EMNET; Charlotte

Patent Applications and Registrations

Patent applications and USPTO patent grants for EMNET; Charlotte.The latest application filed is for "composition for cobalt electroplating comprising leveling agent".

Company Profile

4.18.28

EMNET; Charlotte - Ludwigshafen DE
Emnet; Charlotte - Stuttgart DE
EMNET; Charlotte - Bad Duerkheim DE
Emnet; Charlotte - Dresden DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composition for Cobalt Electroplating Comprising Leveling Agent App 20220298664 - ENGELHARDT; Nadine ; et al.	2022-09-22
Composition for metal electroplating comprising leveling agent Grant 11,387,108 - Kienle , et al. July 12, 2	2022-07-12
Composition for cobalt electroplating comprising leveling agent Grant 11,377,748 - Engelhardt , et al. July 5, 2	2022-07-05
Composition For Cobalt Plating Comprising Additive For Void-free Submicron Feature Filling App 20220018035 - Katayaporn; Sathana ; et al.	2022-01-20
Composition For Metal Plating Comprising Suppressing Agent For Void Free Submicron Feature Filling App 20210317582 - Roger-Gopfert; Cornelia ; et al.	2021-10-14
Composition For Cobalt Plating Comprising Additive For Void-free Submicron Feature Filling App 20210040635 - KIENLE; Marcel Patrik ; et al.	2021-02-11
Composition For Cobalt Electroplating Comprising Leveling Agent App 20200347503 - ENGELHARDT; Nadine ; et al.	2020-11-05
Composition For Metal Electroplating Comprising Leveling Agent App 20200199767 - ROEGER-GOEPFERT; Cornelia ; et al.	2020-06-25
Composition For Metal Electroplating Comprising Leveling Agent App 20200185224 - KIENLE; Marcel Patrik ; et al.	2020-06-11
Composition For Metal Plating Comprising Suppressing Agent For Void Free Submicron Feature Filling App 20200173029 - ROEGER-GOEPFERT; Cornelia ; et al.	2020-06-04
Composition For Metal Plating Comprising Suppressing Agent For Void Free Filing App 20190309429 - KIENLE; Marcel Patrik ; et al.	2019-10-10
Composition For Cobalt Plating Comprising Additive For Void-free Submicron Feature Filling App 20190226107 - KIENLE; Marcel Patrik ; et al.	2019-07-25
Composition for metal plating comprising suppressing agent for void free submicron feature filling Grant 9,869,029 - Roeger-Goepfert , et al. January 16, 2	2018-01-16
Composition for metal electroplating comprising leveling agent Grant 9,834,677 - Roeger-Goepfert , et al. December 5, 2	2017-12-05
Composition for metal electroplating comprising leveling agent Grant 9,758,885 - Kienle , et al. September 12, 2	2017-09-12
Composition for metal electroplating comprising leveling agent Grant 9,683,302 - Siemer , et al. June 20, 2	2017-06-20
Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features Grant 9,631,292 - Roeger-Goepfert , et al. April 25, 2	2017-04-25
Composition for metal plating comprising suppressing agent for void free submicron feature filling Grant 9,617,647 - Roeger-Goepfert , et al. April 11, 2	2017-04-11
Composition for metal electroplating comprising leveling agent Grant 9,598,540 - Roeger-Goepfert , et al. March 21, 2	2017-03-21
Composition For Metal Electroplating Comprising Leveling Agent App 20150284865 - Kienle; Marcel Patrik ; et al.	2015-10-08
Composition for metal electroplating comprising leveling agent Grant 9,011,666 - Roeger-Goepfert , et al. April 21, 2	2015-04-21
Composition For Metal Electroplating Comprising An Additive For Bottom-up Filling Of Though Silicon Vias And Interconnect Features App 20140097092 - Roeger-Goepfert; Cornelia ; et al.	2014-04-10
Composition For Metal Electroplating Comprising Leveling Agent App 20130264213 - Roeger-Goepfert; Cornelia ; et al.	2013-10-10
Composition For Metal Electroplating Comprising Leveling Agent App 20130068626 - Siemer; Michael ; et al.	2013-03-21
Composition For Metal Electroplating Comprising Leveling Agent App 20130020203 - Roeger-Goepfert; Cornelia ; et al.	2013-01-24
Composition For Metal Electroplating Comprising Leveling Agent App 20120292193 - Roeger-Goepfert; Cornelia ; et al.	2012-11-22
Composition For Metal Plating Comprising Suppressing Agent For Void Free Submicron Feature Filling App 20120128888 - Roeger-Goepfert; Cornelia ; et al.	2012-05-24
Composition For Metal Plating Comprising Suppressing Agent For Void Free Submicron Feature Filling App 20120118750 - Roeger-Goepfert; Cornelia ; et al.	2012-05-17
Composition For Metal Plating Comprising Suppressing Agent For Void Free Submicron Feature Filling App 20120027948 - Roeger-Goepfert; Cornelia ; et al.	2012-02-02
Composition For Metal Plating Comprising Suppressing Agent For Void Free Submicron Feature Filling App 20120024711 - Roeger-Goepfert; Cornelia ; et al.	2012-02-02
Composition For Metal Plating Comprising Suppressing Agent For Void Free Submicron Feature Filling App 20120018310 - Roeger-Goepfert; Cornelia ; et al.	2012-01-26
Composition For Metal Electroplating Comprising Leveling Agent App 20110290659 - Roeger-Gopfert; Cornelia ; et al.	2011-12-01
Method of forming a metal directly on a conductive barrier layer by electrochemical deposition using an oxygen-depleted ambient Grant 7,981,793 - Preusse , et al. July 19, 2	2011-07-19
Method Of Forming A Metal Directly On A Conductive Barrier Layer By Electrochemical Deposition Using An Oxygen-depleted Ambient App 20090061621 - Preusse; Axel ; et al.	2009-03-05
Method Of Forming A Metal Directly On A Conductive Barrier Layer By Electrochemical Deposition Using An Oxygen-depleted Ambient App 20090061629 - Preusse; Axel ; et al.	2009-03-05

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