| Patent | Date |
|---|
Optical Metrology Models For In-line Film Thickness Measurements
App 20220290974 - Ng; Eric Chin Hong ; et al. | 2022-09-15 |
Autonomous Substrate Processing System
App 20220214662 - Panda; Priyadarshi ; et al. | 2022-07-07 |
Methods And Systems To Measure Properties Of Products On A Moving Blade In Electronic Device Manufacturing Machines
App 20220057323 - Egan; Todd J. ; et al. | 2022-02-24 |
Spectrum shaping devices and techniques for optical characterization applications
Grant 11,226,234 - Zhao , et al. January 18, 2 | 2022-01-18 |
Imaging reflectometer
Grant 11,187,654 - Zhao , et al. November 30, 2 | 2021-11-30 |
In-line Monitoring Of Oled Layer Thickness And Dopant Concentration
App 20210226182 - Tung; Yeishin ; et al. | 2021-07-22 |
Spectrum Shaping Devices And Techniques For Optical Characterization Applications
App 20210223102 - Zhao; Guoheng ; et al. | 2021-07-22 |
Real-time Detection Of Particulate Matter During Deposition Chamber Manufacturing
App 20210005436 - Vaez-Iravani; Mehdi ; et al. | 2021-01-07 |
Imaging Reflectometer
App 20200355609 - Zhao; Guoheng ; et al. | 2020-11-12 |
Imaging reflectometer
Grant 10,816,464 - Zhao , et al. October 27, 2 | 2020-10-27 |
Apparatus, systems, and methods for temperature control of substrates using embedded fiber optics and epoxy optical diffusers
Grant 10,736,182 - Busche , et al. | 2020-08-04 |
Imaging Reflectometer
App 20200232916 - Zhao; Guoheng ; et al. | 2020-07-23 |
Temperature control for additive manufacturing
Grant 10,710,307 - Ishikawa , et al. | 2020-07-14 |
Methods, Apparatuses And Systems For Conductive Film Layer Thickness Measurements
App 20190390949 - WU; KAI ; et al. | 2019-12-26 |
Electroplating tool with feedback of metal thickness distribution and correction
Grant 10,260,855 - Egan , et al. | 2019-04-16 |
Fast and continuous eddy-current metrology of a conductive film
Grant 10,234,261 - Budiarto , et al. | 2019-03-19 |
Temperature Control For Additive Manufacturing
App 20190047226 - Ishikawa; David Masayuki ; et al. | 2019-02-14 |
Non-Contact Sheet Resistance Measurement of Barrier and/or Seed Layers Prior to Electroplating
App 20170226655 - Ravid; Abraham ; et al. | 2017-08-10 |
Non-contact sheet resistance measurement of barrier and/or seed layers prior to electroplating
Grant 9,631,919 - Ravid , et al. April 25, 2 | 2017-04-25 |
Acoustically-monitored semiconductor substrate processing systems and methods
Grant 9,429,247 - Subrahmanyam , et al. August 30, 2 | 2016-08-30 |
Apparatus and method for optical calibration of wafer placement by a robot
Grant 9,405,287 - Ravid , et al. August 2, 2 | 2016-08-02 |
Film measurement
Grant 9,335,151 - Budiarto , et al. May 10, 2 | 2016-05-10 |
Apparatus, Systems, And Methods For Temperature Control Of Substrates Using Embedded Fiber Optics And Epoxy Optical Diffusers
App 20160007412 - Busche; Matthew ; et al. | 2016-01-07 |
Hybrid laser and plasma etch wafer dicing using substrate carrier
Grant 9,218,992 - Singh , et al. December 22, 2 | 2015-12-22 |
Fast And Continuous Eddy-current Metrology Of A Conductive Film
App 20140367266 - Budiarto; Edward J. ; et al. | 2014-12-18 |
Electroplating Tool With Feedback Of Metal Thickness Distribution And Correction
App 20140367267 - Egan; Todd J. ; et al. | 2014-12-18 |
Non-contact Sheet Resistance Measurement Of Barrier And/or Seed Layers Prior To Electroplating
App 20140367265 - Ravid; Abraham ; et al. | 2014-12-18 |
Hybrid laser and plasma etch wafer dicing using substrate carrier
Grant 8,912,077 - Singh , et al. December 16, 2 | 2014-12-16 |
Acoustically-monitored Semiconductor Substrate Processing Systems And Methods
App 20140260624 - Subrahmanyam; Kommisetti ; et al. | 2014-09-18 |
Hybrid Laser And Plasma Etch Wafer Dicing Using Substrate Carrier
App 20140144585 - Singh; Saravjeet ; et al. | 2014-05-29 |
Film Measurement
App 20140117982 - BUDIARTO; Edward W. ; et al. | 2014-05-01 |
Hybrid Laser And Plasma Etch Wafer Dicing Using Substrate Carrier
App 20120322239 - Singh; Saravjeet ; et al. | 2012-12-20 |
Die-to-robot alignment for die-to-substrate bonding
Grant 8,123,881 - Cox , et al. February 28, 2 | 2012-02-28 |
Dual-mode robot systems and methods for electronic device manufacturing
Grant 8,078,304 - Rice , et al. December 13, 2 | 2011-12-13 |
Spectrographic metrology of patterned wafers
Grant 7,969,568 - Holden , et al. June 28, 2 | 2011-06-28 |
Spectrographic Metrology Of Patterned Wafers
App 20100103411 - HOLDEN; JAMES Matthew ; et al. | 2010-04-29 |
Die-to-robot Alignment For Die-to-substrate Bonding
App 20090126851 - Cox; Damon K. ; et al. | 2009-05-21 |
Three Dimensional Packaging With Wafer-level Bonding And Chip-level Repair
App 20090130821 - Cox; Damon K. ; et al. | 2009-05-21 |
Dual-mode Robot Systems And Methods For Electronic Device Manufacturing
App 20090024241 - Rice; Michael R. ; et al. | 2009-01-22 |
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