Eckstein; Gerald

Patent Applications and Registrations

Patent applications and USPTO patent grants for Eckstein; Gerald.The latest application filed is for "apparatus for energy conversion, in particular a piezoelectric micropower converter".

Company Profile

0.1.12

Eckstein; Gerald - Munchen DE
Eckstein; Gerald - Muenchen DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing connecting device for randomly connecting a number of transmitters and receivers Grant 8,151,444 - Eckstein , et al. April 10, 2	2012-04-10
Apparatus For Energy Conversion, In Particular A Piezoelectric Micropower Converter App 20100301707 - Eckstein; Gerald ; et al.	2010-12-02
Device Comprising A Capacitive Energy Converter That Is Integrated On A Substrate App 20100295413 - Eckstein; Gerald ; et al.	2010-11-25
Device for energy conversion, in particular a piezoelectric micropower converter App 20100259130 - Eckstein; Gerald ; et al.	2010-10-14
Piezoelectric Energy Converter Having A Double Membrane App 20100176694 - Eckstein; Gerald ; et al.	2010-07-15
Chip Module for Installing in Sensor Chip Cards for Fluidic Applications and Method for Producing a Chip Module of This Type App 20100096708 - Eckstein; Gerald	2010-04-22
Device And Method To Extract Material Of A Material Reservoir App 20100076340 - Eckstein; Gerald ; et al.	2010-03-25
Device for Converting Mechanical Energy Into Electrical Energy, and Method for Operating Said Device App 20090284101 - Eckstein; Gerald ; et al.	2009-11-19
Method for Integrating Functional Nanostructures Into Microelectric and Nanoelectric circuits App 20090173527 - Benke; Annegret ; et al.	2009-07-09
Connecting Device for Randomly Connecting a Number of Transmitters and Receivers, Communication Device and Method for Producing Connecting Device App 20080291938 - Eckstein; Gerald ; et al.	2008-11-27
Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure App 20070120273 - Eckstein; Gerald ; et al.	2007-05-31
Electronic assembly and method for producing an electronic assembly App 20070004121 - Eckstein; Gerald ; et al.	2007-01-04
Chip-size package with an integrated passive component App 20050151249 - Eckstein, Gerald ; et al.	2005-07-14

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