EBARA-UDYLITE CO., LTD.

Patent Applications and Registrations

Patent applications and USPTO patent grants for EBARA-UDYLITE CO., LTD..The latest application filed is for "method for conditioning insulating resin and its use".

Company Profile

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EBARA-UDYLITE CO., LTD. - Tokyo JP
EBARA-UDYLITE CO., LTD. - Taito-ku JP
Ebara-Udylite Co., Ltd. - Taito-ku, Tokyo JP
Ebara-Udylite Co., Ltd. - JP JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Metal-laminated polyimide substrate, and method for production thereof Grant 10,021,789 - Ochi , et al. July 10, 2	2018-07-10
Palladium complex and catalyst-imparting treatment solution using the same Grant 8,354,014 - Kohtoku , et al. January 15, 2	2013-01-15
Method For Conditioning Insulating Resin And Its Use App 20110064954 - Shimizu; Satoru	2011-03-17
Palladium Complex And Catalyst-imparting Treatment Solution Using The Same App 20100047458 - Kohtoku; Makoto ; et al.	2010-02-25
Catalyst Attachment-enhancing Agent App 20090277798 - Nakamura; Hajime ; et al.	2009-11-12
Surface Modification Liquid For Plastic And Method Of Metallizing Plastic Surface Therewith App 20090176022 - Shimizu; Satoru	2009-07-09
Additive For Copper Plating And Process For Producing Electronic Circiut Substrate Therewith App 20080087549 - Ishizuka; Hiroshi ; et al.	2008-04-17
Copper plating bath and plating method for substrate using the copper plating bath Grant 6,800,188 - Hagiwara , et al. October 5, 2	2004-10-05
Via-filling process Grant 6,518,182 - Ishikawa , et al. February 11, 2	2003-02-11
Electroplating apparatus Grant 5,441,619 - Kawachi , et al. August 15, 1	1995-08-15
Electroplating bath solution for zinc alloy and electroplated product using the same Grant 5,248,406 - Kamitani September 28, 1	1993-09-28

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