Eiche; James S.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Eiche; James S..The latest application filed is for "fluid-flow-through cooling of circuit boards".
- Eiche; James S. - Apalachin NY
| Patent | Date |
|---|---|
| Process for installing an insert for fluid-flow-through cooling of circuit boards Grant 10,548,243 - Kaplun , et al. Ja | 2020-01-28 |
| Process for making an apparatus with fluid-flow-through cooling of circuit boards Grant 10,362,713 - Kaplun , et al. | 2019-07-23 |
| Fluid-flow-through Cooling Of Circuit Boards App 20160278241 - Kaplun; Brian W. ; et al. | 2016-09-22 |
| Fluid-flow-through Cooling Of Circuit Boards App 20160278240 - Kaplun; Brian W. ; et al. | 2016-09-22 |
| Fluid-flow-through cooling of circuit boards Grant 9,426,931 - Kaplun , et al. August 23, 2 | 2016-08-23 |
| Fluid-flow-through Cooling Of Circuit Boards App 20150230365 - Kaplun; Brian W. ; et al. | 2015-08-13 |
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