Eguchi; Yoshitugu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Eguchi; Yoshitugu.The latest application filed is for "copper-foiled laminated sheet for flexible printed circuit board".
- Eguchi; Yoshitugu - Ibaraki JP
| Patent | Date |
|---|---|
| Copper-foiled laminated sheet for flexible printed circuit board Grant 4,806,432 - Eguchi , et al. February 21, 1 | 1989-02-21 |
| Method for the preparation of a foamed body of a vinyl chloride-based resin composition Grant 4,456,572 - Eguchi , et al. June 26, 1 | 1984-06-26 |
| Method for the preparation of a cellular foamed body of a vinyl chloride-based resin Grant 4,402,893 - Kitamura , et al. September 6, 1 | 1983-09-06 |
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