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Patent applications and USPTO patent grants for Eickman; Nancy C..The latest application filed is for "electronic component encapsulated with a composition comprising a polymer which is capable of forming an anisotropic melt phase and substantially incapable of further chain growth upon heating".
Patent | Date |
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Electronic component encapsulated with a composition comprising a polymer which is capable of forming an anisotropic melt phase and substantially incapable of further chain growth upon heating Grant 4,720,424 - Eickman , et al. January 19, 1 | 1988-01-19 |
Encapsulation of electronic components Grant 4,719,250 - Eickman , et al. January 12, 1 | 1988-01-12 |
Encapsulation of electronic components with anisotropic thermoplastic polymers Grant 4,632,798 - Eickman , et al. December 30, 1 | 1986-12-30 |
High modulus polyethylene fiber bundles as reinforcement for brittle matrices Grant 4,524,101 - Eickman , et al. June 18, 1 | 1985-06-18 |
High modulus polyethylene fiber bundles as reinforcement for brittle matrices Grant 4,483,727 - Eickman , et al. November 20, 1 | 1984-11-20 |
Thermotropic liquid crystalline polymer blend with reduced surface abrasion Grant 4,458,039 - Eickman July 3, 1 | 1984-07-03 |
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