Eder; James E.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Eder; James E..The latest application filed is for "systems and methods for bonding semiconductor elements".
- Eder; James E. - Doylestown PA
| Patent | Date |
|---|---|
| Systems and methods for bonding semiconductor elements Grant 11,295,996 - Eder , et al. April 5, 2 | 2022-04-05 |
| Systems And Methods For Bonding Semiconductor Elements App 20200273759 - Eder; James E. ; et al. | 2020-08-27 |
| Systems and methods for bonding semiconductor elements Grant 10,692,783 - Eder , et al. | 2020-06-23 |
| Systems And Methods For Bonding Semiconductor Elements App 20180090395 - Eder; James E. ; et al. | 2018-03-29 |
| Systems And Methods For Bonding Semiconductor Elements App 20150155211 - Eder; James E. ; et al. | 2015-06-04 |
| Autonomously operated buoys with power generation and power usage control Grant 8,723,355 - Eder , et al. May 13, 2 | 2014-05-13 |
| Multi-mode wave energy converter devices and systems Grant 8,723,351 - Stewart , et al. May 13, 2 | 2014-05-13 |
| Wave energy converter and power take off system Grant 8,487,459 - Eder , et al. July 16, 2 | 2013-07-16 |
| Multi-mode Wave Energy Converter Devices And Systems App 20120248775 - STEWART; DAVID B. ; et al. | 2012-10-04 |
| Autonomously operated buoys with power generation and power usage control App 20120248865 - Eder; James E. ; et al. | 2012-10-04 |
| Wave energy converter and power take off system App 20110084488 - Eder; James E. ; et al. | 2011-04-14 |
| Low-profile capillary for wire bonding Grant 7,500,591 - Eder , et al. March 10, 2 | 2009-03-10 |
| Low-profile Capillary For Wire Bonding App 20080210740 - Eder; James E. ; et al. | 2008-09-04 |
| Low-profile capillary for wire bonding Grant 7,320,425 - Eder , et al. January 22, 2 | 2008-01-22 |
| Integrated flexure mount scheme for dynamic isolation of ultrasonic transducers Grant 7,137,543 - DeAngelis , et al. November 21, 2 | 2006-11-21 |
| Wire tensioner for a wire bonder App 20060091181 - Eder; James E. ; et al. | 2006-05-04 |
| Integrated flexure mount scheme for dynamic isolation of ultrasonic transducers App 20060022016 - DeAngelis; Dominick A. ; et al. | 2006-02-02 |
| Low-profile capillary for wire bonding App 20050252950 - Eder, James E. ; et al. | 2005-11-17 |
| Wire bonding apparatus having actuated flame-off wand App 20050199677 - Sadler, Richard ; et al. | 2005-09-15 |
| Die attach process using cornercube offset tool Grant 6,778,274 - Beatson , et al. August 17, 2 | 2004-08-17 |
| Indirect imaging method for a bonding tool Grant 6,712,257 - Beatson , et al. March 30, 2 | 2004-03-30 |
| Die attach system and process using cornercube offset tool Grant 6,705,507 - Beatson , et al. March 16, 2 | 2004-03-16 |
| Die attach process using cornercube offset tool App 20040012784 - Beatson, David T. ; et al. | 2004-01-22 |
| Indirect imaging system for a bonding tool Grant 6,641,026 - Beatson , et al. November 4, 2 | 2003-11-04 |
| Indirect imaging method for a bonding tool App 20030019911 - Beatson, David T. ; et al. | 2003-01-30 |
| Die attach system and process using cornercube offset tool App 20030019909 - Beatson, David T. ; et al. | 2003-01-30 |
| Indirect imaging system for a bonding tool App 20030019908 - Beatson, David T. ; et al. | 2003-01-30 |
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