Ellerson; James V.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ellerson; James V..The latest application filed is for "interconnection of a carrier substrate and a semiconductor device".
- Ellerson; James V. - Endicott NY
| Patent | Date |
|---|---|
| Interconnection of a carrier substrate and a semiconductor device Grant 5,553,769 - Ellerson , et al. September 10, 1 | 1996-09-10 |
| Method of making an electronic package assembly with protective encapsulant material Grant 5,414,928 - Bonitz , et al. May 16, 1 | 1995-05-16 |
| Apparatus and method for selectively etching a plastic encapsulating material Grant 5,252,179 - Ellerson , et al. October 12, 1 | 1993-10-12 |
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