| Patent | Date |
|---|
Semiconductor Module With A First Substrate, A Second Substrate And A Spacer Separating The Substrates From Each Other
App 20220302073 - Becker; Martin ; et al. | 2022-09-22 |
Semiconductor Module Comprising A Semiconductor And Comprising A Shaped Metal Body That Is Electrically Contacted By The Semiconductor
App 20220302072 - Bastos Abibe; Andre ; et al. | 2022-09-22 |
Compact Power Electronics Module With Increased Cooling Surface
App 20220293489 - Behrendt; Stefan ; et al. | 2022-09-15 |
Power Electronics Module With Improved Cooling
App 20220295662 - Behrendt; Stefan ; et al. | 2022-09-15 |
Sintering tool and method for sintering an electronic subassembly
Grant 11,400,514 - Osterwald , et al. August 2, 2 | 2022-08-02 |
Heat Spreading Plate Having Atleast One Cooling Fin Method For Producing A Heat Spreading Plate Having Atleast One Cooling Fin Electronic Module
App 20210210403 - EISELE; Ronald | 2021-07-08 |
Method For Producing A Substrate Plate, Substrate Plate, Method For Producing A Semiconductor Module And Semiconductor Module
App 20210210416 - EISELE; Ronald | 2021-07-08 |
Method For Producing A Circuit Carrier, Circuit Carrier, Method For Producing A Semiconductor Module And Semiconductor Module
App 20210210406 - EISELE; Ronald | 2021-07-08 |
Method For Producing A Heat-spreading Plate, Heat-spreading Plate, Method For Producing A Semiconductor Module And Semiconductor Module
App 20210202350 - EISELE; Ronald | 2021-07-01 |
Process And Device For Low-temperature Pressure Sintering
App 20210104488 - Eisele; Ronald ; et al. | 2021-04-08 |
Sintering Tool And Method For Sintering An Electronic Subassembly
App 20210016353 - Osterwald; Frank ; et al. | 2021-01-21 |
Power module
Grant 10,832,995 - Eisele , et al. November 10, 2 | 2020-11-10 |
Sintering tool and method for sintering an electronic subassembly
Grant 10,814,396 - Osterwald , et al. October 27, 2 | 2020-10-27 |
Sintering tool for the lower die of a sintering device
Grant 10,818,633 - Osterwald , et al. October 27, 2 | 2020-10-27 |
Semi-conductor module with an encapsulating cement mass that covers a semi-conductor component
Grant 10,685,894 - Eisele | 2020-06-16 |
Method for manufacturing semiconductor chips
Grant 10,607,962 - Osterwald , et al. | 2020-03-31 |
Semiconductor module comprising an encapsulating compound that covers at least one semiconductor component
Grant 10,593,608 - Eisele , et al. | 2020-03-17 |
Sintering device
Grant 10,483,229 - Osterwald , et al. Nov | 2019-11-19 |
Power Module
App 20190341341 - Eisele; Ronald ; et al. | 2019-11-07 |
Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module
Grant 10,438,924 - Becker , et al. O | 2019-10-08 |
Power module
Grant 10,403,566 - Eisele , et al. Sep | 2019-09-03 |
Power semiconductor module
Grant 10,381,283 - Osterwald , et al. A | 2019-08-13 |
Electronic sandwich structure with two parts joined together by means of a sintering layer
Grant 10,332,858 - Becker , et al. | 2019-06-25 |
Cooling trough, cooler and power module assembly
Grant 10,306,800 - Wulf-Toke , et al. | 2019-05-28 |
Electronic Sandwich Structure With Two Parts Joined Together By Means Of A Sintering Layer
App 20180331065 - Becker; Martin ; et al. | 2018-11-15 |
Method For Manufacturing A Circuit Carrier
App 20180301354 - Osterwald; Frank ; et al. | 2018-10-18 |
Power semiconductor contact structure and method for the production thereof
Grant 10,079,219 - Becker , et al. September 18, 2 | 2018-09-18 |
Semiconductor Module Comprising An Encapsulating Compound That Covers At Least One Semiconductor Component
App 20180261518 - EISELE; Ronald ; et al. | 2018-09-13 |
Method For Manufacturing Semiconductor Chips
App 20180240776 - Osterwald; Frank ; et al. | 2018-08-23 |
Power Semiconductor Module
App 20180218957 - Osterwald; Frank ; et al. | 2018-08-02 |
Power Module
App 20170365541 - EISELE; Ronald ; et al. | 2017-12-21 |
Power Semiconductor Module With Short-circuit Failure Mode
App 20170338193 - Lutz; Josef ; et al. | 2017-11-23 |
Cooling Trough, Cooler And Power Module Assembly
App 20170332515 - Wulf-Toke; Franke ; et al. | 2017-11-16 |
Power Semiconductor Contact Structure And Method For The Production Thereof
App 20170317049 - Becker; Martin ; et al. | 2017-11-02 |
Method For Cohesively Connecting A First Component Of A Power Semiconductor Module To A Second Component Of A Power Semiconductor Module
App 20170317051 - Becker; Martin ; et al. | 2017-11-02 |
Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
Grant 9,786,627 - Becker , et al. October 10, 2 | 2017-10-10 |
Sintering Device
App 20170229418 - Osterwald; Frank ; et al. | 2017-08-10 |
Process And Device For Low-temperature Pressure Sintering
App 20170229424 - Eisele; Ronald ; et al. | 2017-08-10 |
Sintering Tool For The Lower Die Of A Sintering Device
App 20170221852 - Osterwald; Frank ; et al. | 2017-08-03 |
Sintering Tool And Method For Sintering An Electronic Subassembly
App 20170216920 - Osterwald; Frank ; et al. | 2017-08-03 |
Semiconductor Module Comprising An Encapsulating Compound That Covers At Least One Semiconductor Component
App 20170133291 - EISELE; Ronald ; et al. | 2017-05-11 |
Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
Grant 9,613,929 - Becker , et al. April 4, 2 | 2017-04-04 |
Semi-conductor Module With An Encapsulating Cement Mass That Covers A Semi-conductor Component
App 20160260648 - EISELE; Ronald | 2016-09-08 |
Power Semiconductor Chip With A Metallic Moulded Body For Contacting Thick Wires Or Strips And Method For The Production Thereof
App 20160225738 - Becker; Martin ; et al. | 2016-08-04 |
Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
Grant 9,318,421 - Becker , et al. April 19, 2 | 2016-04-19 |
Method for producing a high-temperature and temperature-change resistant connection between a semiconductor module and a connection partner
Grant 9,287,232 - Kock , et al. March 15, 2 | 2016-03-15 |
Power semiconductor module with method for manufacturing a sintered power semiconductor module
Grant 9,040,338 - Eisele May 26, 2 | 2015-05-26 |
Method For Creating A Connection Between Metallic Moulded Bodies And A Power Semiconductor Which Is Used To Bond To Thick Wires Or Strips
App 20140230989 - Becker; Martin ; et al. | 2014-08-21 |
Power Semiconductor Chip With A Metallic Moulded Body For Contacting Thick Wires Or Strips And Method For The Production Thereof
App 20140225247 - Becker; Martin ; et al. | 2014-08-14 |
Method of manufacturing a semiconductor component
Grant 8,802,564 - Kock , et al. August 12, 2 | 2014-08-12 |
Rigid power module suited for high-voltage applications
Grant 8,546,923 - Eisele , et al. October 1, 2 | 2013-10-01 |
Power Semiconductor Module With Method For Manufacturing A Sintered Power Semiconductor Module
App 20130228890 - Eisele; Ronald | 2013-09-05 |
Fluid cooling system
Grant 8,490,681 - Eisele , et al. July 23, 2 | 2013-07-23 |
Method Of Manufacturing A Semiconductor Component
App 20120282772 - Kock; Mathias ; et al. | 2012-11-08 |
Method for the low-temperature pressure sintering of electronic units to heat sinks
Grant 8,118,211 - Eisele , et al. February 21, 2 | 2012-02-21 |
Method For Producing A High-temperature And Temperature-change Resistant Connection Between A Semiconductor Module And A Connection Partner
App 20120037688 - Kock; Mathias ; et al. | 2012-02-16 |
Method For Manufacturing A Rigid Power Module Suited For High-voltage Applications
App 20110255246 - Eisele; Ronald ; et al. | 2011-10-20 |
Method for manufacturing a rigid power module suited for high-voltage applications
Grant 8,017,446 - Eisele , et al. September 13, 2 | 2011-09-13 |
Method For The Low-temperature Pressure Sintering
App 20110017808 - Eisele; Ronald ; et al. | 2011-01-27 |
Method For Manufacturing A Rigid Power Module Suited For High-voltage Applications
App 20100277873 - Eisele; Ronald ; et al. | 2010-11-04 |
Power semiconductor module and method for cooling a power semiconductor module
Grant 7,529,091 - Olesen , et al. May 5, 2 | 2009-05-05 |
Cooling unit and flow distributing element for use in such unit
Grant 7,339,788 - Olesen , et al. March 4, 2 | 2008-03-04 |
Fluid Cooling System
App 20070215332 - Eisele; Ronald ; et al. | 2007-09-20 |
Power Semiconductor Module and Method for Cooling a Power Semiconductor Module
App 20070210445 - Olesen; Klaus Kristen ; et al. | 2007-09-13 |
Cooling device
Grant 7,040,381 - Eisele , et al. May 9, 2 | 2006-05-09 |
Cooling device
App 20050143000 - Eisele, Ronald ; et al. | 2005-06-30 |
Blank and method for making coupon cards
Grant 6,874,820 - Michlin , et al. April 5, 2 | 2005-04-05 |
Blank and method for making coupon cards
App 20040051301 - Michlin, Irving R. ; et al. | 2004-03-18 |
Device for optoelectronic interface measurement and refractometry in liquids
Grant 5,159,834 - Eisele November 3, 1 | 1992-11-03 |
| 