loadpatents
name:-0.0063681602478027
name:-0.0030851364135742
name:-0.00038814544677734
Elwin; Matthew P. Patent Filings

Elwin; Matthew P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Elwin; Matthew P..The latest application filed is for "method for forming a reliable solderable contact".

Company Profile
0.4.4
  • Elwin; Matthew P. - Sketty GB
  • Elwin; Matthew P - Swansea N/A GB
  • Elwin; Matthew P. - West Glamorgan GB
  • Elwin, Matthew P. - Swansea GB
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for forming a reliable solderable contact
Grant 9,852,940 - Standing , et al. December 26, 2
2017-12-26
Solderable contact and passivation for semiconductor dies
Grant 9,852,939 - Standing , et al. December 26, 2
2017-12-26
Solderable Contact and Passivation for Semiconductor Dies
App 20130140701 - Standing; Martin ;   et al.
2013-06-06
Method for Forming a Reliable Solderable Contact
App 20130143399 - Standing; Martin ;   et al.
2013-06-06
Solderable top metalization and passivation for source mounted package
Grant 8,368,211 - Standing , et al. February 5, 2
2013-02-05
Trench Ld Structure
App 20070132016 - Elwin; Matthew P.
2007-06-14
Solderable top metalization and passivation for source mounted package
App 20050200011 - Standing, Martin ;   et al.
2005-09-15

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