Ecton; Jeremy

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ecton; Jeremy.The latest application filed is for "multi-step isotropic etch patterning of thick copper layers for forming high aspect-ratio conductors".

Company Profile

14.3.22

Ecton; Jeremy - Gilbert TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
In-situ component fabrication of a highly efficient, high inductance air core inductor integrated into substrate packages Grant 11,404,389 - Ecton , et al. August 2, 2	2022-08-02
Multi-step Isotropic Etch Patterning Of Thick Copper Layers For Forming High Aspect-ratio Conductors App 20220199427 - Fadayomi; Oladeji ; et al.	2022-06-23
Faraday Rotator Interconnect As A Through-via Configuration In A Patch Architecture App 20220187548 - MARIN; Brandon C. ; et al.	2022-06-16
High Bandwidth Optical Interconnection Architectures App 20220155539 - PIETAMBARAM; Srinivas V. ; et al.	2022-05-19
Selectively Roughened Copper Architectures For Low Insertion Loss Conductive Features App 20220102259 - Kong; Jieying ; et al.	2022-03-31
Airgap Structures For High Speed Signal Integrity App 20210375746 - Feng; Hongxia ; et al.	2021-12-02
Structural Elements For Application Specific Electronic Device Packages App 20210296225 - Nad; Suddhasattwa ; et al.	2021-09-23
Method, Device And System For Providing Etched Metallization Structures App 20210289638 - Ecton; Jeremy ; et al.	2021-09-16
Conductive Route Patterning For Electronic Substrates App 20210280463 - Ecton; Jeremy ; et al.	2021-09-09
Method, device and system for providing etched metallization structures Grant 11,116,084 - Ecton , et al. September 7, 2	2021-09-07
Capacitors With Nanoislands On Conductive Plates App 20210066447 - PIETAMBARAM; Srinivas ; et al.	2021-03-04
Sandwich-molded Cores For High-inductance Architectures App 20210014972 - MARIN; Brandon C. ; et al.	2021-01-14
Integrated Circuit Package Assemblies With High-aspect Ratio Metallization Features App 20200411317 - Ecton; Jeremy ; et al.	2020-12-31
Embedded Thin Film Capacitor With Nanocube Film And Process For Forming Such App 20200402720 - MARIN; Brandon C. ; et al.	2020-12-24
Method For Forming Embedded Grounding Planes On Interconnect Layers App 20200328131 - MARIN; Brandon C. ; et al.	2020-10-15
Hybrid Fine Line Spacing Architecture For Bump Pitch Scaling App 20200312665 - NAD; Suddhasattwa ; et al.	2020-10-01
Subtractive Etch Resolution Implementing A Functional Thin Metal Resist App 20200258800 - A1	2020-08-13
Method, Device And System For Providing Etched Metallization Structures App 20200236795 - Ecton; Jeremy ; et al.	2020-07-23
Microelectronic Assemblies Having Conductive Structures With Different Thicknesses App 20200205279 - Ecton; Jeremy ; et al.	2020-06-25
In-situ Component Fabrication Of A Highly Efficient, High Inductance Air Core Inductor Integrated Into Substrate Packages App 20200105685 - ECTON; Jeremy ; et al.	2020-04-02
Enhanced etch anisotropy using nanoparticles as banking agents in the presence or absence of a magnetic or electrical field Grant 10,515,824 - Ecton , et al. Dec	2019-12-24
Patterning Of Dual Metallization Layers App 20190378789 - Ecton; Jeremy	2019-12-12
Alignment Via-trace Structures App 20190304890 - Ecton; Jeremy ; et al.	2019-10-03
Enhanced Etch Anisotropy Using Nanoparticles As Banking Agents In The Presence Or Absence Of A Magnetic Or Electrical Field App 20190214272 - ECTON; Jeremy ; et al.	2019-07-11

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