| Patent | Date |
|---|
Apparatus For Facilitating Cooling Of An Electronics Rack By Mixing Cooler Air Flow With Re-circulating Air Flow In A Re-circulation Region
App 20080117592 - CAMPBELL; Levi A. ; et al. | 2008-05-22 |
Jet Orifice Plate With Projecting Jet Orifice Structures For Direct Impingement Cooling Apparatus
App 20080062639 - CAMPBELL; Levi A. ; et al. | 2008-03-13 |
Cooling Apparatus And Method Employing Discrete Cold Plates Disposed Between A Module Enclosure And Electronics Components To Be Cooled
App 20080030953 - CAMPBELL; Levi A. ; et al. | 2008-02-07 |
Cooling Apparatuses And Methods Employing Discrete Cold Plates Compliantly Coupled Between A Common Manifold And Electronics Components Of An Assembly To Be Cooled
App 20080026509 - CAMPBELL; Levi A. ; et al. | 2008-01-31 |
Direct Liquid Jet Impingement Module For High Heat Flux Electronics Packages
App 20080002363 - Campbell; Levi A. ; et al. | 2008-01-03 |
Apparatus And Method For Facilitating Cooling An An Electronics Rack By Mixing Cooler Air Flow With Re-circulating Air Flow In A Re-circulation Region
App 20070242432 - CAMPBELL; Levi A. ; et al. | 2007-10-18 |
Redundant assembly for a liquid and air cooled module
App 20070119569 - Campbell; Levi A. ; et al. | 2007-05-31 |
Hybrid liquid-air cooled module
App 20070121295 - Campbell; Levi A. ; et al. | 2007-05-31 |
Multi-element heat exchange assemblies and methods of fabrication for a cooling system
App 20070121294 - Campbell; Levi A. ; et al. | 2007-05-31 |
Heat transfer apparatus, cooled electronic module and methods of fabrication thereof employing thermally conductive composite fins
App 20070121299 - Campbell; Levi A. ; et al. | 2007-05-31 |
Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
App 20070091570 - Campbell; Levi A. ; et al. | 2007-04-26 |
Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled
App 20070091569 - Campbell; Levi A. ; et al. | 2007-04-26 |
Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region
App 20070019380 - Campbell; Levi A. ; et al. | 2007-01-25 |
Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins
App 20060250773 - Campbell; Levi A. ; et al. | 2006-11-09 |
Apparatus and method for facilitating cooling of an electronics rack employing a closed loop heat exchange system
App 20060250770 - Campbell; Levi A. ; et al. | 2006-11-09 |
Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold
App 20060250774 - Campbell; Levi A. ; et al. | 2006-11-09 |
Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack
App 20060232945 - Chu; Richard C. ; et al. | 2006-10-19 |
Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins
App 20060126308 - Campbell; Levi A. ; et al. | 2006-06-15 |
Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths
App 20060126293 - Campbell; Levi A. ; et al. | 2006-06-15 |
Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly
App 20060126296 - Campbell; Levi A. ; et al. | 2006-06-15 |
Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing
App 20060065874 - Campbell; Levi A. ; et al. | 2006-03-30 |
Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack
App 20060042289 - Campbell; Levi A. ; et al. | 2006-03-02 |
Thermally conductive composite interface and methods of fabrication thereof for an electronic assembly
App 20050286234 - Campbell, Levi A. ; et al. | 2005-12-29 |
Thermal dissipation structure and method employing segmented heat sink surface coupling to an electronic component
App 20050281000 - Chu, Richard C. ; et al. | 2005-12-22 |
Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins
App 20050280993 - Campbell, Levi A. ; et al. | 2005-12-22 |
Cooling Assembly For Electronics Drawer Using Passive Fluid Loop And Air-cooled Cover
App 20050248922 - Chu, Richard C. ; et al. | 2005-11-10 |
Air flow system and method for facilitating cooling of stacked electronics components
App 20050237716 - Chu, Richard C. ; et al. | 2005-10-27 |
Condensate removal system and method for facilitating cooling of an electronics system
App 20050217299 - Chu, Richard C. ; et al. | 2005-10-06 |
Finned heat sink
App 20050205240 - Ellsworth, Michael J. JR. ; et al. | 2005-09-22 |
Graphite-based heat sinks and method and apparatus for the manufacture thereof
App 20050167085 - Chu, Richard C. ; et al. | 2005-08-04 |
Graphite-based heat sinks and method and apparatus for the manufacture thereof
App 20050167084 - Chu, Richard C. ; et al. | 2005-08-04 |
Transpiration cooled heat sink and a self contained coolant supply for same
App 20050162833 - Chu, Richard C. ; et al. | 2005-07-28 |
Composite cold plate assembly
App 20050128705 - Chu, Richard C. ; et al. | 2005-06-16 |
Method, system and program product for monitoring rate of volume change of coolant within a cooling system
App 20050126276 - Chu, Richard C. ; et al. | 2005-06-16 |
Method, system and program product for automatically checking coolant loops of a cooling system for a computing environment
App 20050126747 - Chu, Richard C. ; et al. | 2005-06-16 |
Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems
App 20050122684 - Chu, Richard C. ; et al. | 2005-06-09 |
Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems
App 20050122685 - Chu, Richard C. ; et al. | 2005-06-09 |
Thermal spreader using thermal conduits
App 20050078453 - Chu, Richard C. ; et al. | 2005-04-14 |
Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack
App 20050068728 - Chu, Richard C. ; et al. | 2005-03-31 |
Method for combined air and liquid cooling of stacked electronics components
App 20040190247 - Chu, Richard C. ; et al. | 2004-09-30 |
Graphite-based heat sinks and method and apparatus for the manufacture thereof
App 20040134646 - Chu, Richard C. ; et al. | 2004-07-15 |
Method And Apparatus For Combined Air And Liquid Cooling Of Stacked Electronics Components
App 20040100770 - Chu, Richard C. ; et al. | 2004-05-27 |
Frame level partial cooling boost for drawer and/or node level processors
App 20040095721 - Ellsworth, Michael J. JR. ; et al. | 2004-05-20 |
Scalable Coolant Conditioning Unit With Integral Plate Heat Exchanger/expansion Tank And Method Of Use
App 20040050231 - Chu, Richard C. ; et al. | 2004-03-18 |
Electronic device substrate assembly with multilayer impermeable barrier and method of making
App 20040012914 - Chu, Richard C. ; et al. | 2004-01-22 |
Liquid-to-air Cooling System For Portable Electronic And Computer Devices
App 20040001310 - Chu, Richard C. ; et al. | 2004-01-01 |
Finned heat sink
App 20030221816 - Ellsworth, Michael J. JR. ; et al. | 2003-12-04 |
Enhanced air cooling of electronic devices using fluid phase change heat transfer
App 20030205363 - Chu, Richard C. ; et al. | 2003-11-06 |
Interstitial material with enhanced thermal conductance for semiconductor device packaging
App 20030203181 - Ellsworth, Michael J. JR. ; et al. | 2003-10-30 |
Two stage cooling system employing thermoelectric modules
App 20030188538 - Chu, Richard C. ; et al. | 2003-10-09 |
Foil heat sink and a method for fabricating same
App 20030178190 - Ellsworth, Michael J. JR. ; et al. | 2003-09-25 |
Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication
App 20030122245 - Chu, Richard C. ; et al. | 2003-07-03 |
Electronic Device Substrate Assembly With Impermeable Barrier And Method Of Making
App 20030090872 - Chu, Richard C. ; et al. | 2003-05-15 |
Integrated cooling unit
App 20030056939 - Chu, Richard C. ; et al. | 2003-03-27 |
Transpiration cooled heat sink and a self contained coolant supply for same
App 20030056940 - Chu, Richard C. ; et al. | 2003-03-27 |
Thermal spreader using thermal conduits
App 20030060108 - Chu, Richard C. ; et al. | 2003-03-27 |
Conic-sectioned Plate And Jet Nozzle Assembly For Use In Cooling An Electronic Module, And Methods Of Fabrication Thereof
App 20030011987 - Chu, Richard C. ; et al. | 2003-01-16 |
Recuperative environmental conditioning unit
App 20020116933 - Chu, Richard C. ; et al. | 2002-08-29 |
High Bandwidth 3d Memory Packaging Technique
App 20020117741 - Beausoleil, William F. ; et al. | 2002-08-29 |
Capping structure for electronics package undergoing compressive socket actuation
App 20020079117 - Coffin, Jeffrey T. ; et al. | 2002-06-27 |
Cavity Plate And Jet Nozzle Assemblies For Use In Cooling An Electronic Module, And Methods Of Fabrication Thereof
App 20020079088 - Agonafer, Dereje ; et al. | 2002-06-27 |
Electronic module with integrated thermoelectric cooling assembly
App 20020062855 - Chu, Richard C. ; et al. | 2002-05-30 |
Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication
App 20020063327 - Chu, Richard C. ; et al. | 2002-05-30 |
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