eChem Solutions Corp.

Patent Applications and Registrations

Patent applications and USPTO patent grants for eChem Solutions Corp..The latest application filed is for "positive photosensitive resin composition for low-temperature process and method for preparing photoresist film".

Company Profile

12.11.33

eChem Solutions Corp. - Taoyuan TW
ECHEM SOLUTIONS CORP. - Taoyuan City TW
eChem Solutions Corp. - TW TW
eChem Solutions Corp. - Longtan TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polyimide Resin Composition, Polyimide Resin Adhesive Layer, Laminate, And Manufacturing Method Of Electronic Component App 20220275205 - Lin; Yung-Yu ; et al.	2022-09-01
Positive Photosensitive Resin Composition For Low-temperature Process And Method For Preparing Photoresist Film App 20220276559 - Chen; Kuan-Ming ; et al.	2022-09-01
Photoresist Composition, Optical Film Thereof, And Preparing Method Of The Optical Film App 20220276556 - Huang; Hao Lun ; et al.	2022-09-01
Photosensitive Resin Composition For Imprinting, Cured Article And Optical Element App 20220221789 - Huang; Chin-Chen ; et al.	2022-07-14
Flexible encapsulating material, process for preparing the same and encapsulating method using the same Grant 11,306,220 - Tang , et al. April 19, 2	2022-04-19
Black Resin Composition, Cured Film, And Black Filter App 20220098398 - Huang; Chin-Chen ; et al.	2022-03-31
White Photosensitive Resin Composition, White Spacer, Light Conversion Layer, And Light-emitting Device App 20210388158 - Liu; Meng-Po ; et al.	2021-12-16
Photosensitive Resin Composition, Spacer, Light Conversion Layer, And Light-emitting Device App 20210382389 - Chen; Ya-Qian ; et al.	2021-12-09
Etchant Composition, Tackifier, Alkaline Solution, Method Of Removing Polyimide And Etching Process App 20210371747 - Chen; Yu-Ning ; et al.	2021-12-02
Resin Composition, Light Conversion Layer And Light Emitting Device App 20210363283 - Lai; Hsiao-Jen ; et al.	2021-11-25
Resin Composition And Filter Element App 20210221946 - Chen; Yu-Wen ; et al.	2021-07-22
Method Of Removing Photoresist, Laminate, Method Of Forming Metallic Pattern, Polyimide Resin And Stripper App 20210223699 - Yang; Tz-Jin ; et al.	2021-07-22
Photosensitive polyimide composition and photoresist film made thereof Grant 11,029,598 - Yang , et al. June 8, 2	2021-06-08
Method Of Forming Patterned Polyimide Layer App 20200319554 - Chang; Ting-Wei ; et al.	2020-10-08
Photosensitive Resin Composition, Optical Film, And Method Of Producing Optical Film App 20200225581 - Hsu; Jui-Yu ; et al.	2020-07-16
Flexible Encapsulating Material, Process For Preparing The Same And Encapsulating Method Using The Same App 20200181445 - Tang; Zong-Hao ; et al.	2020-06-11
Positive Photoresist Composition And Method Of Forming Patterned Polyimide Layer App 20200089114 - Chang; Ting-Wei ; et al.	2020-03-19
Photosensitive Composition, Color Filter And Method For Forming The Color Filter App 20200019055 - Wu; Yi-Sheng ; et al.	2020-01-16
Photosensitive Polyimide Composition and Photoresist Film Made Thereof App 20190243241 - Yang; Tz Jin ; et al.	2019-08-08
Composition and fabricating method thereof, and infrared ray sensor Grant 10,095,107 - Chiu , et al. October 9, 2	2018-10-09
Conductive Composition Solution And Antistatic Film And Panel Display Thereof App 20180210115 - CHEN; HSIN-JEN ; et al.	2018-07-26
Composition And Fabricating Method Thereof, And Infrared Ray Sensor App 20170102610 - CHIU; CHEN WEN ; et al.	2017-04-13
Photosensitive insulated resin composition and method of producing insulated film thereof Grant 9,529,260 - Chang , et al. December 27, 2	2016-12-27
Masking layer formed by applying developable photosensitive resin compositions on panel structure Grant 9,049,790 - Lin , et al. June 2, 2	2015-06-02
Masking Layer Formed By Applying Developable Photosensitive Resin Compositions On Panel Structure App 20150047881 - Lin; Shih-Peng ; et al.	2015-02-19
Photo resist stripper composition Grant 7,456,141 - Hsu , et al. November 25, 2	2008-11-25

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