Emigh; Roger

Patent Applications and Registrations

Patent applications and USPTO patent grants for Emigh; Roger.The latest application filed is for "integrated circuit protruding pad package system and method for manufacturing thereof".

Company Profile

0.5.4

Emigh; Roger - Mesa AZ US
Emigh; Roger - Singapore AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit protruding pad package system and method for manufacturing thereof Grant 8,587,098 - Chow , et al. November 19, 2	2013-11-19
Integrated Circuit Protruding Pad Package System And Method For Manufacturing Thereof App 20110233744 - Chow; Seng Guan ; et al.	2011-09-29
Integrated circuit protruding pad package system Grant 7,968,377 - Chow , et al. June 28, 2	2011-06-28
Integrated Circuit Protruding Pad Package System App 20070063322 - Chow; Seng Guan ; et al.	2007-03-22
Stacked die packaging and fabrication method Grant 7,064,430 - Chow , et al. June 20, 2	2006-06-20
Stacked die packaging and fabrication method App 20060043559 - Chow; Seng Guan ; et al.	2006-03-02
Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices Grant 6,775,140 - Shim , et al. August 10, 2	2004-08-10
Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices App 20040075987 - Shim, Il Kwon ; et al.	2004-04-22

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