| Patent | Date |
|---|
High Capacity, Long Cycle Life Battery Anode Materials, Compositions And Methods
App 20200395602 - Easter; William G. ; et al. | 2020-12-17 |
Retaining ring for use on a carrier of a polishing apparatus
Grant 7,160,493 - Willis , et al. January 9, 2 | 2007-01-09 |
Method of eliminating agglomerate particles in a polishing slurry
Grant 6,750,145 - Crevasse , et al. June 15, 2 | 2004-06-15 |
System and method of determining a polishing endpoint by monitoring signal intensity
Grant 6,730,603 - Crevasse , et al. May 4, 2 | 2004-05-04 |
Polishing carrier head
Grant 6,726,537 - Crevasse , et al. April 27, 2 | 2004-04-27 |
Retaining ring for use on a carrier of a polishing apparatus
App 20040077167 - Willis, George D. ; et al. | 2004-04-22 |
Apparatus for detecting wetness of a semiconductor wafer cleaning brush
Grant 6,615,433 - Crevasse , et al. September 9, 2 | 2003-09-09 |
Method for chemical/mechanical planarization of a semiconductor wafer having dissimilar metal pattern densities
Grant 6,596,639 - Easter , et al. July 22, 2 | 2003-07-22 |
System and method of determining a polishing endpoint by monitoring signal intensity
App 20030082844 - Crevasse, Annette M. ; et al. | 2003-05-01 |
Method of cleaning a semiconductor wafer with a cleaning brush assembly having a contractible and expandable arbor
Grant 6,551,410 - Crevasse , et al. April 22, 2 | 2003-04-22 |
Curvilinear chemical mechanical planarization device and method
Grant 6,537,135 - Easter , et al. March 25, 2 | 2003-03-25 |
Semiconductor polishing pad alignment device for a polishing apparatus and method of use
Grant 6,514,123 - Crevasse , et al. February 4, 2 | 2003-02-04 |
Method Of Manufacturing A Polishing Pad Using A Beam
App 20020144985 - Crevasse, Annette M. ; et al. | 2002-10-10 |
Apparatus and method for detecting wetness of a semiconductor wafer cleaning brush
App 20020139393 - Crevasse, Annette M. ; et al. | 2002-10-03 |
Apparatus and method of determining an endpoint during a chemical-mechanical polishing process
App 20020090889 - Crevasse, Annette M. ; et al. | 2002-07-11 |
Contractible and expandable arbor for a semiconductor wafer cleaning brush assembly
App 20020074016 - Crevasse, Annette M. ; et al. | 2002-06-20 |
Method of eliminating agglomerate particles in a polishing slurry
App 20020052115 - Crevasse, Annette M. ; et al. | 2002-05-02 |
Electrochemical mechanical planarization apparatus and method
Grant 6,368,190 - Easter , et al. April 9, 2 | 2002-04-09 |
Polishing apparatus with carrier ring and carrier head employing like polarities
Grant 6,354,928 - Crevasse , et al. March 12, 2 | 2002-03-12 |
Magnetic force carrier and ring for a polishing apparatus
Grant 6,059,638 - Crevasse , et al. May 9, 2 | 2000-05-09 |
Method of making a getterer for multi-layer wafers
Grant 5,478,758 - Easter December 26, 1 | 1995-12-26 |
Method of manufacturing an integrated circuit including planarizing a wafer
Grant 5,366,924 - Easter , et al. November 22, 1 | 1994-11-22 |
Wafer bonding technique for dielectric isolation processing
Grant H1,137 - Easter , et al. February 2, 1 | 1993-02-02 |
High-speed dielectrically isolated devices utilizing buried silicide regions
Grant 4,987,471 - Easter , et al. January 22, 1 | 1991-01-22 |
Method of forming complementary device structures in partially processed dielectrically isolated wafers
Grant 4,870,029 - Easter , et al. September 26, 1 | 1989-09-26 |
Fabrication of high-speed dielectrically isolated devices utilizing buried silicide outdiffusion
Grant 4,839,309 - Easter , et al. June 13, 1 | 1989-06-13 |
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