Emami; Ramin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Emami; Ramin.The latest application filed is for "wafer cleaning solution for cobalt electroless application".
- Emami; Ramin - San Jose CA
- Emami; Ramin - Sunnyvale CA
| Patent | Date |
|---|---|
| Multi-phase polishing pad Grant 8,133,096 - Emami , et al. March 13, 2 | 2012-03-13 |
| Vibration damping during chemical mechanical polishing Grant 7,497,767 - Chen , et al. March 3, 2 | 2009-03-03 |
| Vibration damping in chemical mechanical polishing system Grant 7,331,847 - Chen , et al. February 19, 2 | 2008-02-19 |
| Wafer cleaning solution for cobalt electroless application Grant 7,273,813 - Emami , et al. September 25, 2 | 2007-09-25 |
| Pretreatment for electroless deposition Grant 7,256,111 - Lopatin , et al. August 14, 2 | 2007-08-14 |
| Planarized copper cleaning for reduced defects Grant 7,104,267 - Emami , et al. September 12, 2 | 2006-09-12 |
| Wafer cleaning solution for cobalt electroless application App 20060174912 - Emami; Ramin ; et al. | 2006-08-10 |
| Vibration damping in chemical mechanical polishing system App 20060148387 - Chen; Hung Chih ; et al. | 2006-07-06 |
| High through-put Cu CMP with significantly reduced erosion and dishing Grant 7,041,599 - Li , et al. May 9, 2 | 2006-05-09 |
| Vibration damping in a chemical mechanical polishing system Grant 7,014,545 - Chen , et al. March 21, 2 | 2006-03-21 |
| Article for polishing semiconductor substrates Grant 7,014,538 - Tietz , et al. March 21, 2 | 2006-03-21 |
| Vibration damping during chemical mechanical polishing App 20050245181 - Chen, Hung Chih ; et al. | 2005-11-03 |
| Multi-phase polishing pad App 20050189235 - Emami, Ramin ; et al. | 2005-09-01 |
| Electroless palladium nitrate activation prior to cobalt-alloy deposition App 20050170650 - Fang, Hongbin ; et al. | 2005-08-04 |
| Pretreatment for electroless deposition App 20050164497 - Lopatin, Sergey ; et al. | 2005-07-28 |
| Electroless cobalt alloy deposition process App 20050161338 - Fang, Hongbin ; et al. | 2005-07-28 |
| Multi-phase polishing pad Grant 6,857,941 - Emami , et al. February 22, 2 | 2005-02-22 |
| Thermal preconditioning fixed abrasive articles Grant 6,832,948 - Birang , et al. December 21, 2 | 2004-12-21 |
| Apparatus and method for edge bead removal Grant 6,786,996 - Emami September 7, 2 | 2004-09-07 |
| Vibration damping in a chemical mechanical polishing system App 20040142646 - Chen, Hung Chih ; et al. | 2004-07-22 |
| Fixed abrasive articles App 20040082288 - Tietz, James V. ; et al. | 2004-04-29 |
| Capillary ring Grant 6,708,701 - Emami March 23, 2 | 2004-03-23 |
| Vibration damping in a chemical mechanical polishing system Grant 6,676,497 - Chen , et al. January 13, 2 | 2004-01-13 |
| Pad cleaning for a CMP system Grant 6,669,538 - Li , et al. December 30, 2 | 2003-12-30 |
| Barrier layer buffing after Cu CMP Grant 6,656,842 - Li , et al. December 2, 2 | 2003-12-02 |
| In-situ pre-clean for electroplating process App 20030201185 - Bajaj, Rajeev ; et al. | 2003-10-30 |
| Electroplating solution composition control App 20030150734 - Bajaj, Rajeev ; et al. | 2003-08-14 |
| Platen for retaining polishing material Grant 6,592,439 - Li , et al. July 15, 2 | 2003-07-15 |
| N2 splash guard for liquid injection on the rotating substrate App 20030070695 - Emami, Ramin ; et al. | 2003-04-17 |
| Apparatus and method for edge bead removal App 20030073309 - Emami, Ramin | 2003-04-17 |
| Capillary ring App 20030070755 - Emami, Ramin | 2003-04-17 |
| Method for preventing surface corrosion in an edge bead removal process App 20030073320 - Emami, Ramin | 2003-04-17 |
| Multi-phase polishing pad App 20020197946 - Emami, Ramin ; et al. | 2002-12-26 |
| Pad Cleaning for a CMP system App 20020090896 - Li, Shijian ; et al. | 2002-07-11 |
| Barrier Layer Buffing After Cu Cmp App 20010055880 - LI, SHIJIAN ; et al. | 2001-12-27 |
| Conditioning fixed abrasive articles Grant 6,322,427 - Li , et al. November 27, 2 | 2001-11-27 |
| Wafer edge scrubber and method Grant 6,299,698 - Emami , et al. October 9, 2 | 2001-10-09 |
| Planarized copper cleaning for reduced defects App 20010015345 - Emami, Ramin ; et al. | 2001-08-23 |
| High through-put copper CMP with reduced erosion and dishing App 20010004538 - Li, Shijian ; et al. | 2001-06-21 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 