Elite Electronic Material (Zhongshan) Co., Ltd.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Elite Electronic Material (Zhongshan) Co., Ltd..The latest application filed is for "resin composition and article made therefrom".

Company Profile

14.27.19

Elite Electronic Material (Zhongshan) Co., Ltd. - Zhongshan City CN
ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD. - ZHONGSHAN
Elite Electronic Material (Zhongshan) Co., Ltd - Zhongshan City CN
Elite Electronic Material(Zhongshan) Co., Ltd. - Zhongshan, Guangdong Province N/A CN
Elite Electronic Material (Zhongshan) Co., Ltd. - Zhongshan, Guang Dong Province N/A CN
ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD - ZhongShan, Guangdong Province N/A CN
ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTD - Guangdong Province N/A CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin Composition And Article Made Therefrom App 20220204746 - MING; Yaoqiang ; et al.	2022-06-30
Resin composition and article made therefrom Grant 11,339,287 - Hu , et al. May 24, 2	2022-05-24
Flame Retardant Compound, Method Of Making The Same, Resin Composition And Article Made Therefrom App 20220024952 - HU; Zhilong ; et al.	2022-01-27
Resin composition and article made therefrom Grant 11,168,200 - Hu , et al. November 9, 2	2021-11-09
Resin Composition And Article Made Therefrom App 20210309852 - HU; Zhilong ; et al.	2021-10-07
Resin composition and article made therefrom Grant 11,066,552 - Hu , et al. July 20, 2	2021-07-20
Resin Composition And Article Made Therefrom App 20210171770 - HU; Zhilong ; et al.	2021-06-10
Resin Composition And Article Made Therefrom App 20210108074 - HU; Zhilong ; et al.	2021-04-15
Flame retardant compound, method of preparing the same and use thereof Grant 10,947,364 - Hu , et al. March 16, 2	2021-03-16
Flame retardant compound, method of making the same, resin composition and article made therefrom Grant 10,774,266 - Hu , et al. Sept	2020-09-15
Resin composition and article made therefrom Grant 10,703,905 - Hu , et al.	2020-07-07
Resin Composition And Article Made Therefrom App 20200199329 - HU; Zhilong ; et al.	2020-06-25
Resin composition Grant 10,626,250 - Hu , et al.	2020-04-21
Flame Retardant Compound, Method Of Making The Same, Resin Composition And Article Made Therefrom App 20200095504 - HU; Zhilong ; et al.	2020-03-26
Resin composition and article made therefrom Grant 10,577,497 - Hu , et al.	2020-03-03
Resin Composition And Article Made Therefrom App 20190390055 - HU; Zhilong ; et al.	2019-12-26
Resin composition and article made therefrom Grant 10,426,045 - Xiong , et al. Sept	2019-09-24
Flame Retardant Compound, Method Of Preparing The Same And Use Thereof App 20190085150 - HU; Zhilong ; et al.	2019-03-21
Resin Composition And Article Made Therefrom App 20180371243 - HU; Zhilong ; et al.	2018-12-27
Resin Composition And Article Made Therefrom App 20180324956 - XIONG; Xiang ; et al.	2018-11-08
Resin composition and product made therefrom Grant 10,047,222 - Hu , et al. August 14, 2	2018-08-14
Phosphaphenanthrene-based compound and related preparation method and application Grant 9,896,551 - Hu , et al. February 20, 2	2018-02-20
Resin Composition App 20170166729 - HU; ZHI-LONG ; et al.	2017-06-15
Phosphaphenanthrene-based Compound And Related Preparation Method And Application App 20170022228 - HU; ZHI-LONG ; et al.	2017-01-26
Multi-layer Printed Circuit Boards With Low Warpage App 20160165714 - CHEN; Ocean ; et al.	2016-06-09
Halogen-free resin composition Grant 9,238,733 - Li , et al. January 19, 2	2016-01-19
Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same Grant 9,187,635 - Li , et al. November 17, 2	2015-11-17
Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same Grant 9,185,801 - Li , et al. November 10, 2	2015-11-10
Halogen-free Resin Composition, Copper Clad Laminate Using The Same, And Printed Circuit Board Using The Same App 20140178697 - LI; CHANG-YUAN ; et al.	2014-06-26
Halogen-free Resin Composition, Copper Clad Laminate Using The Same, And Printed Circuit Board Using The Same App 20140178656 - LI; CHANG-YUAN ; et al.	2014-06-26
Low Dielectric Resin Composition, Applicable Copper-clad Laminate And Printed Circuit Board App 20140004324 - HSIEH; CHEN-YU ; et al.	2014-01-02
Halogen-free Resin Composition App 20130316155 - LI; CHANG-YUAN ; et al.	2013-11-28

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