Emery; Richard D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Emery; Richard D..The latest application filed is for "formation of assemblies with a diamond heat spreader".

Company Profile

0.4.6

Emery; Richard D. - Chandler AZ
Emery; Richard D. - West Hartford CT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fabrication of microelectronic devices Grant 7,952,190 - Emery May 31, 2	2011-05-31
Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices Grant 7,531,429 - Tolchinsky , et al. May 12, 2	2009-05-12
Formation of assemblies with a diamond heat spreader App 20070004216 - Hu; Chuan ; et al.	2007-01-04
Package with integrated wick layer and method for heat removal Grant 7,095,111 - Hu , et al. August 22, 2	2006-08-22
Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices Grant 7,091,108 - Tolchinsky , et al. August 15, 2	2006-08-15
Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices App 20060177994 - Tolchinsky; Peter ; et al.	2006-08-10
Compliant interconnect and method of formation App 20050277281 - Dubin, Valery M. ; et al.	2005-12-15
Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices App 20050059221 - Tolchinsky, Peter ; et al.	2005-03-17
Fabrication of microelectronic devices App 20040262748 - Emery, Richard D.	2004-12-30
Package with integrated wick layer and method for heat removal App 20040188829 - Hu, Chuan ; et al.	2004-09-30

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