| Patent | Date |
|---|
High Density Pixelated Led And Devices And Methods Thereof
App 20220271017 - Edmond; John ; et al. | 2022-08-25 |
High density pixelated LED and devices and methods thereof
Grant 11,387,221 - Edmond , et al. July 12, 2 | 2022-07-12 |
High density pixelated LED and devices and methods thereof
Grant 11,342,313 - Edmond , et al. May 24, 2 | 2022-05-24 |
Laser-assisted Method For Parting Crystalline Material
App 20220126395 - Donofrio; Matthew ; et al. | 2022-04-28 |
Laser-assisted method for parting crystalline material
Grant 11,219,966 - Donofrio , et al. January 11, 2 | 2022-01-11 |
Carrier-assisted Method For Parting Crystalline Material Along Laser Damage Region
App 20210225652 - Donofrio; Matthew ; et al. | 2021-07-22 |
Silicon carbide wafers with relaxed positive bow and related methods
Grant 11,034,056 - Bubel , et al. June 15, 2 | 2021-06-15 |
Silicon Carbide Wafers With Relaxed Positive Bow And Related Methods
App 20210170632 - Bubel; Simon ; et al. | 2021-06-10 |
Carrier-assisted method for parting crystalline material along laser damage region
Grant 11,024,501 - Donofrio , et al. June 1, 2 | 2021-06-01 |
High Density Pixelated Led And Devices And Methods Thereof
App 20210074687 - Edmond; John ; et al. | 2021-03-11 |
High density pixelated LED and devices and methods thereof
Grant 10,910,352 - Edmond , et al. February 2, 2 | 2021-02-02 |
Silicon Carbide Wafers With Relaxed Positive Bow And Related Methods
App 20200361121 - Bubel; Simon ; et al. | 2020-11-19 |
Laser-assisted Method For Parting Crystalline Material
App 20200316724 - Donofrio; Matthew ; et al. | 2020-10-08 |
Carrier-assisted Method For Parting Crystalline Material Along Laser Damage Region
App 20200211850 - Donofrio; Matthew ; et al. | 2020-07-02 |
Silicon carbide wafers with relaxed positive bow and related methods
Grant 10,611,052 - Bubel , et al. | 2020-04-07 |
Laser-assisted method for parting crystalline material
Grant 10,576,585 - Donofrio , et al. | 2020-03-03 |
Laser-assisted method for parting crystalline material
Grant 10,562,130 - Donofrio , et al. Feb | 2020-02-18 |
High density pixelated LED and devices and methods thereof
Grant 10,529,696 - Edmond , et al. J | 2020-01-07 |
Laser-assisted method for parting crystalline material
Grant 10421158 - | 2019-09-24 |
High Density Pixelated Led And Devices And Methods Thereof
App 20190273070 - Edmond; John ; et al. | 2019-09-05 |
Aerosolized disinfectant assembly
Grant 10,377,557 - Edmond A | 2019-08-13 |
High density pixelated LED and devices and methods thereof
Grant 10,312,224 - Edmond , et al. | 2019-06-04 |
High Density Pixelated Led And Devices And Methods Thereof
App 20170294418 - Edmond; John ; et al. | 2017-10-12 |
High Density Pixelated Led And Devices And Methods Thereof
App 20170294417 - Edmond; John ; et al. | 2017-10-12 |
Localized annealing of metal-silicon carbide ohmic contacts and devices so formed
Grant 9,608,166 - Slater, Jr. , et al. March 28, 2 | 2017-03-28 |
Substrate removal process for high light extraction LEDs
Grant 9,559,252 - Edmond January 31, 2 | 2017-01-31 |
Methods of forming optical conversion material caps
Grant 9,444,024 - Donofrio , et al. September 13, 2 | 2016-09-13 |
Wafer level phosphor coating method and devices fabricated utilizing method
Grant 9,159,888 - Chitnis , et al. October 13, 2 | 2015-10-13 |
Emission tuning methods and devices fabricated utilizing methods
Grant 8,877,524 - Chitnis , et al. November 4, 2 | 2014-11-04 |
LED package with increased feature sizes
Grant 8,866,169 - Emerson , et al. October 21, 2 | 2014-10-21 |
Semiconductor Light Emitting Device Packages and Methods
App 20140256072 - Loh; Ban P. ; et al. | 2014-09-11 |
Semiconductor light emitting device packages and methods
Grant 8,791,491 - Loh , et al. July 29, 2 | 2014-07-29 |
Light emitting devices having current reducing structures
Grant 8,704,240 - Emerson , et al. April 22, 2 | 2014-04-22 |
Light Emitting Devices Having Current Reducing Structures
App 20130292639 - Emerson; David Todd ; et al. | 2013-11-07 |
Light emitting diode with improved light extraction
Grant 8,575,633 - Donofrio , et al. November 5, 2 | 2013-11-05 |
Optoelectronic Structures with High Lumens Per Wafer
App 20130146904 - Edmond; John ; et al. | 2013-06-13 |
Methods Of Forming Optical Conversion Material Caps And Light Emitting Devices Including Pre-formed Optical Conversion Material Caps
App 20130119418 - Donofrio; Matthew ; et al. | 2013-05-16 |
Methods of forming light emitting devices having current reducing structures
Grant 8,436,368 - Emerson , et al. May 7, 2 | 2013-05-07 |
Localized Annealing Of Metal-silicon Carbide Ohmic Contacts And Devices So Formed
App 20120164765 - Slater, JR.; David B. ; et al. | 2012-06-28 |
Methods Of Forming Light Emitting Devices Having Current Reducing Structures
App 20120153343 - Emerson; David Todd ; et al. | 2012-06-21 |
Methods of forming light emitting devices having current reducing structures
Grant 8,163,577 - Emerson , et al. April 24, 2 | 2012-04-24 |
Semiconductor Light Emitting Device Packages and Methods
App 20110284903 - Loh; Ban P. ; et al. | 2011-11-24 |
Light emitting diode with a dielectric mirror having a lateral configuration
Grant 8,017,963 - Donofrio , et al. September 13, 2 | 2011-09-13 |
Substrate Removal Process For High Light Extraction Leds
App 20110198626 - EDMOND; JOHN | 2011-08-18 |
Semiconductor light emitting device packages and methods
Grant 7,964,888 - Loh , et al. June 21, 2 | 2011-06-21 |
Substrate removal process for high light extraction LEDs
Grant 7,932,111 - Edmond April 26, 2 | 2011-04-26 |
Methods Of Forming Light Emitting Devices Having Current Reducing Structures
App 20110008922 - Emerson; David Todd ; et al. | 2011-01-13 |
Led Package With Increased Feature Sizes
App 20100252851 - Emerson; David ; et al. | 2010-10-07 |
Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structures
Grant 7,795,623 - Emerson , et al. September 14, 2 | 2010-09-14 |
Light Emitting Diode with a Dielectric Mirror having a Lateral Configuration
App 20100140637 - Donofrio; Matthew ; et al. | 2010-06-10 |
Light Emitting Diode with Improved Light Extraction
App 20100140636 - Donofrio; Matthew ; et al. | 2010-06-10 |
LED chip
Grant D616,839 - Edmond , et al. June 1, 2 | 2010-06-01 |
Light emitting devices suitable for flip-chip bonding
Grant 7,608,860 - Slater, Jr. , et al. October 27, 2 | 2009-10-27 |
Emission Tuning Methods And Devices Fabricated Utilizing Methods
App 20090261358 - CHITNIS; ASHAY ; et al. | 2009-10-22 |
LED chip
Grant D602,450 - Edmond , et al. October 20, 2 | 2009-10-20 |
LED chip
Grant D593,968 - Edmond , et al. June 9, 2 | 2009-06-09 |
LED chip
Grant D583,338 - Edmond , et al. December 23, 2 | 2008-12-23 |
LED chip
Grant D582,865 - Edmond , et al. December 16, 2 | 2008-12-16 |
LED chip
Grant D582,866 - Edmond , et al. December 16, 2 | 2008-12-16 |
Semiconductor light emitting device packages and methods
App 20080258168 - Loh; Ban P. ; et al. | 2008-10-23 |
Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structures
App 20080217635 - Emerson; David Todd ; et al. | 2008-09-11 |
Wafer level phosphor coating method and devices fabricated utilizing method
App 20080179611 - Chitnis; Ashay ; et al. | 2008-07-31 |
Light emitting devices with self aligned ohmic contacts
Grant 7,402,837 - Slater, Jr. , et al. July 22, 2 | 2008-07-22 |
LED chip
Grant D566,057 - Edmond , et al. April 8, 2 | 2008-04-08 |
LED chip
Grant D566,056 - Edmond , et al. April 8, 2 | 2008-04-08 |
Bonding of light emitting diodes having shaped substrates
Grant 7,341,175 - Slater, Jr. , et al. March 11, 2 | 2008-03-11 |
Method for fabricating group-III nitride devices and devices fabricated using method
Grant 7,332,365 - Nakamura , et al. February 19, 2 | 2008-02-19 |
Light Emitting Devices Suitable For Flip-chip Bonding
App 20070241360 - Slater, Jr.; David B. ; et al. | 2007-10-18 |
Flip-chip bonding of light emitting devices
Grant 7,259,033 - Slater, Jr. , et al. August 21, 2 | 2007-08-21 |
Light Emitting Devices Having Current Blocking Structures And Methods Of Fabricating Light Emitting Devices Having Current Blocking Structures
App 20070145392 - Haberern; Kevin ; et al. | 2007-06-28 |
Substrate removal process for high light extraction LEDs
App 20060189098 - Edmond; John | 2006-08-24 |
Method for fabricating group-III nitride devices and devices fabricated using method
App 20060049411 - Nakamura; Shuji ; et al. | 2006-03-09 |
Light emitting devices with self aligned ohmic contact and methods of fabricating same
App 20050145869 - Slater, David Beardsley JR. ; et al. | 2005-07-07 |
Localized annealing of metal-silicon carbide ohmic contacts and devices so formed
App 20050104072 - Slater, David B. JR. ; et al. | 2005-05-19 |
Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding
Grant 6,888,167 - Slater, Jr. , et al. May 3, 2 | 2005-05-03 |
Flip-chip bonding of light emitting devices
App 20050017256 - Slater, David B. JR. ; et al. | 2005-01-27 |
Bonding Of Light Emitting Diodes Having Shaped Substrates
App 20040200882 - Slater, David B. JR. ; et al. | 2004-10-14 |
Collets for bonding of light emitting diodes having shaped substrates
Grant 6,747,298 - Slater, Jr. , et al. June 8, 2 | 2004-06-08 |
Bonding of light emitting diodes having shaped substrates and collets for bonding of light emitting diodes having shaped substrates
App 20030042507 - Slater, David B. JR. ; et al. | 2003-03-06 |
Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding
App 20030045015 - Slater, David B. JR. ; et al. | 2003-03-06 |
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