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Individualized low parasitic power distribution lines deposited over active integrated circuits Grant 7,514,292 - Efland , et al. April 7, 2 | 2009-04-07 |
Robust DEMOS transistors and method for making the same Grant 7,514,329 - Pendharkar , et al. April 7, 2 | 2009-04-07 |
N-channel LDMOS with buried P-type region to prevent parasitic bipolar effects Grant 7,268,045 - Hower , et al. September 11, 2 | 2007-09-11 |
Robust DEMOS transistors and method for making the same Grant 7,238,986 - Pendharkar , et al. July 3, 2 | 2007-07-03 |
Individualized Low Parasitic Power Distribution Lines Deposited Over Active Integrated Circuits App 20070122944 - Efland; Taylor R. ;   et al. | 2007-05-31 |
Premature breakdown in submicron device geometries Grant 7,195,965 - Lin , et al. March 27, 2 | 2007-03-27 |
Individualized low parasitic power distribution lines deposited over active integrated circuits Grant 7,135,759 - Efland , et al. November 14, 2 | 2006-11-14 |
Circuit method integrating the power distribution functions of the circuits and leadframes into the chip surface Grant 7,060,607 - Efland June 13, 2 | 2006-06-13 |
Robust DEMOS transistors and method for making the same App 20060113592 - Pendharkar; Sameer ;   et al. | 2006-06-01 |
Integrated power circuits with distributed bonding and current flow Grant 7,045,903 - Efland , et al. May 16, 2 | 2006-05-16 |
Circuit structure integrating the power distribution functions of circuits and leadframes into the chip surface Grant 6,972,484 - Efland December 6, 2 | 2005-12-06 |
N-channel LDMOS with buried P-type region to prevent parasitic bipolar effects App 20050255655 - Hower, Philip L. ;   et al. | 2005-11-17 |
Robust DEMOS transistors and method for making the same App 20050253191 - Pendharkar, Sameer ;   et al. | 2005-11-17 |
Circuit structure integrating the power distribution functions of circuits and leadframes into the chip surface App 20050248027 - Efland, Taylor R. | 2005-11-10 |
N-channel LDMOS with buried p-type region to prevent parasitic bipolar effects Grant 6,958,515 - Hower , et al. October 25, 2 | 2005-10-25 |
Low cost fabrication method for high voltage, high drain current MOS transistor Grant 6,930,005 - Efland , et al. August 16, 2 | 2005-08-16 |
Low leakage power transistor and method of forming Grant 6,908,859 - Pendharkar , et al. June 21, 2 | 2005-06-21 |
Low cost fabrication method for high voltage, high drain current MOS transistor App 20050118753 - Efland, Taylor R. ;   et al. | 2005-06-02 |
MOS transistors having higher drain current without reduced breakdown voltage Grant 6,873,021 - Mitros , et al. March 29, 2 | 2005-03-29 |
Line self protecting multiple output power IC architecture Grant 6,784,493 - Efland , et al. August 31, 2 | 2004-08-31 |
Thermally enhanced semiconductor chip having integrated bonds over active circuits Grant 6,784,539 - Efland August 31, 2 | 2004-08-31 |
Array of transistors with low voltage collector protection Grant 6,770,935 - Efland , et al. August 3, 2 | 2004-08-03 |
Tank-isolated-drain-extended power device Grant 6,753,575 - Efland , et al. June 22, 2 | 2004-06-22 |
Method of fabricating a drain isolated LDMOS device Grant 6,729,886 - Efland , et al. May 4, 2 | 2004-05-04 |
Premature breakdown in submicron device geometries App 20040079991 - Lin, John ;   et al. | 2004-04-29 |
Distributed power device with dual function minority carrier reduction Grant 6,710,427 - Efland , et al. March 23, 2 | 2004-03-23 |
Method of fabricating integrated system on a chip protection circuit Grant 6,709,900 - Efland , et al. March 23, 2 | 2004-03-23 |
Integrated circuit with bonding layer over active circuitry Grant 6,683,380 - Efland , et al. January 27, 2 | 2004-01-27 |
Methods and devices for optimized digital and analog CMOS transistor performance in deep submicron technology Grant 6,680,226 - Efland , et al. January 20, 2 | 2004-01-20 |
Thermally enhanced semiconductor chip having integrated bonds over active circuits App 20040004282 - Efland, Taylor R. | 2004-01-08 |
Method of fabricating a drain isolated LDMOS device App 20030228737 - Efland, Taylor R. ;   et al. | 2003-12-11 |
In line self protecting multiple output power IC architecture App 20030228729 - Efland, Taylor R. ;   et al. | 2003-12-11 |
Method of forming a distributed power device with low voltage collector protection App 20030228730 - Efland, Taylor R. ;   et al. | 2003-12-11 |
Integrated System On A Chip Protection Circuit App 20030228721 - Efland, Taylor R. ;   et al. | 2003-12-11 |
Tank-isolated-drain-extended power device App 20030228732 - Efland, Taylor R. ;   et al. | 2003-12-11 |
Method Of Building A Distributed Power Device With Dual Function Minority Carrier Reduction App 20030227070 - Efland, Taylor R. ;   et al. | 2003-12-11 |
Thermally enhanced semiconductor chip having integrated bonds over active circuits Grant 6,597,065 - Efland July 22, 2 | 2003-07-22 |
Low leakage power transistor and method of forming App 20030073313 - Pendharkar, Sameer P. ;   et al. | 2003-04-17 |
Integrated circuit with bonding layer over active circuitry App 20030036256 - Efland, Taylor R. ;   et al. | 2003-02-20 |
Methods and devices for optimized digital and analog CMOS transistor performance in deep submicron technology App 20030032231 - Efland, Taylor R. ;   et al. | 2003-02-13 |
Methods and devices for optimized digital and analog CMOS transistor performance in deep submicron technology Grant 6,468,849 - Efland , et al. October 22, 2 | 2002-10-22 |
LDMOS with improved safe operating area App 20020109184 - Hower, Philip L. ;   et al. | 2002-08-15 |
LDMOS power device with oversized dwell Grant 6,424,005 - Tsai , et al. July 23, 2 | 2002-07-23 |
Individualized low parasitic power distribution lines deposited over active integrated circuits App 20020084516 - Efland, Taylor R. ;   et al. | 2002-07-04 |
Method To Partially Or Completely Suppress Pocket Implant In Selective Circuit Elements With No Additional Mask In A Cmos Flow Where Separate Masking Steps Are Used For The Drain Extension Implants For The Low Voltage And High Voltage Transistors Grant 6,413,824 - Chatterjee , et al. July 2, 2 | 2002-07-02 |
High side and low side guard rings for lowest parasitic performance in an H-bridge configuration App 20020053685 - Pendharkar, Sameer ;   et al. | 2002-05-09 |
Circuit structure integrating the power distribution functions of circuits and leadframes into the chip surface App 20020043712 - Efland, Taylor R. | 2002-04-18 |
Method for LDMOS transistor with thick copper interconnect Grant 6,372,586 - Efland , et al. April 16, 2 | 2002-04-16 |
Integrated power circuits with distributed bonding and current flow App 20020011674 - Efland, Taylor R. ;   et al. | 2002-01-31 |
Ldmos Device With Self-aligned Resurf Region And Method Of Fabrication App 20010053581 - MOSHER, DAN M. ;   et al. | 2001-12-20 |
Integrated circuit diode, and method for fabricating same Grant 6,274,918 - Tsai , et al. August 14, 2 | 2001-08-14 |
Heat spreader Grant 6,236,098 - Efland , et al. May 22, 2 | 2001-05-22 |
Resurf LDMOS device with deep drain region Grant 6,211,552 - Efland , et al. April 3, 2 | 2001-04-03 |
Sensing of current in a synchronous-buck power stage Grant 6,160,388 - Skelton , et al. December 12, 2 | 2000-12-12 |
Plastic encapsulation for integrated circuits having plated copper top surface level interconnect Grant 6,140,702 - Efland , et al. October 31, 2 | 2000-10-31 |
Plastic encapsulation for integrated circuits having plated copper top surface level interconnect Grant 6,140,150 - Efland , et al. October 31, 2 | 2000-10-31 |
Method of forming improved thick plated copper interconnect and associated auxiliary metal interconnect Grant 6,025,275 - Efland , et al. February 15, 2 | 2000-02-15 |
Thick plated interconnect and associated auxillary interconnect Grant 6,020,640 - Efland , et al. February 1, 2 | 2000-02-01 |
Multiple transistor integrated circuit with thick copper interconnect Grant 5,859,456 - Efland , et al. January 12, 1 | 1999-01-12 |
Optimized power output clamping structure Grant 5,812,006 - Teggatz , et al. September 22, 1 | 1998-09-22 |
Method for current ballasting and busing over active device area using a multi-level conductor process Grant 5,801,091 - Efland , et al. September 1, 1 | 1998-09-01 |
CMOS power device and method of construction and layout Grant 5,744,843 - Efland , et al. April 28, 1 | 1998-04-28 |
Medium voltage LDMOS device and method of fabrication Grant 5,736,766 - Efland , et al. April 7, 1 | 1998-04-07 |
Method of making a multiple transistor integrated circuit with thick copper interconnect Grant 5,728,594 - Efland , et al. March 17, 1 | 1998-03-17 |
Device having current ballasting and busing over active area using a multi-level conductor process Grant 5,665,991 - Efland , et al. September 9, 1 | 1997-09-09 |
Windowed and segmented linear geometry source cell for power DMOS processes Grant 5,585,657 - Efland , et al. December 17, 1 | 1996-12-17 |
ESD protection structure using LDMOS diodes with thick copper interconnect Grant 5,468,984 - Efland , et al. November 21, 1 | 1995-11-21 |
Resurf lateral double diffused insulated gate field effect transistor Grant 5,406,110 - Kwon , et al. April 11, 1 | 1995-04-11 |
Lateral double diffused insulated gate field effect transistor fabrication process Grant 5,306,652 - Kwon , et al. April 26, 1 | 1994-04-26 |
Process for manufacturing a DMOS transistor Grant 5,182,222 - Malhi , et al. January 26, 1 | 1993-01-26 |
Integrated power DMOS circuit with protection diode Grant 5,119,162 - Todd , et al. June 2, 1 | 1992-06-02 |