loadpatents
Patent applications and USPTO patent grants for Eguchi; Syuuji.The latest application filed is for "module and method for fabricating the same".
Patent | Date |
---|---|
Module and method for fabricating the same App 20060272150 - Eguchi; Syuuji ;   et al. | 2006-12-07 |
Semiconductor device Grant 6,919,622 - Murakami , et al. July 19, 2 | 2005-07-19 |
Semiconductor device App 20040155323 - Murakami, Gen ;   et al. | 2004-08-12 |
Semiconductor device Grant 6,720,208 - Murakami , et al. April 13, 2 | 2004-04-13 |
Semiconductor device App 20030127712 - Murakami, Gen ;   et al. | 2003-07-10 |
Semiconductor device App 20010008302 - Murakami, Gen ;   et al. | 2001-07-19 |
Semiconductor device having all outer leads extending from one side of a resin member Grant 6,100,580 - Murakami , et al. August 8, 2 | 2000-08-08 |
Semiconductor device Grant 6,081,023 - Murakami , et al. June 27, 2 | 2000-06-27 |
Semiconductor device chip on lead and lead on chip manufacturing Grant 6,069,029 - Murakami , et al. May 30, 2 | 2000-05-30 |
Semiconductor device Grant 5,612,569 - Murakami , et al. March 18, 1 | 1997-03-18 |
Semiconductor device Grant 5,530,286 - Murakami , et al. June 25, 1 | 1996-06-25 |
Semiconductor device Grant 5,358,904 - Murakami , et al. * October 25, 1 | 1994-10-25 |
Semiconductor device Grant 5,068,712 - Murakami , et al. November 26, 1 | 1991-11-26 |
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