Embong; Saat Shukri
Patent Applications and Registrations
Patent applications and USPTO patent grants for Embong; Saat Shukri.The latest application filed is for "packaged integrated circuits and methods to form a packaged integrated circuit".
- Embong; Saat Shukri - Selangor MY
- Embong, Saat Shukri - Kuala Terengganu MY
- Embong; Saat Shukri - Senawang Seremban MY
| Patent | Date |
|---|---|
| Packaged Integrated Circuits And Methods To Form A Packaged Integrated Circuit App 20090042339 - Embong; Saat Shukri ; et al. | 2009-02-12 |
| Method of manufacturing a semiconductor component and semiconductor component thereof App 20020066962 - Embong, Saat Shukri ; et al. | 2002-06-06 |
| Ball-less clip bonding App 20020066963 - Embong, Saat Shukri ; et al. | 2002-06-06 |
| Leadframe, method of manufacturing a leadframe, and method of packaging an electronic component utilizing the leadframe Grant 5,973,388 - Chew , et al. October 26, 1 | 1999-10-26 |
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