| Patent | Date |
|---|
Circuit board interconnection structure and circuit board interconnection method
Grant 10,080,298 - Eifuku , et al. September 18, 2 | 2018-09-18 |
Electric component mounting method
Grant 10,034,389 - Eifuku July 24, 2 | 2018-07-24 |
Manufacturing method of electronic component, electronic component, and manufacturing apparatus of electronic component
Grant 9,949,380 - Eifuku , et al. April 17, 2 | 2018-04-17 |
Electrode joining method, production method of electrode joined structure
Grant 9,839,143 - Motomura , et al. December 5, 2 | 2017-12-05 |
Component-mounted structure
Grant 9,756,728 - Sakai , et al. September 5, 2 | 2017-09-05 |
Manufacturing Method Of Electronic Component, Electronic Component, And Manufacturing Apparatus Of Electronic Component
App 20160255716 - EIFUKU; Hideki ; et al. | 2016-09-01 |
Component-mounted Structure
App 20150208509 - Sakai; Tadahiko ; et al. | 2015-07-23 |
Electronic Component Mounting Method And Electronic Component Mounting Line
App 20150121692 - Eifuku; Hideki | 2015-05-07 |
Connecting method of electronic component
Grant 9,015,932 - Sakai , et al. April 28, 2 | 2015-04-28 |
Electrode Joining Method, Production Method Of Electrode Joined Structure, And Production System Of Electrode Joined Structure
App 20150047185 - Motomura; Koji ; et al. | 2015-02-19 |
Circuit Board Interconnection Structure And Circuit Board Interconnection Method
App 20140318837 - EIFUKU; Hideki ; et al. | 2014-10-30 |
Substrate backing device and substrate thermocompression-bonding device
Grant 8,851,138 - Maruo , et al. October 7, 2 | 2014-10-07 |
Electronic component mounting system and electronic component mounting method
Grant 8,817,487 - Motomura , et al. August 26, 2 | 2014-08-26 |
Electronic component mounting system and electronic component mounting method
Grant 8,434,665 - Motomura , et al. May 7, 2 | 2013-05-07 |
Substrate Receiving Device And Substrate Thermocompression-bonding Device
App 20120234496 - Maruo; Hiroki ; et al. | 2012-09-20 |
Components joining method and components joining structure
Grant 8,188,605 - Sakai , et al. May 29, 2 | 2012-05-29 |
Electronic component soldering structure and electronic component soldering method
Grant 8,148,253 - Ozono , et al. April 3, 2 | 2012-04-03 |
Electronic Component Mounting System And Electronic Component Mounting Method
App 20120014084 - Motomura; Koji ; et al. | 2012-01-19 |
Electronic Component Mounting System And Electronic Component Mounting Method
App 20120012645 - Motomura; Koji ; et al. | 2012-01-19 |
Components Joining Method And Components Joining Structure
App 20110284265 - Sakai; Tadahiko ; et al. | 2011-11-24 |
Electronic components mounting adhesive and electronic components mounting structure
Grant 8,034,447 - Sakai , et al. October 11, 2 | 2011-10-11 |
Electronic component mounting method
Grant 8,025,205 - Sakai , et al. September 27, 2 | 2011-09-27 |
Components joining method and components joining structure
Grant 8,018,074 - Sakai , et al. September 13, 2 | 2011-09-13 |
Electric components connecting method
Grant 7,886,432 - Sakai , et al. February 15, 2 | 2011-02-15 |
Method For Manufacturing Electronic Component Module
App 20100327044 - Sakai; Tadahiko ; et al. | 2010-12-30 |
Method for manufacturing electronic parts module
Grant 7,845,074 - Motomura , et al. December 7, 2 | 2010-12-07 |
Method for manufacturing electronic parts module
Grant 7,841,081 - Motomura , et al. November 30, 2 | 2010-11-30 |
Electronic component mounting method
Grant 7,797,822 - Sakai , et al. September 21, 2 | 2010-09-21 |
Method of mounting electronic components
Grant 7,793,413 - Sakai , et al. September 14, 2 | 2010-09-14 |
Connecting Method Of Electronic Component
App 20100018048 - Sakai; Tadahiko ; et al. | 2010-01-28 |
Electronic Components Mounting Adhesive And Electronic Components Mounting Structure
App 20090291314 - Sakai; Tadahiko ; et al. | 2009-11-26 |
Electronic Component Mounting Method
App 20090288767 - Sakai; Tadahiko ; et al. | 2009-11-26 |
Method For Manufacturing Electronic Parts Module
App 20090260230 - Motomura; Koji ; et al. | 2009-10-22 |
Method For Manufacturing Electronic Parts Module
App 20090260229 - Motomura; Koji ; et al. | 2009-10-22 |
Electric Components Connecting Method
App 20090229123 - Sakai; Tadahiko ; et al. | 2009-09-17 |
Method Of Mounting Electronic Components
App 20090205203 - Sakai; Tadahiko ; et al. | 2009-08-20 |
Electronic Components Mounting Adhesive, Manufacturing Method Of An Electronic Components Mounting Adhesive, Electronic Components Mounted Structure, And Manufacturing Method Of An Electronic Components Mounted Structure
App 20090161328 - Sakai; Tadahiko ; et al. | 2009-06-25 |
Electronic Component Thermo-compression Tool, And Electronic Component Mounting Apparatus And Mounting Method
App 20090126188 - Sakai; Tadahiko ; et al. | 2009-05-21 |
Electronic Component Soldering Structure And Electronic Component Soldering Method
App 20090075025 - Ozono; Mitsuru ; et al. | 2009-03-19 |
Components Joining Method And Components Joining Structure
App 20090047534 - Sakai; Tadahiko ; et al. | 2009-02-19 |
Method of mounting bumped electronic components
Grant 6,209,196 - Ozono , et al. April 3, 2 | 2001-04-03 |
Method of soldering bumped work by partially penetrating the oxide film covering the solder bumps
Grant 6,179,198 - Eifuku , et al. January 30, 2 | 2001-01-30 |
Electronic parts mounting method
Grant 6,000,127 - Eifuku , et al. December 14, 1 | 1999-12-14 |
Mounting structure of electronic component having bumps
Grant 5,962,925 - Eifuku , et al. October 5, 1 | 1999-10-05 |
Semiconductor chip bonding method
Grant 5,749,510 - Eifuku May 12, 1 | 1998-05-12 |
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