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Patent applications and USPTO patent grants for Eghan; Abu K..The latest application filed is for "high performance flipchip package that incorporates heat removal with minimal thermal mismatch".
Patent | Date |
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Integrated circuit and method of implementing a contact pad in an integrated circuit Grant 7,701,070 - Li , et al. April 20, 2 | 2010-04-20 |
Semiconductor die with high density offset-inline bond arrangement Grant 7,064,450 - Eghan , et al. June 20, 2 | 2006-06-20 |
High performance flipchip package that incorporates heat removal with minimal thermal mismatch Grant 7,061,102 - Eghan , et al. June 13, 2 | 2006-06-13 |
High performance flipchip package that incorporates heat removal with minimal thermal mismatch App 20020185717 - Eghan, Abu K. ;   et al. | 2002-12-12 |
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