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Patent applications and USPTO patent grants for Egli; Andre.The latest application filed is for "electrolytic nickel plating composition and method of electrolytic nickel plating using such a composition".
Patent | Date |
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Electrolytic nickel plating composition and method of electrolytic nickel plating using such a composition Grant 11,396,711 - Egli July 26, 2 | 2022-07-26 |
Electrolytic Nickel Plating Composition And Method Of Electrolytic Nickel Plating Using Such A Composition App 20200299851 - Egli; Andre | 2020-09-24 |
Externally Electroless Method For Producing A Nickel Alloy And Corresponding Electrolyte App 20190136382 - Egli; Andre ;   et al. | 2019-05-09 |
Solid Forms Of (s)-2-methoxy-3--propionic Acid And Of Salts Thereof App 20170281602 - Dreier; Lukas ;   et al. | 2017-10-05 |
Solid Forms Of (s)-2-methoxy-3--propionic Acid And Of Salts Thereof App 20150182505 - Dreier; Lukas ;   et al. | 2015-07-02 |
Anti-displacement hard gold compositions Grant 8,608,931 - Zhang-Beglinger , et al. December 17, 2 | 2013-12-17 |
Tin plating method Grant 8,518,230 - Egli August 27, 2 | 2013-08-27 |
Whisker free tin plated layer Grant 8,491,774 - Egli July 23, 2 | 2013-07-23 |
Gold alloy electrolytes Grant 8,142,637 - Egli , et al. March 27, 2 | 2012-03-27 |
Gold Alloy Electrolytes App 20110290653 - EGLI; Andre ;   et al. | 2011-12-01 |
Anti-displacement Hard Gold Compositions App 20110147220 - Zhang-Beglinger; Wan ;   et al. | 2011-06-23 |
Electroplating bronze Grant 7,780,839 - Egli , et al. August 24, 2 | 2010-08-24 |
Tin plating method Grant 7,695,605 - Whitlaw , et al. April 13, 2 | 2010-04-13 |
Adhesion promotion App 20090196999 - Egli; Andre ;   et al. | 2009-08-06 |
Electroplating bronze App 20090188807 - Egli; Andre ;   et al. | 2009-07-30 |
Gold alloy electrolytes App 20090104463 - Egli; Andre ;   et al. | 2009-04-23 |
Gold alloy electrolytes Grant 7,465,385 - Egli , et al. December 16, 2 | 2008-12-16 |
Tin-silver electrolyte App 20070037005 - Heber; Jochen ;   et al. | 2007-02-15 |
Gold alloy electrolytes App 20060283714 - Egli; Andre ;   et al. | 2006-12-21 |
Tin-silver electrolyte Grant 7,122,108 - Heber , et al. October 17, 2 | 2006-10-17 |
Tin plating method App 20060090819 - Egli; Andre | 2006-05-04 |
Tin-silver electrolyte App 20060027461 - Heber; Jochen ;   et al. | 2006-02-09 |
Tin plating method App 20050249967 - Egli, Andre | 2005-11-10 |
Tin plating method App 20040256239 - Whitlaw, Keith L. ;   et al. | 2004-12-23 |
Formaldehyde-free electroless copper plating process and solution for use in the process App 20040253450 - Seita, Masaru ;   et al. | 2004-12-16 |
Stabilizers for electroless plating solutions and methods of use thereof Grant 6,824,597 - Heber , et al. November 30, 2 | 2004-11-30 |
Metal alloy compositions and plating methods related thereto Grant 6,773,568 - Egli , et al. August 10, 2 | 2004-08-10 |
Tin plating method App 20040118696 - Zhang, Wan ;   et al. | 2004-06-24 |
Metal alloy compositions and plating methods related thereto App 20040086697 - Egli, Andre ;   et al. | 2004-05-06 |
Metal alloy compositions and plating methods related thereto Grant 6,706,418 - Egli , et al. March 16, 2 | 2004-03-16 |
Tin plating method App 20030226758 - Egli, Andre | 2003-12-11 |
Stabilizers for electroless plating solutions and methods of use thereof App 20030127015 - Heber, Jochen ;   et al. | 2003-07-10 |
Tin plating App 20020187364 - Heber, Jochen ;   et al. | 2002-12-12 |
Metal alloy compositions and plating methods related thereto App 20020153260 - Egli, Andre ;   et al. | 2002-10-24 |
Method for the preparation of facial metal tricarbonyl compounds and their use in the labelling of biologically active substrates Grant 6,344,178 - Alberto , et al. February 5, 2 | 2002-02-05 |
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