| Patent | Date |
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Enhanced plating bath and additive chemistries for cobalt plating
Grant 11,118,278 - Emesh , et al. September 14, 2 | 2021-09-14 |
Methods and apparatus for hybrid feature metallization
Grant 11,024,537 - Shaviv , et al. June 1, 2 | 2021-06-01 |
Methods and apparatus for filling a feature disposed in a substrate
Grant 10,950,500 - Shaviv , et al. March 16, 2 | 2021-03-16 |
Methods And Apparatus For Hybrid Feature Metallization
App 20210043506 - Shaviv; Roey ; et al. | 2021-02-11 |
Methods And Apparatus For Filling A Feature Disposed In A Substrate
App 20200251340 - Kind Code | 2020-08-06 |
Apparatus And Methods For Asymmetric Deposition Of Metal On High Aspect Ratio Nanostructures
App 20200219720 - SHEU; BEN-LI ; et al. | 2020-07-09 |
Methods for asymmetric deposition of metal on high aspect ratio nanostructures
Grant 10,636,655 - Sheu , et al. | 2020-04-28 |
Enhanced Plating Bath And Additive Chemistries For Cobalt Plating
App 20200048784 - EMESH; Ismail ; et al. | 2020-02-13 |
Enhanced plating bath and additive chemistries for cobalt plating
Grant 10,487,410 - Emesh , et al. Nov | 2019-11-26 |
Apparatus And Methods For Asymmetric Deposition Of Metal On High Aspect Ratio Nanostructures
App 20190287791 - SHEU; BEN-LI ; et al. | 2019-09-19 |
Methods Of Etching A Tungsten Layer
App 20190198392 - MULLICK; AMRITA B. ; et al. | 2019-06-27 |
Methods And Apparatus For Filling A Feature Disposed In A Substrate
App 20180323103 - Shaviv; Roey ; et al. | 2018-11-08 |
Enhanced Plating Bath And Additive Chemistries For Cobalt Plating
App 20170247806 - EMESH; Ismail ; et al. | 2017-08-31 |
Electrochemical plating methods
Grant 9,704,717 - Lam , et al. July 11, 2 | 2017-07-11 |
Electrochemical plating methods
Grant 9,496,145 - Lam , et al. November 15, 2 | 2016-11-15 |
Electrochemical Plating Methods
App 20150357195 - Lam; John W. ; et al. | 2015-12-10 |
Electrochemical Plating Methods
App 20150270133 - Lam; John W. ; et al. | 2015-09-24 |
Method and apparatus for electrochemical planarization of a workpiece
Grant 8,268,135 - Emesh , et al. September 18, 2 | 2012-09-18 |
Filling deep features with conductors in semiconductor manufacturing
Grant 7,625,814 - Emesh , et al. December 1, 2 | 2009-12-01 |
Method And Apparatus For Copper Electroplating
App 20090065365 - Durmus; Ayse ; et al. | 2009-03-12 |
Method And Apparatus For Selective Electrofilling Of Through-wafer Vias
App 20080237048 - Emesh; Ismail ; et al. | 2008-10-02 |
Filling Deep Features With Conductors In Semiconductor Manufacturing
App 20070293040 - Emesh; Ismail ; et al. | 2007-12-20 |
Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface
Grant 7,297,239 - Emesh , et al. November 20, 2 | 2007-11-20 |
Process for conditioning conductive surfaces after electropolishing
App 20070111523 - Emesh; Ismail ; et al. | 2007-05-17 |
Planar plating apparatus
Grant 7,201,828 - Emesh April 10, 2 | 2007-04-10 |
Solution for electrochemical mechanical polishing
App 20070017818 - Emesh; Ismail ; et al. | 2007-01-25 |
Method for polishing copper on a workpiece surface
App 20060255016 - Svirchevski; Julia ; et al. | 2006-11-16 |
Apparatus for electrochemically depositing a material onto a workpiece surface
Grant 7,033,464 - Emesh , et al. April 25, 2 | 2006-04-25 |
Method And Apparatus For Electrochemical Planarization Of A Workpiece
App 20060081460 - Emesh; Ismail ; et al. | 2006-04-20 |
Methods and apparatuses for semiconductor fabrication utilizing through-wafer interconnects
App 20060003566 - Emesh; Ismail | 2006-01-05 |
Method and apparatus for electrochemical planarization of a workpiece
Grant 6,974,525 - Emesh , et al. December 13, 2 | 2005-12-13 |
Lubricant for wafer polishing using a fixed abrasive pad
App 20050121969 - Emesh, Ismail ; et al. | 2005-06-09 |
Apparatus and process for polishing a workpiece
Grant 6,849,547 - Chadda , et al. February 1, 2 | 2005-02-01 |
Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface
App 20050016681 - Emesh, Ismail ; et al. | 2005-01-27 |
System and method for cleaning workpieces
Grant 6,818,604 - Emesh , et al. November 16, 2 | 2004-11-16 |
Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface
Grant 6,802,955 - Emesh , et al. October 12, 2 | 2004-10-12 |
Method And Apparatus For Electrochemical Planarization Of A Workpiece
App 20040195110 - Emesh, Ismail ; et al. | 2004-10-07 |
Planar plating apparatus
App 20040163950 - Emesh, Ismail | 2004-08-26 |
Method and apparatus for electrochemical planarization of a workpiece
Grant 6,736,952 - Emesh , et al. May 18, 2 | 2004-05-18 |
Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface
App 20030132120 - Emesh, Ismail ; et al. | 2003-07-17 |
Method for polishing copper on a workpiece surface
App 20030134576 - Chadda, Saket ; et al. | 2003-07-17 |
Apparatus for electrochemically depositing a material onto a workpiece surface
App 20030127320 - Emesh, Ismail ; et al. | 2003-07-10 |
System and method for cleaning workpieces
App 20030069150 - Emesh, Ismail ; et al. | 2003-04-10 |
Chemical mechanical polishing method and apparatus for removing material from a surface of a workpiece that includes low-k material
App 20020151255 - Dyer, Tim ; et al. | 2002-10-17 |
Method and apparatus for electrochemically depositing a material onto a workpiece surface
App 20020148732 - Emesh, Ismail ; et al. | 2002-10-17 |
Apparatus and process for polishing a workpiece
App 20020146908 - Chadda, Saket ; et al. | 2002-10-10 |
Method and apparatus for electrochemical planarization of a workpiece
App 20020108861 - Emesh, Ismail ; et al. | 2002-08-15 |
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