Ehmke; John C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ehmke; John C..The latest application filed is for "mems electrostatic actuator device for rf varactor applications".

Company Profile

0.13.8

Ehmke; John C. - Garland TX
Ehmke; John C. - Dallas TX
Ehmke; John C. - Mesquite TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
MEMS electrostatic actuator device for RF varactor applications Grant 9,966,194 - Gupta , et al. May 8, 2	2018-05-08
Mems Electrostatic Actuator Device For Rf Varactor Applications App 20170098509 - Gupta; Arun ; et al.	2017-04-06
Mems Electrostatic Actuator Device For Rf Varactor Applications App 20160176701 - Gupta; Arun ; et al.	2016-06-23
Hermetically Sealed Mems Device And Its Fabrication App 20140268295 - Ehmke; John C. ; et al.	2014-09-18
Method and apparatus for packaging circuit devices Grant 7,977,208 - Ables , et al. July 12, 2	2011-07-12
Method and Apparatus for Packaging Circuit Devices App 20110097845 - Ables; Billy D. ; et al.	2011-04-28
Method and apparatus for packaging circuit devices Grant 7,867,874 - Ables , et al. January 11, 2	2011-01-11
Method and Apparatus for Packaging Circuit Devices App 20090227068 - Ables; Billy D. ; et al.	2009-09-10
Method and apparatus for packaging circuit devices Grant 7,535,093 - Ables , et al. May 19, 2	2009-05-19
Method for fabricating a lid for a wafer level packaged optical MEMS device Grant 6,856,014 - Ehmke , et al. February 15, 2	2005-02-15
Membrane for micro-electro-mechanical switch, and methods of making and using it Grant 6,803,534 - Chen , et al. October 12, 2	2004-10-12
Method and apparatus for switching high frequency signals Grant 6,700,172 - Ehmke , et al. March 2, 2	2004-03-02
Wafer level interconnection Grant 6,633,079 - Cheever , et al. October 14, 2	2003-10-14
Wafer level interconnection App 20030047799 - Cheever, James L. ; et al.	2003-03-13
Wafer Level Interconnection App 20030001251 - Cheever, James L. ; et al.	2003-01-02
Method and apparatus for switching high frequency signals Grant 6,391,675 - Ehmke , et al. May 21, 2	2002-05-21
Method and apparatus for switching high frequency signals App 20020036304 - Ehmke, John C. ; et al.	2002-03-28
Self-aligned bump bond infrared focal plane array architecture Grant 6,359,290 - Ehmke March 19, 2	2002-03-19
Substrate supported three-dimensional micro-coil Grant 6,147,582 - Goldsmith , et al. November 14, 2	2000-11-14
Self-aligned bump bond infrared focal plane array architecture Grant 5,536,680 - Ehmke July 16, 1	1996-07-16
Infrared focal plane array with integral slot shield using spin-on epoxy and method of making same Grant 5,298,733 - Ehmke , et al. March 29, 1	1994-03-29

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