| Patent | Date |
|---|
Semiconductor wafer probing system including pressure sensing and control unit
Grant 9,702,930 - Edwards , et al. July 11, 2 | 2017-07-11 |
Interconnect structure with enhanced reliability
Grant 9,673,089 - Bonilla , et al. June 6, 2 | 2017-06-06 |
Pressure Sensing And Control For Semiconductor Wafer Probing
App 20160216321 - Edwards; Robert D. ; et al. | 2016-07-28 |
Pressure sensing and control for semiconductor wafer probing
Grant 9,354,252 - Edwards , et al. May 31, 2 | 2016-05-31 |
Reliable back-side-metal structure
Grant 9,059,111 - Edwards , et al. June 16, 2 | 2015-06-16 |
Pressure Sensing And Control For Semiconductor Wafer Probing
App 20150145544 - Edwards; Robert D. ; et al. | 2015-05-28 |
Interconnect Structure With Enhanced Reliability
App 20150056806 - Bonilla; Griselda ; et al. | 2015-02-26 |
Pressure sensing and control for semiconductor wafer probing
Grant 8,963,567 - Edwards , et al. February 24, 2 | 2015-02-24 |
Interconnect structure with enhanced reliability
Grant 8,912,658 - Filippi , et al. December 16, 2 | 2014-12-16 |
Reliable Back-side-metal Structure
App 20140306322 - Edwards; Robert D. ; et al. | 2014-10-16 |
Pressure Sensing And Control For Semiconductor Wafer Probing
App 20130106455 - Edwards; Robert D. ; et al. | 2013-05-02 |
Interconnect Structure With Enhanced Reliability
App 20120104610 - Filippi; Ronald ; et al. | 2012-05-03 |
Method for prediction of premature dielectric breakdown in a semiconductor
Grant 8,053,257 - Chanda , et al. November 8, 2 | 2011-11-08 |
Method For Via Plating In Electronic Packages Containing Fluoropolymer Dielectric Layers
App 20110260299 - Edwards; Robert D. ; et al. | 2011-10-27 |
Apparatus for accurate and efficient quality and reliability evaluation of micro electromechanical systems
Grant 7,602,265 - Deligianni , et al. October 13, 2 | 2009-10-13 |
Method For Prediction Of Premature Dielectric Breakdown In A Semiconductor
App 20080174334 - Chanda; Kaushik ; et al. | 2008-07-24 |
Composite flakes and methods for making and using the same
Grant 7,223,476 - Edwards , et al. May 29, 2 | 2007-05-29 |
Apparatus For Accurate And Efficient Quality And Reliability Evaluation Of Micro Electromechanical Systems
App 20070090902 - Deligianni; Hariklia ; et al. | 2007-04-26 |
Plating method for circuitized substrates
Grant 7,169,313 - Card , et al. January 30, 2 | 2007-01-30 |
Method For Prediction Of Premature Dielectric Breakdown In A Semiconductor
App 20060281338 - Chanda; Kaushik ; et al. | 2006-12-14 |
Plating method for circuitized substrates
App 20060255009 - Card; Norman A. ; et al. | 2006-11-16 |
Composite flakes and methods for making and using the same
App 20050277704 - Edwards, Robert D. ; et al. | 2005-12-15 |
Method of making printed circuit board with electroplated conductive through holes and board resulting therefrom
App 20050157475 - Edwards, Robert D. | 2005-07-21 |
Process of enclosing via for improved reliability in dual damascene interconnects
Grant 6,383,920 - Wang , et al. May 7, 2 | 2002-05-07 |
Direct electroplating of through holes
Grant 4,969,979 - Appelt , et al. November 13, 1 | 1990-11-13 |
Automatic soil sampling machine
Grant 4,869,115 - Edwards , et al. September 26, 1 | 1989-09-26 |
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