Egawa; Yoshimi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Egawa; Yoshimi.The latest application filed is for "semiconductor package, package-on-package semiconductor device, and manufacturing method thereof".

Company Profile

0.28.21

Egawa; Yoshimi - Tokyo N/A JP
Egawa; Yoshimi - Miyazaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing printed-circuit board Grant 8,500,984 - Egawa , et al. August 6, 2	2013-08-06
Method of manufacturing semiconductor device and the semiconductor device Grant 8,435,839 - Egawa May 7, 2	2013-05-07
Semiconductor package and package-on-package semiconductor device Grant 8,314,492 - Egawa November 20, 2	2012-11-20
Camera module and method of manufacturing camera module Grant 8,202,391 - Egawa June 19, 2	2012-06-19
Semiconductor device having stress relaxation sections Grant 8,143,718 - Egawa March 27, 2	2012-03-27
Method for forming laminated structure and method for manufacturing semiconductor device using the method thereof Grant 8,138,023 - Egawa March 20, 2	2012-03-20
Semiconductor device having a package base with at least one through electrode Grant 7,898,086 - Egawa March 1, 2	2011-03-01
Semiconductor Package, Package-on-package Semiconductor Device, And Manufacturing Method Thereof App 20110024904 - EGAWA; Yoshimi	2011-02-03
Semiconductor package Grant 7,781,880 - Egawa August 24, 2	2010-08-24
Semiconductor package App 20100065953 - Egawa; Yoshimi	2010-03-18
Camera module and method of manufacturing camera module App 20100038017 - Egawa; Yoshimi	2010-02-18
Semiconductor device and fabrication method thereof App 20100025710 - Yamada; Shigeru ; et al.	2010-02-04
Semiconductor package Grant 7,646,086 - Egawa January 12, 2	2010-01-12
Method For Manufacturing Printed-circuit Board App 20090321266 - Egawa; Yoshimi ; et al.	2009-12-31
Method of manufacturing semiconductor device and the semiconductor device App 20090209062 - Egawa; Yoshimi	2009-08-20
Semiconductor device fabricating method Grant 7,560,302 - Egawa July 14, 2	2009-07-14
Method for fabricating semiconductor package Grant 7,413,925 - Egawa August 19, 2	2008-08-19
Semiconductor device and manufacturing method thereof Grant 7,317,244 - Uchida , et al. January 8, 2	2008-01-08
Semiconductor device fabricating method App 20070231966 - Egawa; Yoshimi	2007-10-04
Method for fabricating semiconductor package App 20070184583 - Egawa; Yoshimi	2007-08-09
Multi chip package Grant 7,215,031 - Egawa May 8, 2	2007-05-08
Semiconductor package App 20070075413 - Egawa; Yoshimi	2007-04-05
Fabrication method for stacked multi-chip package Grant 7,179,685 - Egawa February 20, 2	2007-02-20
Method For Forming Laminated Structure And Method For Manufacturing Semiconductor Device Using The Method Thereof App 20060223232 - EGAWA; Yoshimi	2006-10-05
Semiconductor device App 20060220261 - Egawa; Yoshimi	2006-10-05
Through electrode, package base having through electrode, and semiconductor chip having through electrode App 20060202347 - Egawa; Yoshimi	2006-09-14
Multi chip package App 20060097374 - Egawa; Yoshimi	2006-05-11
Semiconductor device Grant 7,002,251 - Egawa February 21, 2	2006-02-21
Method of manufacturing semiconductor device Grant 6,995,038 - Egawa , et al. February 7, 2	2006-02-07
Semiconductor device and manufacturing method thereof Grant 6,870,249 - Egawa March 22, 2	2005-03-22
Semiconductor package with a chip connected to a wiring substrate using bump electrodes and underfilled with sealing resin Grant 6,867,069 - Egawa , et al. March 15, 2	2005-03-15
Semiconductor device App 20050046035 - Egawa, Yoshimi	2005-03-03
Method of manufacturing semiconductor device App 20050026418 - Egawa, Yoshimi ; et al.	2005-02-03
Fabrication method for stacked multi-chip package App 20050006746 - Egawa, Yoshimi	2005-01-13
Stacked multi-chip package, process for fabrication of chip structuring package, and process for wire-bonding Grant 6,777,797 - Egawa August 17, 2	2004-08-17
Semiconductor device and manufacturing method thereof App 20040119162 - Egawa, Yoshimi	2004-06-24
Semiconductor package with a chip connected to a wiring substrate using bump electrodes and underfilled with sealing resin App 20040023438 - Egawa, Yoshimi ; et al.	2004-02-05
Stacked multi-chip package, process for fabrication of chip structuring package, and process for wire-bonding App 20040000723 - Egawa, Yoshimi	2004-01-01
Semiconductor package with a chip connected to a wiring substrate using bump electrodes and underfilled with sealing resin Grant 6,635,963 - Egawa , et al. October 21, 2	2003-10-21
Semiconductor device and manufacturing method thereof App 20030132516 - Uchida, Yasufumi ; et al.	2003-07-17
Method for making semiconductor device App 20020119599 - Egawa, Yoshimi ; et al.	2002-08-29
Methods for making a plurality of flip chip packages with a wafer scale resin sealing step Grant 6,376,278 - Egawa , et al. April 23, 2	2002-04-23
Bond pad for stress releif between a substrate and an external substrate Grant 6,259,163 - Ohuchi , et al. July 10, 2	2001-07-10
Method of manufacturing semiconductor devices having solder bumps with reduced cracks Grant 6,251,704 - Ohuchi , et al. June 26, 2	2001-06-26
Semiconductor device and manufacturing method thereof Grant 6,229,215 - Egawa May 8, 2	2001-05-08
Structure for packaging semiconductor chip Grant 6,130,480 - Ohuchi , et al. October 10, 2	2000-10-10
Method of manufacturing semiconductor device Grant 5,994,168 - Egawa November 30, 1	1999-11-30