Egitto; Frank D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Egitto; Frank D..The latest application filed is for "liquid crystal polymer (lcp) surface layer adhesion enhancement".

Company Profile

0.70.62

Egitto; Frank D. - Binghamton NY
Egitto; Frank D. - Binghampton NY
Egitto; Frank D. - Santa Clara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Coreless layer buildup structure with LGA and joining layer Grant 9,351,408 - Markovich , et al. May 24, 2	2016-05-24
Substrate having internal capacitor and method of making same Grant 8,607,445 - Das , et al. December 17, 2	2013-12-17
Electronic package with thermal interposer and method of making same Grant 8,558,374 - Markovich , et al. October 15, 2	2013-10-15
Coreless layer buildup structure Grant 8,541,687 - Markovich , et al. September 24, 2	2013-09-24
Coreless layer buildup structure with LGA Grant 8,536,459 - Markovich , et al. September 17, 2	2013-09-17
Method of forming an electrically conductive printed line Grant 8,499,445 - Das , et al. August 6, 2	2013-08-06
Method of forming multilayer capacitors in a printed circuit substrate Grant 8,501,575 - Das , et al. August 6, 2	2013-08-06
Electronic package including high density interposer and circuitized substrate assembly utilizing same Grant 8,405,229 - Antesberger , et al. March 26, 2	2013-03-26
Liquid Crystal Polymer (lcp) Surface Layer Adhesion Enhancement App 20130033671 - Schadt; Mark ; et al.	2013-02-07
Modular, Detachable Compute Leaf For Use With Computing System App 20120260063 - Markovich; Voya R. ; et al.	2012-10-11
Conductive Metal Nub For Enhanced Electrical Interconnection, And Information Handling System Utilizing Same App 20120243155 - Matienzo; Luis J. ; et al.	2012-09-27
Method Of Forming Multilayer Capacitors In A Printed Circuit Substrate App 20120223047 - Das; Rabindra N. ; et al.	2012-09-06
Method of making high density interposer and electronic package utilizing same Grant 8,245,392 - Antesberger , et al. August 21, 2	2012-08-21
Method of joining a semiconductor device/chip to a printed wiring board Grant 8,240,031 - Markovich , et al. August 14, 2	2012-08-14
Method of making circuitized substrates having film resistors as part thereof Grant 8,240,027 - Egitto , et al. August 14, 2	2012-08-14
Electronic Package With Thermal Interposer And Method Of Making Same App 20120201006 - Markovich; Voya R. ; et al.	2012-08-09
Electronic Package And Method Of Making Same App 20120162928 - Das; Rabindra N. ; et al.	2012-06-28
Coreless Layer Buildup Structure With Lga App 20120160544 - Antesberger; Timothy ; et al.	2012-06-28
Coreless Layer Buildup Structure App 20120160547 - Antesberger; Timothy ; et al.	2012-06-28
High Bandwidth Semiconductor Ball Grid Array Package App 20120112345 - Blackwell; Kim J. ; et al.	2012-05-10
Coreless Layer Buildup Structure With Lga And Joining Layer App 20120031649 - Antesberger; Timothy ; et al.	2012-02-09
High Density Decal And Method For Attaching Same App 20120015532 - Markovich; Voya R. ; et al.	2012-01-19
Method For Via Plating In Electronic Packages Containing Fluoropolymer Dielectric Layers App 20110260299 - Edwards; Robert D. ; et al.	2011-10-27
Multi-layered interconnect structure using liquid crystalline polymer dielectric Grant 7,981,245 - Egitto , et al. July 19, 2	2011-07-19
Electronic package including high density interposer and circuitized substrate assembly utilizing same App 20110127664 - Antesberger; Timothy ; et al.	2011-06-02
Method of making high density interposer and electronic package utilizing same App 20110126408 - Antesberger; Timothy ; et al.	2011-06-02
Capacitive substrate Grant 7,897,877 - Das , et al. March 1, 2	2011-03-01
High speed interposer Grant 7,875,811 - Caletka , et al. January 25, 2	2011-01-25
Method of making multilayered circuitized substrate assembly Grant 7,823,274 - Egitto , et al. November 2, 2	2010-11-02
Capacitive substrate and method of making same Grant 7,803,688 - Das , et al. September 28, 2	2010-09-28
Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same Grant 7,800,916 - Blackwell , et al. September 21, 2	2010-09-21
Multi-layered Interconnect Structure Using Liquid Crystalline Polymer Dielectric App 20100218891 - Egitto; Frank D. ; et al.	2010-09-02
Multi-layered interconnect structure using liquid crystalline polymer dielectric Grant 7,777,136 - Egitto , et al. August 17, 2	2010-08-17
Circuitized substrate with internal cooling structure and electrical assembly utilizing same Grant 7,738,249 - Chan , et al. June 15, 2	2010-06-15
Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same Grant 7,679,005 - Chan , et al. March 16, 2	2010-03-16
High speed interposer Grant 7,629,541 - Caletka , et al. December 8, 2	2009-12-08
Method of making a circuitized substrate Grant 7,596,862 - Egitto , et al. October 6, 2	2009-10-06
Capacitive substrate and method of making same App 20090206051 - Das; Rabindra N. ; et al.	2009-08-20
Method of making circuitized substrates having film resistors as part thereof App 20090178271 - Egitto; Frank D. ; et al.	2009-07-16
Circuitized substrate with internal cooling structure and electrical assembly utilizing same App 20090109624 - Chan; Benson ; et al.	2009-04-30
Method of making an interposer Grant 7,511,518 - Egitto , et al. March 31, 2	2009-03-31
Interposer and test assembly for testing electronic devices Grant 7,501,839 - Chan , et al. March 10, 2	2009-03-10
Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same App 20080244902 - Blackwell; Kim J. ; et al.	2008-10-09
Method of making a circuitized substrate having at least one capacitor therein App 20080248596 - Das; Rabindra N. ; et al.	2008-10-09
Multi-layered Interconnect Structure Using Liquid Crystalline Polymer Dielectric App 20080217050 - Egitto; Frank D. ; et al.	2008-09-11
Multi-layered Interconnect Structure Using Liquid Crystalline Polymer Dielectric App 20080178999 - Egitto; Frank D. ; et al.	2008-07-31
High speed interposer App 20080142258 - Caletka; David V, ; et al.	2008-06-19
Method of making high speed interposer App 20080120835 - Caletka; David V. ; et al.	2008-05-29
Circuitized substrate with sintered paste connections and multilayered substrate assembly having said substrate as part thereof App 20080105457 - Egitto; Frank D. ; et al.	2008-05-08
Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same Grant 7,342,183 - Egitto , et al. March 11, 2	2008-03-11
Circuitized substrate with increased roughness conductive layer as part thereof App 20080054476 - Egitto; Frank D. ; et al.	2008-03-06
Method of making mutilayered circuitized substrate assembly having sintered paste connections Grant 7,334,323 - Egitto , et al. February 26, 2	2008-02-26
Method of making a circuitized substrate Grant 7,325,299 - Egitto , et al. February 5, 2	2008-02-05
Method of making multilayered circuitized substrate assembly App 20080022520 - Egitto; Frank D. ; et al.	2008-01-31
Method of making an interposer App 20080020566 - Egitto; Frank D. ; et al.	2008-01-24
Method Of Making A Circuitized Substrate App 20080014409 - Egitto; Frank D. ; et al.	2008-01-17
High speed interposer App 20070289773 - Caletka; David V. ; et al.	2007-12-20
Structure and method for improved adhesion between two polymer films Grant 7,309,529 - Egitto , et al. December 18, 2	2007-12-18
Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof Grant 7,307,022 - Egitto , et al. December 11, 2	2007-12-11
Capacitive substrate and method of making same App 20070275525 - Das; Rabindra N. ; et al.	2007-11-29
Multi-layered interconnect structure using liquid crystalline polymer dielectric Grant 7,301,108 - Egitto , et al. November 27, 2	2007-11-27
Interposer for use with test apparatus Grant 7,292,055 - Egitto , et al. November 6, 2	2007-11-06
Method Of Making A Circuitized Substrate App 20070102396 - Egitto; Frank D. ; et al.	2007-05-10
Interposer and test assembly for testing electronic devices App 20070075726 - Chan; Benson ; et al.	2007-04-05
Method of making a circuitized substrate Grant 7,185,428 - Egitto , et al. March 6, 2	2007-03-06
Method of making a circuitized substrate with sintered paste connections and multilayered substrate assembly having said substrate as part thereof App 20070006452 - Egitto; Frank D. ; et al.	2007-01-11
Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same App 20070007032 - Egitto; Frank D. ; et al.	2007-01-11
Composite solder transfer moldplate structure and method of making same App 20060289607 - Buchwalter; Stephen L. ; et al.	2006-12-28
Interposer for use with test apparatus App 20060238207 - Egitto; Frank D. ; et al.	2006-10-26
Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same App 20060214010 - Chan; Benson ; et al.	2006-09-28
Electronic package with filled blinds vias Grant 7,084,509 - Egitto , et al. August 1, 2	2006-08-01
Joining member for Z-interconnect in electronic devices without conductive paste Grant 7,083,901 - Egitto , et al. August 1, 2	2006-08-01
Structure and method for improved adhesion between two polymer films Grant 7,067,193 - Egitto , et al. June 27, 2	2006-06-27
Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof App 20060121738 - Egitto; Frank D. ; et al.	2006-06-08
Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same Grant 7,045,897 - Egitto , et al. May 16, 2	2006-05-16
Membrane probe with anchored elements Grant 7,011,531 - Egitto , et al. March 14, 2	2006-03-14
Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same App 20060022310 - Egitto; Frank D. ; et al.	2006-02-02
Method and structure for small pitch z-axis electrical interconnections Grant 6,955,849 - Curcio , et al. October 18, 2	2005-10-18
Method of forming filled blind vias Grant 6,924,224 - Egitto , et al. August 2, 2	2005-08-02
Circuitized substrate and method of making same Grant 6,905,589 - Egitto , et al. June 14, 2	2005-06-14
Membrane probe with anchored elements App 20050121800 - Egitto, Frank D. ; et al.	2005-06-09
Membrane probe with anchored elements Grant 6,881,072 - Egitto , et al. April 19, 2	2005-04-19
Structure and method for improved adhesion between two polymer films App 20050064199 - Egitto, Frank D. ; et al.	2005-03-24
Multi-layered interconnect structure using liquid crystalline polymer dielectric App 20050057908 - Egitto, Frank D. ; et al.	2005-03-17
Method and structure for small pitch z-axis electrical interconnections App 20050008833 - Curcio, Brian E. ; et al.	2005-01-13
Multi-layered interconnect structure using liquid crystalline polymer dielectric Grant 6,826,830 - Egitto , et al. December 7, 2	2004-12-07
Fine line circuitization Grant 6,822,332 - Egitto , et al. November 23, 2	2004-11-23
Method and structure for small pitch z-axis electrical interconnections Grant 6,790,305 - Curcio , et al. September 14, 2	2004-09-14
Circuitized substrate and method of making same App 20040163964 - Egitto, Frank D. ; et al.	2004-08-26
Method for bonding heat sinks to overmolds and device formed thereby Grant 6,770,968 - Egitto , et al. August 3, 2	2004-08-03
Fine line circuitization App 20040130003 - Egitto, Frank D. ; et al.	2004-07-08
Electronic package with filled blind vias App 20040132279 - Egitto, Frank D. ; et al.	2004-07-08
Structure and method for improved adhesion between two polymer films App 20040076839 - Egitto, Frank D. ; et al.	2004-04-22
Method for bonding heat sinks to overmolds and device formed thereby Grant 6,719,871 - Egitto , et al. April 13, 2	2004-04-13
Method and structure for small pitch z-axis electrical interconnections App 20040067347 - Curcio, Brian E. ; et al.	2004-04-08
Electronic package with filled blinds vias App 20040065960 - Egitto, Frank D. ; et al.	2004-04-08
Membrane probe with anchored elements App 20040063352 - Egitto, Frank D. ; et al.	2004-04-01
Joining member for Z-interconnect in electronic devices without conductive paste App 20040063040 - Egitto, Frank D. ; et al.	2004-04-01
Fine line circuitization App 20040056330 - Egitto, Frank D. ; et al.	2004-03-25
Solder ball with chemically and mechanically enhanced surface properties Grant 6,607,613 - Egitto , et al. August 19, 2	2003-08-19
Multi-layered interconnect structure using liquid crystalline polymer dielectric App 20030147227 - Egitto, Frank D. ; et al.	2003-08-07
Method for bonding heat sinks to overmolds and device formed thereby App 20030123229 - Egitto, Frank D. ; et al.	2003-07-03
Fabrication of a metalized blind via App 20030054635 - Egitto, Frank D. ; et al.	2003-03-20
Laser excision of laminate chip carriers Grant 6,509,546 - Egitto , et al. January 21, 2	2003-01-21
Structure and method for improved adhesion between two polymer films App 20020195197 - Egitto, Frank D. ; et al.	2002-12-26
Multilayered laminate App 20020108780 - Blackwell, Kim J. ; et al.	2002-08-15
Method for bonding heat sinks to overmolds and device formed thereby App 20020005245 - Egitto, Frank D. ; et al.	2002-01-17
Method of forming adherent metal components on a polyimide substrate Grant 6,284,329 - Matienzo , et al. September 4, 2	2001-09-04
Solder ball with chemically and mechanically enhanced surface properties App 20010012570 - Egitto, Frank D. ; et al.	2001-08-09
Fluxless joining process for enriched solders Grant 6,250,540 - Egitto , et al. June 26, 2	2001-06-26
Method for bonding heat sinks to overmolds and device formed thereby App 20010001183 - Egitto, Frank D. ; et al.	2001-05-17
Method for bonding heat sinks to overmolds and device formed thereby Grant 6,206,997 - Egitto , et al. March 27, 2	2001-03-27
Method of forming a via in a substrate Grant 6,203,652 - Egitto , et al. March 20, 2	2001-03-20
Method of forming adherent metal components on a polyimide substrate Grant 6,194,076 - Matienzo , et al. February 27, 2	2001-02-27
Method of forming a flip chip assembly Grant 6,074,895 - Dery , et al. June 13, 2	2000-06-13
Design of high density structures with laser etch stop Grant 5,626,771 - Davis , et al. May 6, 1	1997-05-06
Design of high density structures with laser etch stop Grant 5,536,579 - Davis , et al. July 16, 1	1996-07-16
Electronic package including lower water content polyimide film Grant 5,461,203 - Blackwell , et al. October 24, 1	1995-10-24
Removal of excimer laser debris using carbon dioxide laser Grant 5,194,713 - Egitto , et al. March 16, 1	1993-03-16
Enhanced plasma etching Grant 4,985,112 - Egitto , et al. January 15, 1	1991-01-15
Process for removing contaminant Grant 4,654,115 - Egitto , et al. March 31, 1	1987-03-31
Materials and methods for plasma etching of aluminum and aluminum alloys Grant 4,412,885 - Wang , et al. November 1, 1	1983-11-01
Materials and methods for plasma etching of oxides and nitrides of silicon Grant 4,376,672 - Wang , et al. March 15, 1	1983-03-15

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