EBEFORS; Thorbjorn
Patent Applications and Registrations
Patent applications and USPTO patent grants for EBEFORS; Thorbjorn.The latest application filed is for "a device, system and method for generating an acoustic-potential field of ultrasonic waves".
Company Profile
0.37.27
- EBEFORS; Thorbjorn - HUDDINGE SE
- Ebefors; Thorbjorn - Huddings SE
- Ebefors; Thorbjorn - Kallkarrsvagen SE
Patent Activity
| Patent | Date |
|---|---|
| A Device, System And Method For Generating An Acoustic-potential Field Of Ultrasonic Waves App 20210162457 - EBEFORS; Thorbjorn | 2021-06-03 |
| Insulation of micro structures Grant 9,936,918 - Kalvesten , et al. April 10, 2 | 2018-04-10 |
| Thin capping for MEMS devices Grant 9,718,674 - Kalvesten , et al. August 1, 2 | 2017-08-01 |
| Method of making a semiconductor device having a functional capping Grant 9,620,390 - Ebefors , et al. April 11, 2 | 2017-04-11 |
| Method for forming electroless metal through via Grant 9,613,863 - Ebefors , et al. April 4, 2 | 2017-04-04 |
| Thin film capping Grant 9,511,999 - Ebefors , et al. December 6, 2 | 2016-12-06 |
| Electroless metal through silicon via Grant 9,514,985 - Ebefors , et al. December 6, 2 | 2016-12-06 |
| Semiconductor devices with close-packed via structures having in-plane routing and method of making same Grant 9,484,293 - Ebefors , et al. November 1, 2 | 2016-11-01 |
| Via structure and method thereof Grant 9,448,401 - Ebefors , et al. September 20, 2 | 2016-09-20 |
| Thin Capping For Mems Devices App 20160207758 - KALVESTEN; Edvard ; et al. | 2016-07-21 |
| Electroless Metal Through Silicon Via App 20160172241 - EBEFORS; Thorbjorn ; et al. | 2016-06-16 |
| Method of making a semiconductor device having a functional capping Grant 9,362,139 - Ebefors , et al. June 7, 2 | 2016-06-07 |
| Method of providing a via hole and routing structure Grant 9,355,895 - Ebefors , et al. May 31, 2 | 2016-05-31 |
| Methods for making a starting substrate wafer for semiconductor engineering having wafer through connections Grant 9,312,217 - Kalvesten , et al. April 12, 2 | 2016-04-12 |
| Semiconductor Devices With Close-packed Via Structures Having In-plane Routing And Method Of Making Same App 20160035662 - EBEFORS; Thorbjorn ; et al. | 2016-02-04 |
| Semiconductor devices with close-packed via structures having in-plane routing and method of making same Grant 9,240,373 - Ebefors , et al. January 19, 2 | 2016-01-19 |
| CTE matched interposer and method of making Grant 9,224,681 - Ebefors , et al. December 29, 2 | 2015-12-29 |
| Electroless Metal Through Silicon Via App 20150255344 - Ebefors; Thorbjorn ; et al. | 2015-09-10 |
| Cte Matched Interposer And Method Of Making App 20150076677 - Ebefors; Thorbjorn ; et al. | 2015-03-19 |
| Method Of Providing A Via Hole And Routing Structure App 20150054136 - Ebefors; Thorbjorn ; et al. | 2015-02-26 |
| Semiconductor Devices With Close-packed Via Structures Having In-plane Routing And Method Of Making Same App 20150028479 - Ebefors; Thorbjorn ; et al. | 2015-01-29 |
| Insulation Of Micro Structures App 20140378804 - Kalvesten; Edvard ; et al. | 2014-12-25 |
| Thin Film Capping App 20140346657 - Ebefors; Thorbjorn ; et al. | 2014-11-27 |
| Bonding process and bonded structures Grant 8,866,289 - Ebefors , et al. October 21, 2 | 2014-10-21 |
| Via structure and method thereof Grant 8,729,713 - Ebefors , et al. May 20, 2 | 2014-05-20 |
| Bonding process and bonded structures Grant 8,729,685 - Ebefors , et al. May 20, 2 | 2014-05-20 |
| Via Structure And Method Thereof App 20140063580 - Ebefors; Thorbjorn ; et al. | 2014-03-06 |
| Methods for making micro needles and applications thereof Grant 8,637,351 - Kalvesten , et al. January 28, 2 | 2014-01-28 |
| Via structure and method thereof Grant 8,630,033 - Ebefors , et al. January 14, 2 | 2014-01-14 |
| Barrier structure Grant 8,598,676 - Ebefors , et al. December 3, 2 | 2013-12-03 |
| Via structure and method thereof Grant 8,592,981 - Ebefors , et al. November 26, 2 | 2013-11-26 |
| Bonding process and bonded structures Grant 8,485,416 - Ebefors , et al. July 16, 2 | 2013-07-16 |
| Barrier Structure App 20120292736 - Ebefors; Thorbjorn ; et al. | 2012-11-22 |
| Methods for making micro needles and applications thereof Grant 8,308,960 - Kalvesten , et al. November 13, 2 | 2012-11-13 |
| Functional Capping App 20120267773 - Ebefors; Thorbjorn ; et al. | 2012-10-25 |
| Methods for Making Micro Needles and Applications Thereof App 20120126392 - Kalvesten; Edvard ; et al. | 2012-05-24 |
| Novel Bonding Process And Bonded Structures App 20120112335 - EBEFORS; Thorbjorn ; et al. | 2012-05-10 |
| Novel Bonding Process And Bonded Structures App 20120097733 - EBEFORS; Thorbjorn ; et al. | 2012-04-26 |
| Novel Bonding Process And Bonded Structures App 20120076715 - Ebefors; Thorbjorn ; et al. | 2012-03-29 |
| Via Structure And Method Thereof App 20120018852 - Ebefors; Thorbjorn ; et al. | 2012-01-26 |
| Via Structure And Method Thereof App 20120019886 - Ebefors; Thorbjorn ; et al. | 2012-01-26 |
| Via Structure And Method Thereof App 20120018898 - Ebefors; Thorbjorn ; et al. | 2012-01-26 |
| Micropackaging Method And Devices App 20100053922 - Ebefors; Thorbjorn ; et al. | 2010-03-04 |
| Methods For Making Micro Needles And Applications Thereof App 20100006536 - Kalvesten; Edvard ; et al. | 2010-01-14 |
| Trench Isolation For Reduced Cross Talk App 20090302414 - Ebefors; Thorbjorn ; et al. | 2009-12-10 |
| Methods For Making A Starting Substrate Wafer For Semiconductor Engineering Having Wafer Through Connections App 20090195948 - Kalvesten; Edvard ; et al. | 2009-08-06 |
| Electrical connections in substrates Grant 7,560,802 - Kalvesten , et al. July 14, 2 | 2009-07-14 |
| Deflectable microstructure and method of manufacturing the same through bonding of wafers Grant 7,172,911 - Kalvesten , et al. February 6, 2 | 2007-02-06 |
| Electrical connections in substrates App 20070020926 - Kalvesten; Edvard ; et al. | 2007-01-25 |
| Deflectable microstructure and method of manufacturing the same through bonding of wafers App 20050124159 - Kalvesten, Edvard ; et al. | 2005-06-09 |
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