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Patent applications and USPTO patent grants for Eide; Floyd K..The latest application filed is for "stackable layers containing ball grid array packages".
Patent | Date |
---|---|
Stackable layers containing ball grid array packages Grant 6,967,411 - Eide November 22, 2 | 2005-11-22 |
Stackable layers containing ball grid array packages App 20040004286 - Eide, Floyd K. | 2004-01-08 |
Stacking layers containing enclosed IC chips Grant 6,195,268 - Eide February 27, 2 | 2001-02-27 |
IC stack utilizing secondary leadframes Grant 6,028,352 - Eide February 22, 2 | 2000-02-22 |
IC stack utilizing BGA contacts Grant 6,014,316 - Eide January 11, 2 | 2000-01-11 |
Chip stack and method of making same Grant 5,612,570 - Eide , et al. March 18, 1 | 1997-03-18 |
IC chip package having chip attached to and wire bonded within an overlying substrate Grant 5,313,096 - Eide May 17, 1 | 1994-05-17 |
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