ;   et al.
2009-08-20
Printed Wiring Board And Method For Producing The Same
App 20090188708 - EN; Honchin ;   et al.
2009-07-30
Printed Wiring Board And Method For Producing The Same
App 20090183904 - EN; Honchin ;   et al.
2009-07-23
Printed Wiring Board And Its Manufacturing Method
App 20090145652 - En; Honchin ;   et al.
2009-06-11
Printed wiring board and method for producing the same
Grant 7,535,095 - En , et al. May 19, 2
2009-05-19
Printed Wiring Board And Method For Producing The Same
App 20090090003 - En; Honchin ;   et al.
2009-04-09
Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board
Grant 7,514,637 - En April 7, 2
2009-04-07
Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same
Grant 7,504,719 - En , et al. March 17, 2
2009-03-17
Printed Wiring Board And Method For Producing The Same
App 20080289176 - EN; Honchin ;   et al.
2008-11-27
Printed Wiring Board And Method For Producing The Same
App 20080292852 - EN; Honchin ;   et al.
2008-11-27
Printed Wiring Board And Method For Producing The Same
App 20080289864 - EN; Honchin ;   et al.
2008-11-27
Multilayer printed circuit board
Grant 7,446,263 - En November 4, 2
2008-11-04
Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board
App 20080230263 - EN; Honchin
2008-09-25
Printed Wiring Board And Its Manufacturing Method
App 20070266886 - En; Honchin ;   et al.
2007-11-22
Printed wiring board and its manufacturing method
Grant 7,230,188 - En , et al. June 12, 2
2007-06-12
Printed wiring board and method for producing the same
App 20050258522 - En, Honchin ;   et al.
2005-11-24
Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board
App 20050211561 - En, Honchin
2005-09-29
Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board
App 20040226745 - En, Honchin
2004-11-18
Printed wiring board and its manufacturing method
App 20040134682 - En, Honchin ;   et al.
2004-07-15
Printed wiring board and method for manufacturing the same
Grant 6,242,079 - Mikado , et al. June 5, 2
2001-06-05

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed