| Patent | Date |
|---|
Resin composition and article made therefrom
Grant 11,453,771 - Hsieh September 27, 2 | 2022-09-27 |
Resin composition and article made therefrom
Grant 11,434,366 - Hsieh September 6, 2 | 2022-09-06 |
Resin composition and article made therefrom
Grant 11,407,895 - Hsu August 9, 2 | 2022-08-09 |
Resin Composition And Article Made Therefrom
App 20220243046 - HSIEH; Chen-Yu | 2022-08-04 |
Resin composition and article made therefrom
Grant 11,384,239 - Chang July 12, 2 | 2022-07-12 |
Prepolymer, Resin Composition Comprising The Same And Article Made Therefrom
App 20220153900 - HSIEH; Chen-Yu | 2022-05-19 |
Resin Composition And Article Made Therefrom
App 20220081559 - HSU; Ching-Hsien | 2022-03-17 |
Resin composition and article made therefrom
Grant 11,198,788 - Yu , et al. December 14, 2 | 2021-12-14 |
Resin Composition And Article Made Therefrom
App 20210371627 - TAN; Kok-Sheng ; et al. | 2021-12-02 |
Resin Composition And Article Made Therefrom
App 20210371656 - YU; Yi-Fei ; et al. | 2021-12-02 |
Resin Composition And Article Made Therefrom
App 20210371655 - HSU; Ching-Hsien | 2021-12-02 |
Resin composition and article made therefrom
Grant 11,174,385 - Shen , et al. November 16, 2 | 2021-11-16 |
Phosphorus-containing resin composition and article made therefrom
Grant 11,118,055 - Hsieh September 14, 2 | 2021-09-14 |
Resin composition and article made therefrom
Grant 11,111,383 - Chang September 7, 2 | 2021-09-07 |
Resin Composition And Article Made Therefrom
App 20210269637 - CHANG; SHU-HAO | 2021-09-02 |
Vinyl-modified maleimide, composition and article made thereby
Grant 11,066,520 - Hsieh July 20, 2 | 2021-07-20 |
Powder gathering apparatus
Grant 11,052,399 - Shih July 6, 2 | 2021-07-06 |
Resin Composition And Article Made Therefrom
App 20210139691 - ZHANG; Yan ; et al. | 2021-05-13 |
Resin Composition And Article Made Therefrom
App 20210130610 - HSIEH; Chen-Yu | 2021-05-06 |
Resin Composition And Article Made Therefrom
App 20210108075 - CHANG; Shu-Hao | 2021-04-15 |
Prepolymerized Resin, Preparation Method Thereof, Resin Composition Comprising The Same, And Article Made Therefrom
App 20210054151 - CHANG; Shu-Hao | 2021-02-25 |
Resin Composition And Article Made Therefrom
App 20210032463 - SHEN; Chenyu ; et al. | 2021-02-04 |
Prepolymerized resin, preparation method thereof, resin composition comprising the same, and article made therefrom
Grant 10,894,865 - Chang January 19, 2 | 2021-01-19 |
Phosphorus-containing Resin Composition And Article Made Therefrom
App 20200399471 - HSIEH; Chen-Yu | 2020-12-24 |
Phosphorus-containing flame retardant, preparation method thereof, resin composition comprising the phosphorus-containing flame retardant and article made therefrom
Grant 10,865,221 - Chang , et al. December 15, 2 | 2020-12-15 |
Resin composition and article made therefrom
Grant 10,774,210 - Hsu Sept | 2020-09-15 |
Resin Composition And Article Made Therefrom
App 20200263022 - HSU; Ching-Hsien | 2020-08-20 |
Epoxy resin composition and article made therefrom
Grant 10,717,807 - Lin | 2020-07-21 |
Assembly manufacturing method
Grant 10,668,698 - Huang , et al. | 2020-06-02 |
Resin Composition And Article Made Therefrom
App 20200148881 - YU; Yi-Fei ; et al. | 2020-05-14 |
Phosphorus-containing olefin polymer, method for preparing the same, and composition and article comprising the same
Grant 10,618,993 - Hsieh | 2020-04-14 |
Resin Composition And Article Made Therefrom
App 20200109282 - HSU; Ching-Hsien ; et al. | 2020-04-09 |
Resin composition and articles made therefrom
Grant 10,604,640 - Hsieh | 2020-03-31 |
Resin composition and article made therefrom
Grant 10,604,651 - Hsu , et al. | 2020-03-31 |
Assembly Manufacturing Method
App 20200047463 - HUANG; Chia-Hui ; et al. | 2020-02-13 |
Resin composition suitable for rigid-flex board and use thereof
Grant 10,557,033 - Chang Feb | 2020-02-11 |
Vinylbenzyl imide resin, method of preparing vinylbenzyl imide resin, vinylbenzyl imide prepolymer, resin composition and article made therefrom
Grant 10,538,628 - Hsieh Ja | 2020-01-21 |
Assembly arrangement system and assembly manufacturing method
Grant 10,493,727 - Huang , et al. De | 2019-12-03 |
Phosphorus-containing Flame Retardant, Preparation Method Thereof, Resin Composition Comprising The Phosphorus-containing Flame
App 20190300556 - CHANG; Shu-Hao ; et al. | 2019-10-03 |
Prepolymerized Resin, Preparation Method Thereof, Resin Composition Comprising The Same, And Article Made Therefrom
App 20190292326 - CHANG; Shu-Hao | 2019-09-26 |
Powder Gathering Apparatus
App 20190143335 - Shih; Hui-Ting | 2019-05-16 |
Phosphorus-containing polyphenylene oxide resin, its preparation method, method for preparing prepolymer of phosphorus-containing polyphenylene oxide, resin composition and its application
Grant 10,280,260 - Hsieh , et al. | 2019-05-07 |
Vinylbenzyl Imide Resin, Method Of Preparing Vinylbenzyl Imide Resin, Vinylbenzyl Imide Prepolymer, Resin Composition And Article Made Therefrom
App 20190077914 - HSIEH; Chen-Yu | 2019-03-14 |
Resin Composition And Articles Made Therefrom
App 20190016874 - HSIEH; Chen-Yu | 2019-01-17 |
Vinyl-modified Maleimide, Composition And Article Made Thereby
App 20180362715 - HSIEH; Chen-Yu | 2018-12-20 |
Polyphenylene oxide prepolymer, method of making the same, resin composition and product made therefrom
Grant 10,023,672 - Hsieh July 17, 2 | 2018-07-17 |
Assembly Arrangement System And Assembly Manufacturing Method
App 20180170011 - HUANG; Chia-Hui ; et al. | 2018-06-21 |
Phosphorus-containing vinyl polyphenylene ether, resin composition comprising phosphorus-containing vinyl polyphenylene ether and product thereof
Grant 10,000,599 - Hsieh June 19, 2 | 2018-06-19 |
Multi-layer printed circuit boards with dimensional stability
Grant 9,955,569 - Kuo , et al. April 24, 2 | 2018-04-24 |
Phosphorus-containing Vinyl Polyphenylene Ether, Resin Composition Comprising Phosphorus-containing Vinyl Polyphenylene Ether And Product Thereof
App 20180086870 - HSIEH; Chen Yu | 2018-03-29 |
Resin Composition Suitable For Rigid-flex Board And Use Thereof
App 20180086910 - CHANG; Shu-Hao | 2018-03-29 |
Resin composition, copper-clad laminate using the same, and printed circuit board using the same
Grant 9,926,435 - Hsieh March 27, 2 | 2018-03-27 |
Phosphorus-containing Olefin Polymer, Method For Preparing The Same, And Composition And Article Comprising The Same
App 20170342185 - HSIEH; Chen-Yu | 2017-11-30 |
Polyphenylene Oxide Prepolymer, Method Of Making The Same, Resin Composition And Product Made Therefrom
App 20170342178 - HSIEH; Chen-Yu | 2017-11-30 |
Resin Composition, Copper-clad Laminate Using The Same, And Printed Circuit Board Using The Same
App 20170260364 - Hsieh; Chen-Yu | 2017-09-14 |
Phosphorus-containing Polyphenylene Oxide Resin, Its Preparation Method, Method For Preparing Prepolymer Of Phosphorus-containing Polyphenylene Oxide, Resin Composition And Its Application
App 20170088669 - HSIEH; Chen-Yu ; et al. | 2017-03-30 |
Multi-layer Printed Circuit Boards With Dimensional Stability
App 20170079134 - KUO; Ya-Wen ; et al. | 2017-03-16 |
Multi-layer printed circuit boards with dimensional stability
Grant 9,545,018 - Kuo , et al. January 10, 2 | 2017-01-10 |
Modified Oxazine Resin And Use Of A Composition Comprising The Same
App 20160297779 - HSIEH; Chen-Yu ; et al. | 2016-10-13 |
Low dielectric halogen-free resin composition and circuit board using the same
Grant 9,428,646 - Hsieh August 30, 2 | 2016-08-30 |
Halogen-free resin composition and copper clad laminate and printed circuit board using same
Grant 9,422,412 - Yu , et al. August 23, 2 | 2016-08-23 |
Low dielectric resin composition, and resin film, prepreg, printed circuit board made thereby
Grant 9,403,981 - Hsieh August 2, 2 | 2016-08-02 |
Resin composition, copper-clad laminate and printed circuit board for use therewith
Grant 9,394,438 - Yu , et al. July 19, 2 | 2016-07-19 |
Multi-layer printed circuit boards having properties suitable for layer reduction design
Grant 9,392,683 - Chang , et al. July 12, 2 | 2016-07-12 |
Multi-layer Printed Circuit Boards With Dimensional Stability
App 20160128180 - KUO; Ya-Wen ; et al. | 2016-05-05 |
Multi-layer Printed Circuit Boards Suitable For Layer Reduction Design
App 20160120018 - CHANG; Ming-Chuan ; et al. | 2016-04-28 |
Halogen-free resin composition, and copper clad laminate and printed circuit board using same
Grant 9,279,051 - Yu , et al. March 8, 2 | 2016-03-08 |
Low Dielectric Resin Composition, And Resin Film, Prepreg, Printed Circuit Board Made Thereby
App 20150353730 - HSIEH; CHEN YU | 2015-12-10 |
Halogen-free resin composition and its application for copper clad laminate and printed circuit board
Grant 9,005,761 - Lin April 14, 2 | 2015-04-14 |
Phosphazene compound having vinyl group, resin composition containing the same, and circuit board manufactured from the same
Grant 9,000,077 - Hsieh April 7, 2 | 2015-04-07 |
Low Dielectric Halogen-free Resin Composition And Circuit Board Using The Same
App 20140349090 - HSIEH; CHEN-YU | 2014-11-27 |
Phosphazene Compound Having Vinyl Group, Resin Composition Containing The Same, And Circuit Board Manufactured From The Same
App 20140323624 - HSIEH; CHEN-YU | 2014-10-30 |
Resin composition for insulation film
Grant 8,808,862 - Hsieh , et al. August 19, 2 | 2014-08-19 |
Resin Composition, Copper-clad Laminate And Printed Circuit Board For Use Therewith
App 20140178696 - YU; LI-CHIH ; et al. | 2014-06-26 |
Resin Composition For Insulation Film
App 20130245161 - HSIEH; CHEN-YU ; et al. | 2013-09-19 |
Halogen-free Resin Composition, And Copper Clad Laminate And Printed Circuit Board Using Same
App 20130115472 - YU; Li-Chih ; et al. | 2013-05-09 |
Resin composition and prepreg, laminate and circuit board thereof
Grant 8,404,764 - Yu , et al. March 26, 2 | 2013-03-26 |
| 