loadpatents
Patent applications and USPTO patent grants for Elwin; Matthew P..The latest application filed is for "method for forming a reliable solderable contact".
Patent | Date |
---|---|
Method for forming a reliable solderable contact Grant 9,852,940 - Standing , et al. December 26, 2 | 2017-12-26 |
Solderable contact and passivation for semiconductor dies Grant 9,852,939 - Standing , et al. December 26, 2 | 2017-12-26 |
Solderable Contact and Passivation for Semiconductor Dies App 20130140701 - Standing; Martin ;   et al. | 2013-06-06 |
Method for Forming a Reliable Solderable Contact App 20130143399 - Standing; Martin ;   et al. | 2013-06-06 |
Solderable top metalization and passivation for source mounted package Grant 8,368,211 - Standing , et al. February 5, 2 | 2013-02-05 |
Trench Ld Structure App 20070132016 - Elwin; Matthew P. | 2007-06-14 |
Solderable top metalization and passivation for source mounted package App 20050200011 - Standing, Martin ;   et al. | 2005-09-15 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.