Eaton; Brad

Patent Applications and Registrations

Patent applications and USPTO patent grants for Eaton; Brad.The latest application filed is for "waste collection and abatement during hybrid additive and subtractive manufacturing".

Company Profile

11.134.146

Eaton; Brad - Menlo Park CA
Eaton; Brad - San Francisco CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate breakthrough treatment Grant 11,355,394 - Lei , et al. June 7, 2	2022-06-07
Waste Collection And Abatement During Hybrid Additive And Subtractive Manufacturing App 20220097190 - Connor; Stephen T. ; et al.	2022-03-31
Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process Grant 11,217,536 - Park , et al. January 4, 2	2022-01-04
Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process Grant 11,158,540 - Li , et al. October 26, 2	2021-10-26
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch App 20210134676 - Lei; Wei-Sheng ; et al.	2021-05-06
Wafer dicing using femtosecond-based laser and plasma etch Grant 10,910,271 - Lei , et al. February 2, 2	2021-02-02
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch App 20200286787 - Lei; Wei-Sheng ; et al.	2020-09-10
Transfer Arm For Film Frame Substrate Handling During Plasma Singulation Of Wafers App 20200258780 - A1	2020-08-13
Wafer dicing using femtosecond-based laser and plasma etch Grant 10,714,390 - Lei , et al.	2020-07-14
Transfer arm for film frame substrate handling during plasma singulation of wafers Grant 10,692,765 - Holden , et al.	2020-06-23
Mitigation of particle contamination for wafer dicing processes Grant 10,661,383 - Lei , et al.	2020-05-26
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch App 20200118880 - Lei; Wei-Sheng ; et al.	2020-04-16
Wafer Dicing Using Hybrid Laser Scribing And Plasma Etch Approach With Intermediate Breakthrough Treatment App 20200091001 - Lei; Wei-Sheng ; et al.	2020-03-19
Wafer dicing using femtosecond-based laser and plasma etch Grant 10,566,238 - Lei , et al. Feb	2020-02-18
Mitigation Of Particle Contamination For Wafer Dicing Processes App 20190291206 - Lei; Wei-Sheng ; et al.	2019-09-26
Mitigation of particle contamination for wafer dicing processes Grant 10,363,629 - Lei , et al.	2019-07-30
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch App 20190088549 - Lei; Wei-Sheng ; et al.	2019-03-21
Wafer dicing using femtosecond-based laser and plasma etch Grant 10,163,713 - Lei , et al. Dec	2018-12-25
Mitigation Of Particle Contamination For Wafer Dicing Processes App 20180345418 - Lei; Wei-Sheng ; et al.	2018-12-06
Light-absorbing Mask For Hybrid Laser Scribing And Plasma Etch Wafer Singulation Process App 20180342422 - Li; Wenguang ; et al.	2018-11-29
Hybrid Wafer Dicing Approach Using A Split Beam Laser Scribing Process And Plasma Etch Process App 20180226355 - PARK; JUNGRAE ; et al.	2018-08-09
Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process Grant 9,972,575 - Park , et al. May 15, 2	2018-05-15
Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process Grant 9,852,997 - Park , et al. December 26, 2	2017-12-26
Etch mask for hybrid laser scribing and plasma etch wafer singulation process Grant 9,793,132 - Li , et al. October 17, 2	2017-10-17
Hybrid Wafer Dicing Approach Using A Rotating Beam Laser Scribing Process And Plasma Etch Process App 20170278801 - Park; Jungrae ; et al.	2017-09-28
Wafer coating Grant 9,768,014 - Park , et al. September 19, 2	2017-09-19
Hybrid Wafer Dicing Approach Using A Split Beam Laser Scribing Process And Plasma Etch Process App 20170256500 - Park; Jungrae ; et al.	2017-09-07
Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch Grant 9,620,379 - Lei , et al. April 11, 2	2017-04-11
UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach Grant 9,601,375 - Lei , et al. March 21, 2	2017-03-21
Water soluble mask formation by dry film lamination Grant 9,583,375 - Lei , et al. February 28, 2	2017-02-28
Etch-resistant Water Soluble Mask For Hybrid Wafer Dicing Using Laser Scribing And Plasma Etch App 20160365283 - Lei; Wei-Sheng ; et al.	2016-12-15
Uv-cure Pre-treatment Of Carrier Film For Wafer Dicing Using Hybrid Laser Scribing And Plasma Etch Approach App 20160315009 - Lei; Wei-Sheng ; et al.	2016-10-27
Method and apparatus for dicing wafers having thick passivation polymer layer Grant 9,460,966 - Lei , et al. October 4, 2	2016-10-04
Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing Grant 9,443,765 - Lei , et al. September 13, 2	2016-09-13
Method of outgassing a mask material deposited over a workpiece in a process tool Grant 9,412,619 - Kumar , et al. August 9, 2	2016-08-09
Hybrid Wafer Dicing Approach Using A Polygon Scanning-based Laser Scribing Process And Plasma Etch Process App 20160197015 - Lei; Wei-Sheng ; et al.	2016-07-07
Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process Grant 9,355,907 - Lei , et al. May 31, 2	2016-05-31
Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process Grant 9,349,648 - Lei , et al. May 24, 2	2016-05-24
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch App 20160141210 - Lei; Wei-Sheng ; et al.	2016-05-19
Dicing wafers having solder bumps on wafer backside Grant 9,343,366 - Lei , et al. May 17, 2	2016-05-17
Transfer Arm For Film Frame Substrate Handling During Plasma Singulation Of Wafers App 20160133519 - Holden; James M. ; et al.	2016-05-12
Hybrid wafer dicing approach using a galvo scanner and linear stage hybrid motion laser scribing process and plasma etch process Grant 9,330,977 - Lei , et al. May 3, 2	2016-05-03
Screen print mask for laser scribe and plasma etch wafer dicing process Grant 9,312,177 - Kumar , et al. April 12, 2	2016-04-12
Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance Grant 9,299,611 - Lei , et al. March 29, 2	2016-03-29
Method and carrier for dicing a wafer Grant 9,299,614 - Holden , et al. March 29, 2	2016-03-29
Hybrid Wafer Dicing Approach Using An Adaptive Optics-controlled Laser Scribing Process And Plasma Etch Process App 20160086851 - Park; Jungrae ; et al.	2016-03-24
Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process Grant 9,281,244 - Park , et al. March 8, 2	2016-03-08
Dicing processes for thin wafers with bumps on wafer backside Grant 9,275,902 - Lei , et al. March 1, 2	2016-03-01
Wafer edge warp suppression for thin wafer supported by tape frame Grant 9,269,604 - Lei , et al. February 23, 2	2016-02-23
Method Of Outgassing A Mask Material Deposited Over A Workpiece In A Process Tool App 20160049313 - KUMAR; PRABHAT ; et al.	2016-02-18
Water soluble mask for substrate dicing by laser and plasma etch Grant 9,263,308 - Lei , et al. February 16, 2	2016-02-16
Multi-layer Mask Including Non-photodefinable Laser Energy Absorbing Layer For Substrate Dicing By Laser And Plasma Etch App 20160035577 - LEI; Wei-Sheng ; et al.	2016-02-04
Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application Grant 9,252,057 - Chowdhury , et al. February 2, 2	2016-02-02
Hybrid Wafer Dicing Approach Using A Rectangular Shaped Two-dimensional Top Hat Laser Beam Profile Or A Linear Shaped One-dimensiional Top Hat Laser Beam Profile Laser Scribing Process And Plasma Etch Process App 20160027697 - Lei; Wei-Sheng ; et al.	2016-01-28
Wafer dicing using femtosecond-based laser and plasma etch Grant 9,245,802 - Lei , et al. January 26, 2	2016-01-26
Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process Grant 9,245,803 - Park , et al. January 26, 2	2016-01-26
Wafer dicing with etch chamber shield ring for film frame wafer applications Grant 9,236,305 - Lei , et al. January 12, 2	2016-01-12
Wafer dicing from wafer backside and front side Grant 9,224,650 - Lei , et al. December 29, 2	2015-12-29
Laser and plasma etch wafer dicing using water-soluble die attach film Grant 9,224,625 - Lei , et al. December 29, 2	2015-12-29
Hybrid laser and plasma etch wafer dicing using substrate carrier Grant 9,218,992 - Singh , et al. December 22, 2	2015-12-22
Maskless hybrid laser scribing and plasma etching wafer dicing process Grant 9,209,084 - Lei , et al. December 8, 2	2015-12-08
Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process Grant 9,196,536 - Park , et al. November 24, 2	2015-11-24
Carrier With Thermally Resistant Film Frame For Supporting Wafer During Singulation App 20150332970 - Lei; Wei-Sheng ; et al.	2015-11-19
Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile Grant 9,177,861 - Park , et al. November 3, 2	2015-11-03
Method of coating water soluble mask for laser scribing and plasma etch Grant 9,177,864 - Lei , et al. November 3, 2	2015-11-03
Wafer Edge Warp Suppression For Thin Wafer Supported By Tape Frame App 20150311107 - Lei; Wei-Sheng ; et al.	2015-10-29
Dicing Tape Protection For Wafer Dicing Using Laser Scribe Process App 20150311118 - Lei; Wei-Sheng ; et al.	2015-10-29
Dicing Wafers Having Solder Bumps On Wafer Backside App 20150303111 - Lei; Wei-Sheng ; et al.	2015-10-22
Method of die singulation using laser ablation and induction of internal defects with a laser Grant 9,165,832 - Papanu , et al. October 20, 2	2015-10-20
Water Soluble Mask Formation By Dry Film Lamination App 20150294892 - Lei; Wei-Sheng ; et al.	2015-10-15
Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach Grant 9,159,624 - Lei , et al. October 13, 2	2015-10-13
Dicing tape protection for wafer dicing using laser scribe process Grant 9,159,621 - Lei , et al. October 13, 2	2015-10-13
Hybrid Wafer Dicing Approach Using Collimated Laser Scribing Process And Plasma Etch App 20150287638 - Park; Jungrae ; et al.	2015-10-08
Dicing Processes For Thin Wafers With Bumps On Wafer Backside App 20150279739 - Lei; Wei-Sheng ; et al.	2015-10-01
Wafer dicing using hybrid laser scribing and plasma etch approach with mask application by vacuum lamination Grant 9,142,459 - Kumar , et al. September 22, 2	2015-09-22
Baking Tool For Improved Wafer Coating Process App 20150255346 - PARK; Jungrae ; et al.	2015-09-10
Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicing Grant 9,130,056 - Holden , et al. September 8, 2	2015-09-08
Baking tool for improved wafer coating process Grant 9,130,030 - Park , et al. September 8, 2	2015-09-08
Hybrid dicing process using a blade and laser Grant 9,130,057 - Kumar , et al. September 8, 2	2015-09-08
Laser and plasma etch wafer dicing using physically-removable mask Grant 9,126,285 - Lei , et al. September 8, 2	2015-09-08
Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch Grant 9,129,904 - Lei , et al. September 8, 2	2015-09-08
Hybrid Wafer Dicing Approach Using Temporally-controlled Laser Scribing Process And Plasma Etch App 20150243559 - Park; Jungrae ; et al.	2015-08-27
Dicing tape thermal management by wafer frame support ring cooling during plasma dicing Grant 9,112,050 - Lei , et al. August 18, 2	2015-08-18
Wafer dicing method for improving die packaging quality Grant 9,105,710 - Lei , et al. August 11, 2	2015-08-11
Improved Wafer Coating App 20150221505 - Park; Jungrae ; et al.	2015-08-06
Wafer Dicing Using Hybrid Laser Scribing And Plasma Etch Approach With Mask Plasma Treatment For Improved Mask Etch Resistance App 20150214109 - Lei; Wei-Sheng ; et al.	2015-07-30
Water Soluble Mask Formation By Dry Film Vacuum Lamination For Laser And Plasma Dicing App 20150214111 - Lei; Wei-Sheng ; et al.	2015-07-30
Singulation of wafers having wafer-level underfill Grant 9,093,518 - Lei , et al. July 28, 2	2015-07-28
Laser Scribing And Plasma Etch For High Die Break Strength And Clean Sidewall App 20150200119 - EATON; Brad ; et al.	2015-07-16
Residue removal from singulated die sidewall Grant 9,076,860 - Lei , et al. July 7, 2	2015-07-07
Screen Print Mask For Laser Scribe And Plasma Etch Wafer Dicing Process App 20150162243 - Kumar; Prabhat ; et al.	2015-06-11
Method And Carrier For Dicing A Wafer App 20150162244 - Holden; James M. ; et al.	2015-06-11
Multi-step and asymmetrically shaped laser beam scribing Grant 9,054,176 - Lei , et al. June 9, 2	2015-06-09
Uniform masking for wafer dicing using laser and plasma etch Grant 9,048,309 - Chowdhury , et al. June 2, 2	2015-06-02
Maskless hybrid laser scribing and plasma etching wafer dicing process Grant 9,041,198 - Lei , et al. May 26, 2	2015-05-26
Laser And Plasma Etch Wafer Dicing With A Double Sided Uv-curable Adhesive Film App 20150122419 - Chowdhury; Mohammad Kamruzzaman ; et al.	2015-05-07
Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening clean Grant 9,018,079 - Lei , et al. April 28, 2	2015-04-28
Maskless Hybrid Laser Scribing And Plasma Etching Wafer Dicing Process App 20150111363 - Lei; Wei-Sheng ; et al.	2015-04-23
Maskless Hybrid Laser Scribing And Plasma Etching Wafer Dicing Process App 20150111364 - Lei; Wei-Sheng ; et al.	2015-04-23
Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean Grant 9,012,305 - Lei , et al. April 21, 2	2015-04-21
Method And Apparatus For Dicing Wafers Having Thick Passivation Polymer Layer App 20150104929 - Lei; Wei-Sheng ; et al.	2015-04-16
Method Of Diced Wafer Transportation App 20150102467 - Lei; Wei-Sheng ; et al.	2015-04-16
Pre-patterned dry laminate mask for wafer dicing processes Grant 8,999,816 - Holden , et al. April 7, 2	2015-04-07
Laser scribing and plasma etch for high die break strength and clean sidewall Grant 8,993,414 - Eaton , et al. March 31, 2	2015-03-31
Wafer coating Grant 8,991,329 - Park , et al. March 31, 2	2015-03-31
Wafer Dicing from Wafer Backside and Front Side App 20150079761 - Lei; Wei-Sheng ; et al.	2015-03-19
Alternating Masking And Laser Scribing Approach For Wafer Dicing Using Laser Scribing And Plasma Etch App 20150079760 - Lei; Wei-Sheng ; et al.	2015-03-19
Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafers Grant 8,980,726 - Lei , et al. March 17, 2	2015-03-17
Substrate patterning using hybrid laser scribing and plasma etching processing schemes Grant 8,980,727 - Lei , et al. March 17, 2	2015-03-17
Wafer dicing from wafer backside Grant 8,975,162 - Lei , et al. March 10, 2	2015-03-10
Laser-dominated laser scribing and plasma etch hybrid wafer dicing Grant 8,975,163 - Lei , et al. March 10, 2	2015-03-10
Wafer Dicing Method For Improving Die Packaging Quality App 20150064878 - LEI; Wei-Sheng ; et al.	2015-03-05
Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film Grant 8,969,177 - Chowdhury , et al. March 3, 2	2015-03-03
Wafer dicing using hybrid split-beam laser scribing process with plasma etch Grant 8,951,819 - Lei , et al. February 10, 2	2015-02-10
Method And System For Laser Focus Plane Determination In A Laser Scribing Process App 20150037915 - LEI; Wei-Sheng ; et al.	2015-02-05
Laser and plasma etch wafer dicing using UV-curable adhesive film Grant 8,946,057 - Lei , et al. February 3, 2	2015-02-03
Wafer Dicing With Wide Kerf By Laser Scribing And Plasma Etching Hybrid Approach App 20150028446 - Lei; Wei-Sheng ; et al.	2015-01-29
Method of diced wafer transportation Grant 8,940,619 - Lei , et al. January 27, 2	2015-01-27
Water soluble mask formation by dry film lamination Grant 8,932,939 - Lei , et al. January 13, 2	2015-01-13
Laser Scribing And Plasma Etch For High Die Break Strength And Smooth Sidewall App 20150011073 - Lei; Wei-Sheng ; et al.	2015-01-08
Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing Grant 8,927,393 - Lei , et al. January 6, 2	2015-01-06
Method Of Coating Water Soluble Mask For Laser Scribing And Plasma Etch App 20140377937 - Lei; Wei-Sheng ; et al.	2014-12-25
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch App 20140367041 - Lei; Wei-Sheng ; et al.	2014-12-18
Dicing wafers having solder bumps on wafer backside Grant 8,912,078 - Lei , et al. December 16, 2	2014-12-16
Wafer edge warp supression for thin wafer supported by tape frame Grant 8,912,075 - Lei , et al. December 16, 2	2014-12-16
Hybrid laser and plasma etch wafer dicing using substrate carrier Grant 8,912,077 - Singh , et al. December 16, 2	2014-12-16
Laser, Plasma Etch, And Backside Grind Process For Wafer Dicing App 20140363952 - Lei; Wei-Sheng ; et al.	2014-12-11
Wafer Dicing With Wide Kerf By Laser Scribing And Plasma Etching Hybrid Approach App 20140346641 - Lei; Wei-Sheng ; et al.	2014-11-27
Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach Grant 8,883,614 - Lei , et al. November 11, 2	2014-11-11
Method of coating water soluble mask for laser scribing and plasma etch Grant 8,859,397 - Lei , et al. October 14, 2	2014-10-14
Wafer dicing using femtosecond-based laser and plasma etch Grant 8,853,056 - Lei , et al. October 7, 2	2014-10-07
Wafer dicing using hybrid multi-step laser scribing process with plasma etch Grant 8,846,498 - Lei , et al. September 30, 2	2014-09-30
Laser, plasma etch, and backside grind process for wafer dicing Grant 8,845,854 - Lei , et al. September 30, 2	2014-09-30
Substrate Laser Dicing Mask Including Laser Energy Absorbing Water-soluble Film App 20140273401 - LEI; Wei-Sheng ; et al.	2014-09-18
Substrate Dicing By Laser Ablation & Plasma Etch Damage Removal For Ultra-thin Wafers App 20140213042 - LEI; Wei-Sheng ; et al.	2014-07-31
Laser And Plasma Etch Wafer Dicing With Etch Chamber Shield Ring For Film Frame Wafer Applications App 20140213041 - LEI; Wei-Sheng ; et al.	2014-07-31
Water Soluble Mask For Substrate Dicing By Laser And Plasma Etch App 20140174659 - Lei; Wei-Sheng ; et al.	2014-06-26
Wafer Dicing From Wafer Backside App 20140179084 - Lei; Wei-Sheng ; et al.	2014-06-26
Hybrid Laser And Plasma Etch Wafer Dicing Using Substrate Carrier App 20140144585 - Singh; Saravjeet ; et al.	2014-05-29
Wafer Dicing Using Hybrid Multi-step Laser Scribing Process With Plasma Etch App 20140120698 - Lei; Wei-Sheng ; et al.	2014-05-01
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch App 20140120697 - Lei; Wei-Sheng ; et al.	2014-05-01
Water soluble mask for substrate dicing by laser and plasma etch Grant 8,703,581 - Lei , et al. April 22, 2	2014-04-22
Laser And Plasma Etch Wafer Dicing With Partial Pre-curing Of Uv Release Dicing Tape For Film Frame Wafer Application App 20140106542 - CHOWDHURY; Mohammad Kamruzzaman ; et al.	2014-04-17
In-situ Deposited Mask Layer For Device Singulation By Laser Scribing And Plasma Etch App 20140065797 - Yalamanchili; Madhava Rao ; et al.	2014-03-06
Mask Residue Removal For Substrate Dicing By Laser And Plasma Etch App 20140057414 - IYER; Aparna ; et al.	2014-02-27
Wafer dicing used hybrid multi-step laser scribing process with plasma etch Grant 8,652,940 - Lei , et al. February 18, 2	2014-02-18
Wafer dicing using femtosecond-based laser and plasma etch Grant 8,642,448 - Lei , et al. February 4, 2	2014-02-04
Laser, Plasma Etch, And Backside Grind Process For Wafer Dicing App 20140017880 - LEI; Wei-Sheng ; et al.	2014-01-16
Method Of Coating Water Soluble Mask For Laser Scribing And Plasma Etch App 20140017882 - Lei; Wei-Sheng ; et al.	2014-01-16
Uniform Masking For Wafer Dicing Using Laser And Plasma Etch App 20140017879 - Chowdhury; Mohammad Kamruzzaman ; et al.	2014-01-16
Method Of Diced Wafer Transportation App 20140015109 - Lei; Wei-Sheng ; et al.	2014-01-16
Laser Scribing And Plasma Etch For High Die Break Strength And Clean Sidewall App 20140017881 - EATON; Brad ; et al.	2014-01-16
Multi-step And Asymmetrically Shaped Laser Beam Scribing App 20140011338 - Lei; Wei-Sheng ; et al.	2014-01-09
Multi-layer Mask For Substrate Dicing By Laser And Plasma Etch App 20140011337 - Holden; James M. ; et al.	2014-01-09
Laser And Plasma Etch Wafer Dicing With A Double Sided Uv-curable Adhesive Film App 20140004685 - CHOWDHURY; Mohammad Kamruzzaman ; et al.	2014-01-02
In-situ deposited mask layer for device singulation by laser scribing and plasma etch Grant 8,598,016 - Yalamanchili , et al. December 3, 2	2013-12-03
Laser And Plasma Etch Wafer Dicing Using Water-soluble Die Attach Film App 20130299088 - Lei; Wei-Sheng ; et al.	2013-11-14
Methods For Fabricating Dual Damascene Interconnect Structures App 20130288474 - MISHRA; ROHIT ; et al.	2013-10-31
Laser And Plasma Etch Wafer Dicing Using Uv-curable Adhesive Film App 20130280890 - Lei; Wei-Sheng ; et al.	2013-10-24
Multi-step and asymmetrically shaped laser beam scribing Grant 8,557,683 - Lei , et al. October 15, 2	2013-10-15
Multi-layer mask for substrate dicing by laser and plasma etch Grant 8,557,682 - Holden , et al. October 15, 2	2013-10-15
Wafer Dicing Using Hybrid Multi-step Laser Scribing Process With Plasma Etch App 20130267076 - Lei; Wei-Sheng ; et al.	2013-10-10
Laser and plasma etch wafer dicing using water-soluble die attach film Grant 8,507,363 - Lei , et al. August 13, 2	2013-08-13
Wafer Dicing Using Hybrid Split-beam Laser Scribing Process With Plasma Etch App 20130017668 - Lei; Wei-Sheng ; et al.	2013-01-17
Laser And Plasma Etch Wafer Dicing Using Physically-removable Mask App 20120322237 - Lei; Wei-Sheng ; et al.	2012-12-20
Hybrid Laser And Plasma Etch Wafer Dicing Using Substrate Carrier App 20120322239 - Singh; Saravjeet ; et al.	2012-12-20
In-situ Deposited Mask Layer For Device Singulation By Laser Scribing And Plasma Etch App 20120322234 - YALAMANCHILI; Madhava Rao ; et al.	2012-12-20
Multi-step And Asymmetrically Shaped Laser Beam Scribing App 20120322242 - LEI; Wei-Sheng ; et al.	2012-12-20
Wafer Dicing Using Hybrid Galvanic Laser Scribing Process With Plasma Etch App 20120322235 - Lei; Wei-Sheng ; et al.	2012-12-20
Wafer Dicing Using Pulse Train Laser With Multiple-pulse Bursts And Plasma Etch App 20120322236 - Lei; Wei-Sheng ; et al.	2012-12-20
Multi-layer Mask For Substrate Dicing By Laser And Plasma Etch App 20120322241 - HOLDEN; James M. ; et al.	2012-12-20
Laser And Plasma Etch Wafer Dicing Using Water-soluble Die Attach Film App 20120322238 - Lei; Wei-Sheng ; et al.	2012-12-20
Water Soluble Mask For Substrate Dicing By Laser And Plasma Etch App 20120322233 - LEI; Wei-Sheng ; et al.	2012-12-20
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch App 20110312157 - Lei; Wei-Sheng ; et al.	2011-12-22
Etch System App 20090139657 - LEE; CHANGHUN ; et al.	2009-06-04