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name:-0.0064311027526855
name:-0.0041170120239258
name:-0.00541090965271
Echikawa; Yoshitaka Patent Filings

Echikawa; Yoshitaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Echikawa; Yoshitaka.The latest application filed is for "mountable electronic component and electronic circuit module".

Company Profile
4.3.5
  • Echikawa; Yoshitaka - Kyoto JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Substrate equipped with antenna and antenna module
Grant 11,322,830 - Echikawa , et al. May 3, 2
2022-05-03
Electronic component package and method for manufacturing the same
Grant 11,302,593 - Matsukawa , et al. April 12, 2
2022-04-12
Radio-frequency module
Grant 11,270,922 - Nomura , et al. March 8, 2
2022-03-08
Mountable Electronic Component And Electronic Circuit Module
App 20210265555 - KUSUYAMA; Takafumi ;   et al.
2021-08-26
Radio-frequency Module
App 20200395262 - Nomura; Tadashi ;   et al.
2020-12-17
Substrate Equipped With Antenna And Antenna Module
App 20200350667 - ECHIKAWA; Yoshitaka ;   et al.
2020-11-05
Electronic Component Package And Method For Manufacturing The Same
App 20200343152 - MATSUKAWA; Yoshitaka ;   et al.
2020-10-29
Substrate With Antenna, And Antenna Module
App 20200343618 - ECHIKAWA; Yoshitaka ;   et al.
2020-10-29

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